Patents by Inventor Takashi Harada
Takashi Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240153758Abstract: There is included forming an oxide film on a substrate by alternately performing: forming the first oxide film containing an atom X by performing a first cycle including non-simultaneously performing forming a first layer including a component in which a first functional group is bonded to the atom X, and forming a second layer containing the atom X and oxygen by oxidizing the first layer; and forming the second oxide film containing the atom X by performing a second cycle including non-simultaneously performing forming a third layer including a component in which the first functional group is bonded to the atom X, and forming a fourth layer containing the atom X and oxygen by oxidizing the third layer, under a processing condition that an oxidizing power is higher than an oxidizing power when oxidizing the first layer.Type: ApplicationFiled: January 12, 2024Publication date: May 9, 2024Applicant: Kokusai Electric CorporationInventors: Tomiyuki SHIMIZU, Masaya NAGATO, Takashi OZAKI, Yoshitomo HASHIMOTO, Katsuyoshi HARADA
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Patent number: 11978623Abstract: There is provided a technique that includes: forming an oxide film containing an atom X of a precursor on a substrate by performing a cycle a predetermined number of times. The cycle including non-simultaneously performing: (a) forming a first layer containing a component in which a first group is bonded to the atom X on the substrate by supplying the precursor having a molecular structure in which the first and second groups are bonded to the atom X, to the substrate, the first group containing an alkoxy group, and the second group containing at least one of an amino group, an alkyl group, a halogeno group, a hydroxy group, a hydro group, an aryl group, a vinyl group, and a nitro group; and (b) forming a second layer containing the atom X by supplying an oxidizing agent to the substrate to oxidize the first layer.Type: GrantFiled: November 8, 2022Date of Patent: May 7, 2024Assignee: KOKUSAI ELECTRIC CORPORATIONInventors: Yoshitomo Hashimoto, Katsuyoshi Harada, Kimihiko Nakatani, Yoshiro Hirose, Masaya Nagato, Takashi Ozaki, Tomiyuki Shimizu
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Patent number: 11975392Abstract: A cutting tool includes: a base metal provided with a seat portion; a blade edge member that is a polycrystalline diamond sintered material containing polycrystalline diamond and a binder; and a brazing material that fixes the blade edge member to the seat portion of the base metal. The blade edge member has a thickness of greater than or equal to 0.3 mm. The brazing material is disposed between a blade edge bottom face of the blade edge member and a seat bottom face of the seat portion and is in contact with the blade edge bottom face and the seat bottom face. The flank face is located outside of the base metal with respect to the lateral face of the base metal.Type: GrantFiled: December 22, 2020Date of Patent: May 7, 2024Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.Inventors: Hideki Tomimoto, Hirotsugu Iwasaki, Satoru Kukino, Takashi Harada, Naoki Watanobe, Mayuka Segawa
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Patent number: 11961733Abstract: There is included forming an oxide film on a substrate by alternately performing: forming the first oxide film containing an atom X by performing a first cycle including non-simultaneously performing forming a first layer including a component in which a first functional group is bonded to the atom X, and forming a second layer containing the atom X and oxygen by oxidizing the first layer; and forming the second oxide film containing the atom X by performing a second cycle including non-simultaneously performing forming a third layer including a component in which the first functional group is bonded to the atom X, and forming a fourth layer containing the atom X and oxygen by oxidizing the third layer, under a processing condition that an oxidizing power is higher than an oxidizing power when oxidizing the first layer.Type: GrantFiled: September 7, 2021Date of Patent: April 16, 2024Assignee: Kokusai Electric CorporationInventors: Tomiyuki Shimizu, Masaya Nagato, Takashi Ozaki, Yoshitomo Hashimoto, Katsuyoshi Harada
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Patent number: 11943950Abstract: A plurality of light-emitting devices (10) include a plurality of light-emitting devices (10a), a plurality of light-emitting devices (10b), and a plurality of light-emitting devices (10c). The plurality of light-emitting devices (10) are aligned on a reflecting member (20). Six light-emitting devices (10c) are aligned in a straight line along one direction. Four light-emitting devices (10b) are aligned surrounding a region facing one ends of the six light-emitting devices (10c). Each of four light-emitting devices (10a) are aligned with each of the four light-emitting devices (10b) outside the four light-emitting devices (10b).Type: GrantFiled: July 11, 2022Date of Patent: March 26, 2024Assignee: Pioneer CorporationInventors: Takeru Okada, Chihiro Harada, Ayako Yoshida, Takashi Chuman
