Abstract: A radio-frequency module includes a module substrate having major surfaces that are opposite to each other; a module substrate having major surfaces that are opposite to each other, the major surface being disposed facing the major surface; a plurality of electronic components disposed between the major surfaces, on the major surface, and on the major surface; and a plurality of external connection terminals disposed on the major surface. The plurality of electronic components include a power amplifier. The power amplifier includes major surfaces that are opposite to each other and a circuit section that is formed at a position closer to the major surface than the major surface, and includes an amplification transistor. The power amplifier has the major surface disposed facing the major surface, and a heat dissipation conductor extending along a direction from the major surface to the major surface is joined to the major surface.

Abstract: A radio-frequency module includes one or more first electronic components disposed on one main surface and one or more second electronic components disposed on another main surface. The one or more first electronic components include at least one of a filter whose passband includes a first band, a switch connected to the filter, a power amplifier connected to the filter, and a switch connected to the filter. The one or more second electronic components include at least one of a filter whose passband includes a second band in which the frequency of a harmonic wave of a signal in the first band is included, a switch connected to the filter, a low-noise amplifier connected to the filter, and an inductor connected to a path that forms a connection between the first low-noise amplifier and an antenna connection terminal.

Abstract: A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, and a first radio-frequency component, wherein a pass band width of the hybrid filter is greater than a resonant band width of the first acoustic wave resonator, one of the first acoustic wave resonator, the first inductor, and the first capacitor is disposed on the main surface, and the first radio-frequency component is disposed on the main surface.

Abstract: A radio frequency module includes a module substrate having a first main surface facing a second main surface, and a module substrate having a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components, including a power amplifier, are disposed between the second and third main surfaces on the first main surface, and on the fourth main surface. Multiple external connection terminals are disposed on the third main surface. The power amplifier has a fifth main surface facing a sixth main surface and includes a circuit portion formed nearer to the fifth main surface than the sixth main surface and includes an amplifier transistor. in the power amplifier, the fifth main surface faces the third main surface, and the sixth main surface faces the second main surface. A heat dissipation conductor is joined to the main surface.

Abstract: A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, a switch for connecting and disconnecting an antenna connection terminal and the hybrid filter, and a coupler disposed on a path linking the antenna connection terminal and the switch. The first acoustic wave resonator is disposed on the main surface, the switch is included in a semiconductor IC disposed on the main surface, the coupler is disposed inside the module substrate, and in plan view of the module substrate, the semiconductor IC at least partially overlaps the first acoustic wave resonator, and the semiconductor IC and the coupler at least partially overlaps.

Abstract: A radio frequency module includes a first module substrate that has a first main surface facing a second main surface, a second module substrate that has a third main surface facing a fourth main surface. The third main surface faces the second main surface. Multiple electronic components are disposed between the second main surface and the third main surface, on the first main surface, and on the fourth main surface. A first inductor is disposed in the first module substrate. The multiple electronic components include a first filter, and a switch that connects and disconnects an antenna connection terminal and the first filter. The first inductor is connected between the switch and the first filter. The first module substrate is thicker than the second module substrate.

Abstract: A high-frequency module that includes: a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component including a PA controller which controls the power amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.

Abstract: A radio-frequency module includes a module substrate having major surfaces; a module substrate having major surfaces, the major surface being disposed facing the major surface; and plural electronic components disposed between the major surfaces, on the major surface, and on the major surface. The plural electronic components include: a first electronic component including the power amplifier; a second electronic component including a low-noise amplifier; a switch that switches connection and disconnection between a first filter and the power amplifier; and a third electronic component including a PA controller to control the power amplifier or a switch controller to control the switch. The first to third electronic components are separately disposed on the major surface, between the major surfaces, and on the major surface.

Abstract: A radio frequency module includes a first reception low-noise amplifier that amplifies a radio frequency reception signal of a first communication band, a second reception low-noise amplifier configured to amplify a radio frequency reception signal of a second communication band different from the first communication band, and a module board which includes a first principal surface and a second principal surface on opposite sides of the module board, and on which the first reception low-noise amplifier and the second reception low-noise amplifier are mounted. The first reception low-noise amplifier is disposed on the first principal surface, and the second reception low-noise amplifier is disposed on the second principal surface.

