Patents by Inventor Takashi Kikuchi
Takashi Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9147952Abstract: An electrical connector assembled component includes a first attachment connector for attaching to a first circuit board member; a second attachment connector for attaching to a second circuit member; and an intermediate connector that is provided between the first attachment connector and the second attachment connector. The intermediate connector has conducting terminals in the housing. The first attachment connector and the second attachment connector have first receiving terminals and second receiving terminals. Each conducting terminal has a first contact section; a second contact section; and a joining section. An elastic cylindrical member is made of metal and can elastically deform in the radial direction so as to allow movement of the first contact section and the second contact section. The elastic cylindrical member contacts with the first contact section and the first receiving terminal or the second contact section and the second receiving terminal.Type: GrantFiled: December 10, 2013Date of Patent: September 29, 2015Assignee: HIROSE ELECTRIC CO., LTD.Inventors: Takashi Kikuchi, Atsushi Matsuzawa
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Publication number: 20150259299Abstract: Provided are a method for producing a sulfonyl amidine compound, which has an excellent gonadotropin releasing hormone receptor antagonism and is useful as a therapeutic agent for gonadotropin-dependent diseases (for example, prostate cancer, breast cancer, endometriosis, uterine fibroid, prostatic hyperplasia, or the like) or a salt thereof, and a synthesis intermediate useful in the production method. The production method of the present invention controls formation of a by-product which is hardly removed unless column purification is conducted and racemization of a target compound, thereby obtaining the target compound with a high purity, and therefore, the production method is suitable for industrial production.Type: ApplicationFiled: September 6, 2013Publication date: September 17, 2015Applicant: Astellas Pharma Inc.Inventors: Takashi Kikuchi, Shinya Yoshida, Atsushi Nakamura, Takahiro Akiba, Toshitaka Yoshino, Shuichi Nakagawa, Kiichi Sato
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Patent number: 9129828Abstract: A semiconductor device in which a plurality of semiconductor chips having different planar sizes are stacked with a degree of freedom in design of each of the semiconductor chips is provided. A logic chip, a redistribution chip, and a memory chip having a larger planar size than the logic chip are mounted over a wiring board. The logic chip and the memory chip are electrically connected via the redistribution chip. The redistribution chip includes a plurality of front surface electrodes formed to a front surface facing the wiring board, and a plurality of back surface electrodes formed to a back surface opposite to the surface. The redistribution chip has a plurality of through silicon vias, and a plurality of lead wirings formed to the front surface or the back surface and electrically connecting the plurality of through silicon vias and the front surface electrodes or the back surface electrodes.Type: GrantFiled: September 14, 2013Date of Patent: September 8, 2015Assignee: Renesas Electronics CorporationInventors: Takashi Kikuchi, Takafumi Kikuchi
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Publication number: 20150090518Abstract: A vehicle body structure (10) is provided with: an exhaust pipe (18) disposed between a fuel container (16) and a right framework member (12) so as to extend in the front-rear direction of the vehicle body; and a slide member (23) provided to the framework side wall (25) of the right framework member (12). The slide member (12) is provided to the portion (27) of the framework side wall (25), which is overlapped by the fuel container (16) and a chamber (42) in the width direction of the vehicle. The slide member (23) has a slide slope section (64). The slide slope section (64) is tilted inward in the width direction of the vehicle from the lower end (64b) toward the upper end (64a) so as to approach the fuel tank (16).Type: ApplicationFiled: March 22, 2013Publication date: April 2, 2015Inventors: Masayasu Yoshida, Daisuke Nohara, Youichirou Hamano, Keita Ishihara, Takashi Kikuchi
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Patent number: 8779140Abstract: [Problem] A salt or crystal of a compound which is highly stable in a solid state and useful as a bulk material for the preparation of a pharmaceutical product is provided. [Means for Solution] 4-{[(1R,2s,3S,5s,7s)-5-Hydroxy-2-adamantyl]amino}-1H-pyrrolo[2,3-b]pyridine-5-carboxamide succinate, 4-{[(1R,2s,3S,5s,7s)-5-hydroxy-2-adamantyl]amino}-1H-pyrrolo[2,3-b]pyridine-5-carboxamide hydrobromide, and 4-{[(1R,2s,3S,5s,7s)-5-hydroxy-2-adamantyl]amino}-1H-pyrrolo[2,3-b]pyridine-5-carboxamide hydrochloride and crystals thereof are useful as a bulk material for the preparation of a solid preparation, in particular, a solid dispersion preparation. Furthermore, the crystal of the hydrobromide has excellent stability in a solid state and is useful as a bulk material for the preparation of a pharmaceutical product.Type: GrantFiled: June 22, 2011Date of Patent: July 15, 2014Assignee: Astellas Pharma Inc.Inventors: Takashi Kikuchi, Katsuhiko Gato, Koichiro Mukoyoshi, Tsuyoshi Kitamura, Takeshi Kawakami, Hironobu Yasuda
