Patents by Inventor Takashi Kikuchi

Takashi Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8398116
    Abstract: An airbag for a vehicle, the airbag formed as a bag body by sewing together a base cloth, wherein the bag body is configured so that a direction in which the bag body unfolds expands from a base end side of the bag body to a tip end side, and, the bag body includes a tensional force providing mechanism generating a tensional force pulling an upper rim of the bag body toward an outer side by forming a tension line extending so as to cross with the direction in which the bag body unfolds, along a side surface of the bag body.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: March 19, 2013
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kazuhiro Onda, Nobuhiro Kawamoto, Itaru Genpei, Makoto Uchikawa, Takashi Kikuchi, Yukio Hiruta, Yuichi Saito
  • Publication number: 20130050386
    Abstract: A light emitting unit includes a substrate, plural light emitting elements disposed on the substrate, and a lens array disposed above the plural light emitting elements. The lens array includes a base and plural lenses that each focus light emitted from a corresponding light emitting element among the plural light emitting elements. The base includes a boundary surface which is in contact with the plural lenses and an opposing surface which opposes the plural light emitting elements. The distance from one of the plural light emitting elements to the boundary surface of the base which is in contact with a corresponding lens among the plural lenses is different from the distance from another one of the plural light emitting elements to the boundary surface of the base which is in contact with a corresponding lens among the plural lenses.
    Type: Application
    Filed: January 6, 2012
    Publication date: February 28, 2013
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Masahiro IGUSA, Roshan THAPLIYA, Takashi KIKUCHI
  • Patent number: 8376620
    Abstract: A sliding bearing is constructed by an upper split bearing half and a lower split bearing half. The upper split bearing half has a sliding surface, in which an oil groove which allows a lubricating oil to flow therein is formed over the entire circumferential extent of the sliding surfaced. The oil groove extends through a crush relief to be open to a junction area, and the oil groove has a bottom which is formed so that a portion disposed toward the junction area as considered in the circumferential direction of the crush relief is located closer to the center of the upper split bearing half in comparison to a central portion. An ingress in large quantities of foreign particles within the oil groove onto the sliding surface of the sliding bearing and into a connecting rod bearing after passing through a lubricating oil feed passage is suppressed, and an oil leakage through the crush relief is reduced, allowing a lubricating oil pressure to be secured and augmented.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: February 19, 2013
    Assignees: Taiho Kogyo Co., Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Masao Yamazaki, Masao Takahashi, Yasuhiro Hikita, Junichi Natsume, Toshimitsu Shiba, Takashi Kikuchi, Tatsuhiro Terada, Takashi Shimura
  • Patent number: 8338560
    Abstract: The present invention provides a polyimide film and its usage. The polyimide film according to the present invention does not cause dimensional change due to thermal stress. The present invention particularly relates to a polyimide film and its usage, which polyimide film has a characteristic of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method. The polyimide film according to the present invention has the following characteristics: (1) an inflexion point of storage modulus ranges from 270° C. to 340° C.; (2) tan ?, which is a value obtained by dividing a loss elastic modulus by a storage modulus, has a peak-top in a range of 320° C. to 410° C.; (3) a storage modulus at 380° C. ranges from 0.4 GPa to 2.0 GPa; and (4) a storage modulus ?1 at the inflexion point (GPa) and a storage modulus ?2 at 380° C. (GPa) satisfy: 85?{(?1??2)/?1}×100?65.
    Type: Grant
    Filed: April 25, 2006
    Date of Patent: December 25, 2012
    Assignee: Kaneka Corporation
    Inventors: Hisayasu Kaneshiro, Takashi Kikuchi
  • Patent number: 8314493
    Abstract: Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: November 20, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Takashi Kikuchi, Tomoaki Hashimoto, Tatsuya Hirai
  • Patent number: 8298366
    Abstract: Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulating layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E?2/E?1 between the storage elasticity modulus E?1 at 25° C. and the storage elasticity modulus E?2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 seconds under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: October 30, 2012
    Assignee: Kaneka Corporation
    Inventors: Hisayasu Kaneshiro, Takashi Kikuchi
  • Patent number: 8293575
    Abstract: The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes.