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Publication number: 20240091863Abstract: A diamond coated tool includes a base material and a diamond layer provided on the base material. The diamond layer has a boron content of 1×103 ppma or more and 1×106 ppma or less and an oxygen content of 1×102 ppma or more and 1×105 ppma or less in a first region surrounded by a surface of the diamond layer and a first imaginary plane located at a distance of 1 ?m from the surface in a thickness direction.Type: ApplicationFiled: October 9, 2020Publication date: March 21, 2024Inventors: Rintaro SUGIMOTO, Takashi HARADA, Satoru KUKINO
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Patent number: 11935738Abstract: Edge trimming is performed on a wafer while a cleaning liquid is supplied to the center of a face side of the wafer and the wafer is rotated to form a film of the cleaning liquid that covers the face side of the wafer. The film of the cleaning liquid prevents the face side of the wafer from being dried, lowering the probability that swarf will be introduced into devices on the face side of the wafer. In addition, the consumption of the cleaning liquid can be reduced compared with a step of performing edge trimming on the wafer while supplying a curtain of cleaning liquid to the entire face side of the wafer.Type: GrantFiled: November 2, 2022Date of Patent: March 19, 2024Assignee: DISCO CORPORATIONInventors: Takashi Okamura, Shigenori Harada
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Patent number: 11925316Abstract: Provided is an endoscope that can easily perform the attachment and detachment work of a proximal end side of a wire with respect to a slider. An endoscope includes a base member (98) that forms a slider housing space (150) that is independent of an internal space of an operating part (22), an opening part (94) that is provided at a proximal end of a wire channel (62) and delivers the proximal end side of the wire (60) to a slider housing space (150), a slider (96) that is disposed in the slider housing space (150) and moves in a longitudinal direction of the operating part (22) depending on the operation of an erection operating lever (20) so as to be movable forward and backward, an engaged part (152) that is provided in the slider (96) and recessed toward a lateral side orthogonal to a movement direction of the slider (96), and an engaging member (154) that is provided at the proximal end of the wire (60) and is pushed into and engageable with the engaged part (152) from the lateral side.Type: GrantFiled: March 23, 2020Date of Patent: March 12, 2024Assignee: FUJIFILM CorporationInventor: Takashi Harada
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Patent number: 11920222Abstract: A composite sintered material includes: a plurality of diamond grains having an average grain size of less than or equal to 10 ?m; a plurality of cubic boron nitride grains having an average grain size of less than or equal to 2 ?m; and a plurality of aluminum oxide grains having an average grain size of less than or equal to 0.5 ?m; and a remainder of a binder phase, wherein at least parts of adjacent diamond grains are bound to one another, the binder phase includes cobalt, in the composite sintered material, a content of the diamond grains is from 30 to 92 volume %, a content of the cubic boron nitride grains is from 3 to 40 volume %, a content of the aluminum oxide grains is from 2 to 15 volume %, and a content of the cobalt is from 3 to 30 volume %.Type: GrantFiled: April 3, 2019Date of Patent: March 5, 2024Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Hardmetal Corp.Inventors: Naoki Watanobe, Takashi Harada, Katsumi Okamura, Satoru Kukino, Taisuke Higashi
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Patent number: 11918181Abstract: An endoscope is provided in which an attachment/detachment operation of the proximal end of a wire is easily performed to/from an erecting operation mechanism.Type: GrantFiled: January 16, 2020Date of Patent: March 5, 2024Assignee: FUJIFILM CorporationInventor: Takashi Harada
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Patent number: 11910996Abstract: An endoscope is provided in which an attachment/detachment operation of the proximal end of a wire is easily performed to/from an erecting operation mechanism and leakage of current to the outside can be prevented. An endoscope has an operation section 22 provided with an erecting lever, and a movable member 96 that moves in association with an operation of the erecting lever. The movable member 96 is arranged to be exposed to the outside of the operation section 22. A wire 60 is, at a distal end side thereof, coupled to an erecting base, and, at a proximal end side thereof, coupled to an attachment member 98 that is attachable to or detachable from the movable member 96 by a one-touch operation. The wire 60 includes a wire body 60A, and an insulating coat 60B coating a wire exposure region L.Type: GrantFiled: January 16, 2020Date of Patent: February 27, 2024Assignee: FUJIFILM CorporationInventors: Takashi Harada, Toshizumi Tanaka
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Patent number: 11889980Abstract: An endoscope in which an erecting operation of a treatment tool erecting base can be smoothly performed during an operation of the endoscope is provided. An endoscope according to the present invention has an operation section 22 provided with an erecting operation lever 20 and angle knobs 64; an insertion section 24 that is provided on a distal end side of the operation section 22 and that has a bending part 52 that is moved to be bent by an operation of the angle knobs 64; an erecting base 30 provided at a distal end part 26 of the insertion section 24; and a movable member 96 that is arranged to be exposed to outside of the operation section 22 and that moves in association with an operation of the erecting operation lever 20.Type: GrantFiled: January 16, 2020Date of Patent: February 6, 2024Assignee: FUJIFILM CorporationInventor: Takashi Harada