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Publication number: 20140186699Abstract: A multilayer conductive film includes a layer 1 including a conductive material containing a polymer material 1 having an alicyclic structure and conductive particles 1 and a layer 2 including a material having durability against positive electrode potential. The multilayer conductive film has stability in an equilibrium potential environment in a negative electrode and stability in an equilibrium potential environment in a positive electrode, has low electric resistance per unit area in the thickness direction, and has excellent barrier properties for a solvent of an electrolytic solution. A battery including a current collector employing the multilayer conductive film can achieve both weight reduction and durability.Type: ApplicationFiled: May 22, 2012Publication date: July 3, 2014Applicant: Nissan Motor Co., Ltd.Inventors: Yusuke Kato, Masahiro Kojima, Ryutaro Mukai, Masato Kusakabe, Hiroyuki Ogino, Takashi Kikuchi, Takashi Ito, Satoshi Oku, Akiko Waki, Shiho Inoue, Yuji Muroya, Norihisa Waki, Yasuyuki Tanaka, Shigeo Ibuka, Yoshio Shimoida
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Publication number: 20140170886Abstract: An electrical connector assembled component includes a first attachment connector for attaching to a first circuit board member; a second attachment connector for attaching to a second circuit member; and an intermediate connector that is provided between the first attachment connector and the second attachment connector. The intermediate connector has conducting terminals in the housing. The first attachment connector and the second attachment connector have first receiving terminals and second receiving terminals. Each conducting terminal has a first contact section; a second contact section; and a joining section. An elastic cylindrical member is made of metal and can elastically deform in the radial direction so as to allow movement of the first contact section and the second contact section. The elastic cylindrical member contacts with the first contact section and the first receiving terminal or the second contact section and the second receiving terminal.Type: ApplicationFiled: December 10, 2013Publication date: June 19, 2014Applicant: HIROSE ELECTRIC CO., LTD.Inventors: Takashi KIKUCHI, Atsushi MATSUZAWA
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Patent number: 8740287Abstract: Disclosed is a passenger protection device (12) for a vehicle, which protects a passenger (Mn) sitting on a seat (11) when an external force (Fs) is applied to a side surface (16a) of a vehicle body (16). The passenger protection device has a side support (14). The side support is provided on the side portion of a seat back (46), and supports the upper body (Bu) of the passenger. The side support has a deformable portion (47). The deformable portion allows the side support to be deformed by an external force having a predetermined value or more.Type: GrantFiled: April 20, 2010Date of Patent: June 3, 2014Assignee: Honda Motor Co., Ltd.Inventors: Kazuhiro Onda, Nobuhiro Kawamoto, Itaru Genpei, Makoto Uchikawa, Takashi Kikuchi, Hajime Ishida
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Publication number: 20140099537Abstract: A conductive film includes a layer 1 formed by a conductive material 1 that includes a polymer material 1 containing any of (1) an amine and an epoxy resin (where the epoxy resin and the amine are mixed in a ratio of 1.0 or more in terms of the ratio of the number of active hydrogen atoms in the amine with respect to the number of functional groups in the epoxy resin), (2) a phenoxy resin and an epoxy resin, (3) a saturated hydrocarbon polymer having a hydroxyl group, and (4) a curable resin and an elastomer and conductive particles 1. The conductive film has excellent stability in an equilibrium potential environment in a negative electrode and low electric resistance per unit area in the thickness direction. A multilayer conductive film including the conductive film achieves excellent interlayer adhesion, and using them as a current collector enables the production of a battery satisfying both weight reduction and durability.Type: ApplicationFiled: May 22, 2012Publication date: April 10, 2014Applicants: Nissan Motor Co., Ltd., Kaneka CorporationInventors: Yusuke Kato, Takashi Ito, Masami Yanagida, Satoshi Oku, Hiroyuki Ogino, Masato Kusakabe, Ryutaro Mukai, Masahiro Kojima, Takashi Kikuchi, Akiko Waki, Shiho Inoue, Shigeo Ibuka, Yasuyuki Tanaka, Yoshio Shimoida, Yuji Muroya, Norihisa Waki