Abstract: A module includes a substrate and a first metal member. The substrate has an upper main surface and a lower main surface arranged in an up-down direction. The first metal member includes a first plate-shaped portion provided on the upper main surface of the substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The first metal member further includes a first left support portion. A boundary between the first plate-shaped portion and the first left support portion is defined as a first left boundary. The first left support portion bends with respect to the first plate-shaped portion at the first left boundary so as to be located behind the first plate-shaped portion.

Abstract: A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.

Abstract: The high frequency module includes a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The circuit component is mounted on the first main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers at least part of an outer peripheral surface of the circuit component. The shield layer covers at least part of the resin layer and a main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at at least one of a position between the circuit component and the resin layer, a position between the circuit component and the shield layer, a position inside the resin layer, and a position inside the shield layer.

Abstract: A hybrid filter includes a module substrate having a major surface and a major surface that are opposite to each other, acoustic wave resonator elements disposed at the module substrate, inductors disposed at the module substrate, and a capacitor disposed at the module substrate. The pass band of the hybrid filter is wider than the resonance band width of the acoustic wave resonator elements. One of the acoustic wave resonator elements, the inductors, and the capacitor is a first circuit element, and the first circuit element is disposed at the major surface. Another of the acoustic wave resonator elements, the inductors, and the capacitor is a second circuit element, and the second circuit element is disposed at the major surface.

Abstract: A radio frequency circuit includes a transmit filter for B66-Tx connected to a power amplifier, a transmit filter for B25-Tx connected to a power amplifier, a switch circuit having terminals, a switch circuit having a common terminal and terminals, and a switch circuit having a common terminal and terminals. The terminal is connected to the common terminal, the terminal is connected to the common terminal, the terminal is connected to the transmit filter, and the terminal is connected to the transmit filter. The switch circuit has a smaller stack number than the switch circuit, and the switch circuit has a smaller stack number than the switch circuit.

Abstract: A radio frequency module includes a module substrate, a first component disposed on a principal surface side of the module substrate, a metal shield wall disposed on an upper surface of the first component and set to ground potential, a resin member covering the principal surface of the module substrate, the upper surface and a side surface of the first component, and a side surface of the metal shield wall, and a metal shield layer set to the ground potential and covering an upper surface of the resin member. An upper end of the metal shield wall is in contact with the metal shield layer. The first component includes a first terminal and a second terminal both connected to the module substrate. When the principal surface is viewed in plan, the metal shield wall is disposed between the first terminal and the second terminal.

Abstract: A radio frequency module includes a module substrate having major surfaces that face each other, a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed, a second base part that is at least partially comprised of a second semiconductor material different from the first semiconductor material and in which a power amplifier is formed, and a switch connected to an output terminal of the power amplifier. The first base part is disposed on or over the major surface; the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode; and the switch is disposed on or over the major surface.

Abstract: A radio frequency module includes a transmit filter that allows a transmit signal of a band A for FDD to pass through, a receive filter that allows a receive signal of the band A to pass through, a filter that allows a transmit/receive signal of a band B for TDD to pass through, power amplifiers, a low noise amplifier, a switch between connecting the receive filter to the low noise amplifier and connecting the filter to the low noise amplifier, a switch between connecting the filter to the power amplifier and connecting the filter to the low noise amplifier, a matching circuit connected between the power amplifier and the transmit filter, a matching circuit connected between the power amplifier and the switch, and a module board. On the module board, each of the power amplifiers and the switch is arranged in between the matching circuit and the matching circuit.

Abstract: A radio-frequency module includes a module substrate having main surfaces facing each other, a transmission filter that has a bottom surface and a top surface facing each other and passes a radio-frequency signal, and an external connection terminal disposed on the main surface. The bottom surface faces the main surface and is disposed closer to the main surface than the top surface. The radio-frequency module further includes a metal electrode joined to the top surface.

Abstract: An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit, a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a high thermal conductive member that has at least a part formed of a high thermal conductive material having a thermal conductivity higher than the first semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the high thermal conductive member overlaps at least a part of the first base and at least a part of the second base in plan view. The high thermal conductive member is in contact with the first base and the second base.

Abstract: The radio frequency module includes a module substrate, an electronic component disposed on a main surface, a resin member covering at least part of the main surface and at least part of a side surface of the electronic component, and a metal shield layer that is formed on a surface of the resin member and is set to a ground potential. The electronic component has a top surface in contact with the metal shield layer, a bottom surface facing the main surface, a circuit portion formed at a position closer to the bottom surface than to the top surface, and a metal layer formed between the metal shield layer and the circuit portion. The metal layer is a barrier metal.