Abstract: An exhaust gas recirculation system for a multi-cylinder engine is provided, which includes an exhaust manifold connected to a cylinder head, a catalyst connected to a downstream end of the exhaust manifold in terms of an exhaust gas flow, an EGR gas outlet provided downstream of the catalyst, an in-head EGR passage penetrating the cylinder head, and an EGR pipe extending from the EGR gas outlet and directly connected to an inlet of the in-head EGR passage to lead EGR gas thereto. The catalyst is disposed so that the exhaust gas flows therein from a first side to a second side in an engine cylinder lined-up direction. The EGR gas outlet is located on the second side with respect to the center of the engine in the cylinder lined-up direction, and the inlet of the in-head EGR passage is located in the first side with respect to the engine center.

Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.

Abstract: In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.

Abstract: An exhaust gas recirculation system for a multi-cylinder engine is provided, which includes an exhaust manifold connected to a cylinder head, a catalyst connected to a downstream end of the exhaust manifold in terms of an exhaust gas flow, an EGR gas outlet provided downstream of the catalyst, an in-head EGR passage penetrating the cylinder head, and an EGR pipe extending from the EGR gas outlet and directly connected to an inlet of the in-head EGR passage to lead EGR gas thereto. The catalyst is disposed so that the exhaust gas flows therein from a first side to a second side in an engine cylinder lined-up direction. The EGR gas outlet is located on the second side with respect to the center of the engine in the cylinder lined-up direction, and the inlet of the in-head EGR passage is located in the first side with respect to the engine center.

Abstract: An engine EGR system is provided, which includes an engine body, an intake passage, an exhaust passage and an EGR passage configured to recirculate exhaust gas as EGR gas to the intake passage. The EGR passage includes an EGR cooler and an EGR internal passage constituting the EGR passage upstream of the EGR cooler, and including a passage passing through a cylinder head. The EGR internal passage has a bent pipe part including a first bent portion at which an upstream portion of the EGR internal passage is bent away from a gas inflow port of the EGR cooler, a second bent portion located downstream of the first bent portion and bending the EGR internal passage toward the gas inflow port, and an intermediate portion connecting the first and the second bent portions by being disposed therebetween. The water-cooling passage is disposed around the bent pipe part.

Abstract: An engine EGR system is provided, which includes an engine body, an intake passage, an exhaust passage and an EGR passage configured to recirculate exhaust gas as EGR gas to the intake passage. The EGR passage includes an EGR cooler and an EGR internal passage constituting the EGR passage upstream of the EGR cooler, and including a passage passing through a cylinder head. The EGR internal passage has a bent pipe part including a first bent portion at which an upstream portion of the EGR internal passage is bent away from a gas inflow port of the EGR cooler, a second bent portion located downstream of the first bent portion and bending the EGR internal passage toward the gas inflow port, and an intermediate portion connecting the first and the second bent portions by being disposed therebetween. The water-cooling passage is disposed around the bent pipe part.

Abstract: An engine EGR system is provided. An EGR passage includes an EGR cooler, an EGR internal passage passing through a cylinder head on an upstream side of the EGR cooler, and a relay passage extending outside the cylinder head and connecting the EGR internal passage to the EGR cooler. The EGR cooler formed in a columnar shape is arranged above an intake manifold so as to locate a gas inflow port on a first end surface side and a gas outflow port on a second end surface side, and the relay passage communicates with the EGR internal passage on an external side of the engine compared to a head EGR gas exit. The EGR cooler inclines downward from the gas outflow port toward the gas inflow port, and the relay passage is connected to the gas inflow port while being bent downward toward the upstream side.

Abstract: In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.

Abstract: A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.

Abstract: In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.

Abstract: In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.

Abstract: A printed wiring board for package-on-package includes a first insulating layer, a wiring layer including a conductor pattern and formed on first surface of the first insulating layer, a second insulating layer formed on first surface side of the first insulating layer, electrodes formed in through holes of the first insulating layer respectively such that the electrodes electrically connect to the conductor pattern and have exposed surfaces exposed from second surface of the first insulating layer, first pads formed on the second insulating layer and positioned to connect an IC chip in center portion of the second insulating layer, second pads formed on the second insulating layer and positioned in outer edge portion of the second insulating layer to connect a second printed wiring board, and via conductors formed in the second insulating layer such that the via conductors electrically connect the first and second pads to the conductor pattern.

Abstract: A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction.

Abstract: A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.

Abstract: A method for manufacturing a printed wiring board includes forming a resin layer on an interlayer layer such that the resin layer has first openings exposing circuits in central portion and second openings exposing circuits in peripheral portion of the interlayer layer, forming solder bumps on the circuits in the first openings, forming a plating resist over the bumps and resin layer such that the resist has openings having diameters greater than the second openings and exposing the second openings, forming a seed layer on the resist, in the openings and on the circuits through the second openings, applying electrolytic plating on the resist such that electrolytic plating fills the openings and forms a plated film on the resist and metal posts in the openings, etching the plating such that the plated film is removed and recesses are formed on end surfaces of the posts, and removing the resist.

Abstract: A method for manufacturing a printed wiring board includes forming a removable layer over first pads in central portion of an interlayer insulation layer to mount IC chip, forming on the interlayer and removable layers a resin insulation layer having openings exposing second pads in peripheral portion of the interlayer layer to connect second substrate, forming a seed layer on the resin layer, in the openings and on the second pads, forming on the seed layer a plating resist having resist openings exposing the openings of the resin layer with diameters greater than the openings, filling the resist openings with electrolytic plating such that metal posts are formed in the resist openings, removing the resist, removing the seed layer exposed on the resin layer, and removing the removable layer and the resin layer on the removable layer such that cavity exposing the first pads is formed in the resin layer.

Abstract: A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.

Abstract: A wiring board includes a first resin insulating layer, conductor pads on the first insulating layer including first and second conductor pads, a second resin insulating layer on the first insulating layer covering the first and second pads, an outermost conductor layer on the second insulating layer including first and second outermost wiring layers, via conductors through the second insulating layer including a first via conductor connecting the first wiring layer and first pad and a second via conductor connecting the second wiring layer and second pad, and a solder resist layer on the second insulating layer such that the solder resist layer is covering the first wiring layer and has one or more openings exposing the second wiring layer. The first wiring layer includes first main metal, and the second wiring layer includes second main metal which is different from the first metal of the first wiring layer.

Abstract: A printed wiring board includes a core substrate, first and second buildup structures on surfaces of the core, respectively, and first and second solder-resist layers on the first and second structures, respectively. The core includes insulative substrate, conductive layers on surfaces of the substrate and through-hole conductor connecting the conductive layers, the first structure includes interlayer insulation layer and conductive layer in the first structure, the second structure includes interlayer insulation layer and conductive layer in the second structure, a thickness between the outer surfaces of the first and second solder-resist layers is set in range of from 150 ?m or greater and less than 380 ?m, and at least one of the core, first and second structures, and first and second solder-resist layers includes reinforcing material in amount such that the board includes the material in amount in range of from 20 to 35 vol. %.

Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.