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Publication number: 20140077391Abstract: A semiconductor device in which a plurality of semiconductor chips having different planar sizes are stacked with a degree of freedom in design of each of the semiconductor chips is provided. A logic chip, a redistribution chip, and a memory chip having a larger planar size than the logic chip are mounted over a wiring board. The logic chip and the memory chip are electrically connected via the redistribution chip. The redistribution chip includes a plurality of front surface electrodes formed to a front surface facing the wiring board, and a plurality of back surface electrodes formed to a back surface opposite to the surface. The redistribution chip has a plurality of through silicon vias, and a plurality of lead wirings formed to the front surface or the back surface and electrically connecting the plurality of through silicon vias and the front surface electrodes or the back surface electrodes.Type: ApplicationFiled: September 14, 2013Publication date: March 20, 2014Applicant: Renesas Electronics CorporationInventors: Takashi Kikuchi, Takafumi Kikuchi
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Patent number: 8658885Abstract: Provided is a substrate for a thin-film photoelectric conversion device which makes it possible to produce the device having improved characteristics at low cost and high productivity. The substrate includes a transparent base member, with a transparent underlying layer and a transparent electrode layer successively stacked on one main surface of the transparent base member. The underlying layer includes transparent insulating fine particles and transparent binder, and the particles are dispersed to cover the one main surface with a coverage factor of particles ranging from 30% or more to less than 80%. An antireflection layer is provided on the other main surface of the transparent base. The antireflection layer includes transparent insulating fine particles and transparent binder, and the particles are dispersed to cover the other main surface with a coverage factor greater than the underlying layer. The transparent electrode layer contains zinc oxide deposited by low-pressure CVD method.Type: GrantFiled: May 15, 2009Date of Patent: February 25, 2014Assignee: Kaneka CorporationInventors: Takashi Kikuchi, Toshiaki Sasaki
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Patent number: 8569919Abstract: A generator motor includes a flange, stationary-side members, rotor-side members, and latching members. The flange is removably mounted on a first end side in an axial direction. The stationary-side members are fixed on a second end side that is on an opposite side from the first end side in the axial direction. The rotor-side members are configured to move toward the first end side in the axial direction with respect to the stationary-side members in a state in which the flange has been removed. The latching members are configured to restrict relative movement of the flange in the axial direction with respect to the rotor-side members.Type: GrantFiled: March 26, 2012Date of Patent: October 29, 2013Assignee: Komatsu Ltd.Inventors: Yukihiko Sugimoto, Teiichirou Chiba, Takashi Kikuchi
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Patent number: 8541261Abstract: Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.Type: GrantFiled: November 1, 2012Date of Patent: September 24, 2013Assignee: Renesas Electronics CorporationInventors: Takashi Kikuchi, Tomoaki Hashimoto, Tatsuya Hirai
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Patent number: 8518744Abstract: The reliability of the semiconductor device which has the structure which stores a plurality of semiconductor chips with which plane sizes differ in the same sealing body in the state where they are accumulated via the insulating film which has adhesive property is improved. In the semiconductor device which has the structure which stores a plurality of semiconductor chips with which plane sizes differ in the same sealing body in the state where they are accumulated via DAF, thickness of DAF of the back surface of the uppermost semiconductor chip with which the control circuit was formed was made thicker than each of DAF of the back surface of the lower layer semiconductor chip with which the memory circuit was formed. Hereby, the defect that the bonding wire which connects the uppermost semiconductor chip and a wiring substrate contacts the main surface corner part of a lower layer semiconductor chip can be reduced.Type: GrantFiled: March 9, 2011Date of Patent: August 27, 2013Assignee: Renesas Electronics CorporationInventors: Takashi Kikuchi, Koichi Kanemoto, Chuichi Miyazaki, Toshihiro Shiotsuki