    Type: Grant
    Filed: July 13, 2010
    Date of Patent: October 23, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Tatsuya Hirai, Tomoaki Hashimoto, Takashi Kikuchi, Masatoshi Yasunaga, Michiaki Sugiyama
  • Patent number: 8293331
    Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: October 23, 2012
    Assignee: Kaneka Corporation
    Inventors: Hisayasu Kaneshiro, Takashi Kikuchi, Shogo Fujimoto
  • Publication number: 20120212566
    Abstract: A light emitting component includes plural of light emitting elements arranged in rows on a substrate, plural lenses provided to face light emitting faces to which light beams of the plural light emitting elements are emitted, and condensing the light beams emitted from the light emitting elements, and one or plural pedestals holding the lenses such that the light emitting faces of the respective light emitting elements of the plural light emitting elements and the lenses that face the light emitting elements face the light emitting faces via gaps.
    Type: Application
    Filed: July 22, 2011
    Publication date: August 23, 2012
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Takashi KIKUCHI, Roshan THAPLIYA, Shigetoshi NAKAMURA
  • Patent number: 8226156
    Abstract: A reinforcing element structure placed between left and right seats. A reinforcing element comprises a pair of left and right side walls positioned so as to be disposed opposite from interior faces of a pair of left and right seats, and a reinforcing member for coupling the pair of left and right side walls. The pair of left and right side walls and the reinforcing member are jointly fastened to a tunnel section. A load that acts on the reinforcing element is transferred from one of the side walls to the other side wall via the reinforcing member. The load is withstood by a highly rigid reinforcing element constituted by the left and right side walls and the reinforcing member.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: July 24, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Masamitsu Shiono, Kazuhiro Onda, Hitoshi Kato, Takashi Kikuchi
  • Publication number: 20120156388
    Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.
    Type: Application
    Filed: February 9, 2012
    Publication date: June 21, 2012
    Applicant: Kaneka Corporation
    Inventors: Hisayasu Kaneshiro, Takashi Kikuchi, Shogo Fujimoto
  • Patent number: 8200052
    Abstract: There is provided an optical device including: a passive core layer in which is formed an optical circuit having a refractive index n2; an active core layer covering at least a portion of the optical circuit, exhibiting an electro-optical effect, and having a refractive index of n1 higher than n2; a lower clad layer over which the passive core layer is formed and having a refractive index n3 lower than n2; an upper clad layer covering the active and passive core layers and having a refractive index n5 lower than n1; a lower electrode disposed below the lower clad layer; and an upper electrode disposed on the upper clad layer, in which the entrance and exit portions of the active core layer are tapered, respectively.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: June 12, 2012
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Roshan Thapliya, Shigetoshi Nakamura, Takashi Kikuchi, Kazuhiro Hayashi
  • Patent number: 8158268
    Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: April 17, 2012
    Assignee: Kaneka Corporation
    Inventors: Hisayasu Kaneshiro, Takashi Kikuchi, Shogo Fujimoto
  • Publication number: 20120038182
    Abstract: Disclosed is a passenger protection device (12) for a vehicle, which protects a passenger (Mn) sitting on a seat (11) when an external force (Fs) is applied to a side surface (16a) of a vehicle body (16). The passenger protection device has a side support (14). The side support is provided on the side portion of a seat back (46), and supports the upper body (Bu) of the passenger. The side support has a deformable portion (47). The deformable portion allows the side support to be deformed by an external force having a predetermined value or more.
    Type: Application
    Filed: April 20, 2010
    Publication date: February 16, 2012
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Kazuhiro Onda, Nobuhiro Kawamoto, Itaru Genpei, Makoto Uchikawa, Takashi Kikuchi, Hajime Ishida
  • Patent number: 8113716
    Abstract: A bearing (crank bearing 6) is constituted of an upper bearing (61) that is attached to a cylinder block, a lower bearing (67) that is attached to a crank cap, and a bearing filter (71) for filtering engine oil. The bearing filter (71) is fitted in an oil hole (62A) of the upper bearing (61).