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Patent number: 11882998Abstract: An endoscope is provided in which an attachment/detachment operation of the proximal end of a wire can be easily performed to/from an erecting operation mechanism and the wire can be prevented from meandering in a wire channel. An endoscope has an operation section 22 provided with an erecting operation lever, and a movable member 96 that moves in association with an operation of the erecting operation lever. The movable member 96 is arranged to be exposed to outside of the operation section 22. A wire 60 has a distal end side coupled to an erecting base, and a proximal end side coupled to an attachment member 98 that is attachable to and detachable from the movable member 96 by a one-touch operation. The wire 60 is configured of a wire body 60A and a gap filling member 60B.Type: GrantFiled: January 16, 2020Date of Patent: January 30, 2024Assignee: FUJIFILM CorporationInventors: Takashi Harada, Tomohiro Ohki, Shozo Iyama
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Publication number: 20240001453Abstract: A cutting tool includes a rake face, a flank face, and a cutting edge ridge line connecting the rake face and the flank face. A portion of the rake face and a portion of the flank face adjacent to the cutting edge ridge line are made of a diamond sintered body including diamond grains. A dislocation density in the portion of the flank face is 8×1015/m2 or less. The diamond grains have an average grain size of 0.1 ?m to 50 ?m. A content ratio of the diamond grains in the diamond sintered body is 80% by volume to 99% by volume.Type: ApplicationFiled: November 29, 2021Publication date: January 4, 2024Applicant: SUMITOMO ELECTRIC HARDMETAL CORP.Inventors: Hirotsugu IWASAKI, Akihiko UEDA, Naoki WATANOBE, Takashi HARADA, Satoru KUKINO
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Patent number: 11839355Abstract: There is an endoscope that allows operations for attaching and detaching the proximal end of a wire to and from an elevating operation mechanism to be easily performed, can reduce the influence of variations of the length of a soft part and the length of an operation wire, and can adjust an operating range of an elevating operation lever for an elevator.Type: GrantFiled: July 20, 2020Date of Patent: December 12, 2023Assignee: FUJIFILM CorporationInventor: Takashi Harada
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Publication number: 20230393382Abstract: An endoscope includes first and second angle knobs that are connected to first and second wire pulling members which change a direction of a distal end of an insertion part, in which a rotational movement restricting member is attached instead of the first and second angle knobs before use. The rotational movement restricting member includes a first rotational movement restricting portion that is engaged with the first wire pulling member to restrict a rotational movement of the first wire pulling member and a second rotational movement restricting portion that is engaged with the second wire pulling member to restrict a rotational movement of the second wire pulling member.Type: ApplicationFiled: August 15, 2023Publication date: December 7, 2023Applicant: FUJIFILM CorporationInventors: Masaya INOUE, Takashi HARADA
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Publication number: 20230389780Abstract: An elevating base provided to be movable between an elevated position and a fallen position is provided at a distal end of an insertion part of the endoscope. As an elevating operation lever rotates in a first direction, the elevating operation lever causes the elevating base to move to the elevated position, and as the elevating operation lever rotates in a second direction, the elevating operation lever causes the elevating base to move to the fallen position. The elevating operation lever is coupled to a bearing member via a rotation ring. The rotation ring has a protrusion, and the bearing member has a plurality of holes and a rail to configure a locking mechanism.Type: ApplicationFiled: August 15, 2023Publication date: December 7, 2023Applicant: FUJIFILM CorporationInventors: Masaya INOUE, Takashi HARADA
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Patent number: D1009106Type: GrantFiled: July 7, 2022Date of Patent: December 26, 2023Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.Inventors: Satoru Kukino, Gaku Harada, Takashi Harada, Naoki Watanobe, Soichiro Kakinoki, Keita Miyamoto, Hironari Moroguchi
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Patent number: D1024146Type: GrantFiled: November 10, 2020Date of Patent: April 23, 2024Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.Inventors: Satoru Kukino, Naoki Watanobe, Taisuke Higashi, Takashi Harada
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Patent number: D1024152Type: GrantFiled: August 16, 2022Date of Patent: April 23, 2024Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.Inventors: Takashi Harada, Naoki Watanobe, Satoru Kukino, Taisuke Higashi, Rintaro Sugimoto