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Patent number: 8513373Abstract: A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid dianhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can giveType: GrantFiled: September 20, 2005Date of Patent: August 20, 2013Assignee: Kaneka CorporationInventors: Hisayasu Kaneshiro, Takashi Kikuchi
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Publication number: 20130119803Abstract: A generator motor includes a flange, stationary-side members, rotor-side members, and latching members. The flange is removably mounted on a first end side in an axial direction. The stationary-side members are fixed on a second end side that is on an opposite side from the first end side in the axial direction. The rotor-side members are configured to move toward the first end side in the axial direction with respect to the stationary-side members in a state in which the flange has been removed. The latching members are configured to restrict relative movement of the flange in the axial direction with respect to the rotor-side members.Type: ApplicationFiled: March 26, 2012Publication date: May 16, 2013Inventors: Yukihiko Sugimoto, Teiichirou Chiba, Takashi Kikuchi
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Patent number: 8435641Abstract: A method for manufacturing a heat resistant flexible laminate effectively enabling avoidance of not only visual defects but occurrence of dimensional changes, and a heat resistant flexible laminate are provided. In a process for laminating a heat resistant adhesive material and a metallic foil by thermal lamination, a film-like protective material is disposed between a pressurized surface and the metallic foil at the time of thermal lamination. At this time, coefficients of linear expansion in a temperature range of 200 degree C. to 300 degree C. of the heat resistant adhesive material and the protective material are within a range of a coefficient of linear expansion of the metallic foil ±10 ppm/degrees C. Thereby, occurrence of visual defects is not only effectively avoidable, but excellent dimensional change after etching may be exhibited.Type: GrantFiled: October 9, 2003Date of Patent: May 7, 2013Assignee: Kaneka CorporationInventors: Takashi Kikuchi, Naoki Hase, Hiroyuki Tsuji, Yasuo Fushiki
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Publication number: 20130102628Abstract: [Problem] A salt or crystal of a compound which is highly stable in a solid state and useful as a bulk material for the preparation of a pharmaceutical product is provided. [Means for Solution] 4-{[(1R,2s,3S,5s,7s)-5-Hydroxy-2-adamantyl]amino}-1H-pyrrolo[2,3-b]pyridine-5-carboxamide succinate, 4-{[(1R,2s,3S,5s,7s)-5-hydroxy-2-adamantyl]amino}-1H-pyrrolo[2,3-b]pyridine-5-carboxamide hydrobromide, and 4-{[(1R,2s,3S,5s,7s)-5-hydroxy-2-adamantyl]amino}-1H-pyrrolo[2,3-b]pyridine-5-carboxamide hydrochloride and crystals thereof are useful as a bulk material for the preparation of a solid preparation, in particular, a solid dispersion preparation. Furthermore, the crystal of the hydrobromide has excellent stability in a solid state and is useful as a bulk material for the preparation of a pharmaceutical product.Type: ApplicationFiled: June 22, 2011Publication date: April 25, 2013Applicant: Astellas Pharma Inc.Inventors: Takashi Kikuchi, Katsuhiko Gato, Koichiro Mukoyoshi, Tsuyoshi Kitamura, Takeshi Kawakami, Hironobu Yasuda
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Patent number: 8426548Abstract: A polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal distortion to be imposed on the material; an adhesive film and a flexible metal-clad laminate each comprising or obtained with the polyimide film. the polyimide film is obtained by reacting an aromatic diamine with an aromatic acid dianhydride and imidiating the polyamic acid obtained, and has a storage elastic modulus in a specific range.Type: GrantFiled: September 14, 2005Date of Patent: April 23, 2013Assignee: Kaneka CorporationInventors: Takashi Kikuchi, Hisayasu Kaneshiro
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Patent number: 8404497Abstract: A surface mount type semiconductor device is disclosed. The semiconductor device has testing lands on a lower surface of a wiring substrate with a semiconductor chip mounted thereon. Lower surface-side lands with solder balls coupled thereto respectively and testing lands with solder balls not coupled thereto are formed on a lower surface of a wiring substrate. To suppress the occurrence of contact imperfection between the testing lands and land contacting contact pins provided in a probe socket, the diameter of each testing land is set larger than the diameter of each lower surface-side land. Even when the wiring substrate is reduced in size, electrical characteristic tests using the testing lands can be done with high accuracy.Type: GrantFiled: November 15, 2010Date of Patent: March 26, 2013Assignee: Renesas Electronics CorporationInventors: Kazuya Maruyama, Toshikazu Ishikawa, Jun Matsuhashi, Takashi Kikuchi