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: February 14, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Takashi Kikuchi, Yutaka Matsuyama
  • Publication number: 20120026226
    Abstract: According to one embodiment, an inkjet head includes a head main body having a plurality of nozzles and drive elements which discharges ink from the plurality of nozzles, a control section which controls the drive elements, and a ceramic base on which the head main body and the control section are arranged. The inkjet head further includes a cover which is formed of a resin in which ceramic particles are mixed, and fixed to the base to cover the control section and hold the control section inside, and an adhesive which is interposed between the base and the cover, and seals an interior of the cover.
    Type: Application
    Filed: July 21, 2011
    Publication date: February 2, 2012
    Applicant: TOSHIBA TEC KABUSHIKI KAISHA
    Inventor: Takashi KIKUCHI
  • Patent number: 8107778
    Abstract: There is provided a method of producing a waveguide element comprising steps of forming a lower cladding layer having a refractive index n1 on a substrate having a lower electrode; forming an active core layer having a refractive index n2 and exhibiting an electro-optical effect on a surface of the lower cladding layer; forming a protective layer having a reflective index n4 on a surface of the active core layer; forming a passive core layer having a reflective index n3 on a surface of the protective layer; exposing the passive core layer with a predetermined pattern to form an optical circuit; forming an upper cladding layer on a surface of the passive core layer; forming an upper electrode on a surface of the upper cladding layer; and performing a polarization orientation treatment in which the active core layer is softened or liquidized and cured while the electric field is applied.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: January 31, 2012
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Takashi Kikuchi, Roshan Thapliya, Shigetoshi Nakamura
  • Publication number: 20120022271
    Abstract: [Object] A novel method for producing an optically active pyrrolidine compound, which is useful as a production intermediate of a pharmaceutical, and a production intermediate thereof, is provided. [Means for Solution] According to the production method of the present invention, a chloro compound that is a key intermediate can be produced efficiently industrially by subjecting a mixture of regioisomers obtained by reacting an optically active epoxy compound substituted with aryl, which is easily available, with an amine compound, to chlorination. Furthermore, an optically active pyrrolidine compound can be produced industrially efficiently with the key intermediate.
    Type: Application
    Filed: April 13, 2010
    Publication date: January 26, 2012
    Applicant: ASTELLAS PHARMA INC.
    Inventors: Atsushi Ohigashi, Takashi Kikuchi
  • Publication number: 20110308725
    Abstract: Disclosed is an adhesive film having high dimensional stability which can be suitably used for two layer FPCs. Specifically, disclosed is an adhesive sheet composed of an insulting layer and an adhesive layer arranged on one side or both sides of the insulating layer. This adhesive sheet is characterized in that the insulating layer has a ratio E?2/E?1 between the storage elasticity modulus E?1 at 25° C. and the storage elasticity modulus E?2 at 380° C. of not more than 0.2 and a coefficient of thermal expansion in the MD direction of 5-15 ppm at 100-200° C. It is further characterized in that the change in the coefficient of thermal expansion of the adhesive sheet at 100-250° C. after heat treatment at 380° C. for 30 second under tension of 20 kg/m is not more than 2.5 ppm in the tension direction and not more than 10 ppm in the direction perpendicular to the tension direction.
    Type: Application
    Filed: August 30, 2011
    Publication date: December 22, 2011
    Applicant: Kaneka Corporation
    Inventors: Hisayasu Kaneshiro, Takashi Kikuchi
  • Publication number: 20110159641
    Abstract: The reliability of the semiconductor device which has the structure which stores a plurality of semiconductor chips with which plane sizes differ in the same sealing body in the state where they are accumulated via the insulating film which has adhesive property is improved. In the semiconductor device which has the structure which stores a plurality of semiconductor chips with which plane sizes differ in the same sealing body in the state where they are accumulated via DAF, thickness of DAF of the back surface of the uppermost semiconductor chip with which the control circuit was formed was made thicker than each of DAF of the back surface of the lower layer semiconductor chip with which the memory circuit was formed. Hereby, the defect that the bonding wire which connects the uppermost semiconductor chip and a wiring substrate contacts the main surface corner part of a lower layer semiconductor chip can be reduced.
    Type: Application
    Filed: March 9, 2011
    Publication date: June 30, 2011
    Inventors: Takashi KIKUCHI, Koichi KANEMOTO, Chuichi MIYAZAKI, Toshihiro SHIOTSUKI