Abstract: Provided is a booklet including: a plurality of leaves 2; a spine 4 that couples bound edges of the leaves 2 via a flexible glue layer 3; and a front cover 5 and a back cover 6 each having at least an entire area of a surface portion continuing to an entire area of a surface portion of the spine 4, wherein a flexural strength of the spine 4 backed by the glue layer 3 is set such that the spine 4 is flexibly deformed inwardly at a near acute angle together with the bound edges of the leaves 2 when center pages of the leaves 2 are spread.

Abstract: A computer readable recording medium storing a printer driver causing a computer to execute a process for generating, based on printing target data, printing data and sending to a printing device, the process which includes: selecting a character with a specific typeface from the printing target data; performing conversion of the selected character with the specific typeface into a character with other typeface; and generating the printing data based on the printing target data including the converted character.

Abstract: There is provided a polycarbonate resin composition containing aluminum oxide nanoparticles and being capable of showing good moldability and retention heat stability and combining high transparency and dimensional stability with excellent mechanical properties. The polycarbonate resin composition is characterized by containing an organic acid and aluminum oxide and in that: the resin composition has a melt mass flow rate of 11 g/10 min or higher as measured according to JIS K 7210 under the conditions of a temperature of 280° C., a nominal load of 2.16 Kg and a nozzle dimension UD of 8/2; and a No.2 dumbbell-shaped specimen according to JIS K 7113 formed by heat-press molding the resin composition into a film of 0.2 mm in thickness and cutting the film has a breaking stress of 8 MPa or higher as measured under the conditions of a temperature of 23° C., a humidity of 50% RH and a tensile rate of 50 min/min.

Abstract: A wiring circuit layer 2 having at least a wiring part and an insulating part, whose top and bottom surfaces (20A, 20B) is adhesive surfaces, is formed on a metal support substrate 1 in a way such that the layer 2 can be peeled from the substrate 1. Exposed in the first adhesive surface 20A of the wiring circuit layer 2 is a first connecting conductor part 21, which is connectable with an electrode 31 of a first semiconductor element 3 in a wafer state. After the wiring circuit layer 2 is laminated on and connected to the element 3, the metal support substrate 1 is peeled from the wiring circuit layer 2 to yield a semiconductor device 4. Another element may be connected to the other adhesive surface 20B exposed upon the peeling.

Abstract: An alumina particle composite (1) includes an alumina particle (2) and an organic acid (3) chemically bonded to a surface of the alumina particle (2). Further, the alumina particle (2) has a short axis length of 1 to 10 nm, a long axis length of 20 to 400 nm, and an aspect ratio of 5 to 80, and is represented by Formula I, Al2O3.nH2O??Formula I where n is 0 or more.

Abstract: A wiring circuit layer 2 having a connecting conductor part 21 that can be connected to an electrode 31 of a semiconductor element 3 is formed on a metal support substrate 1 in a way such that the wiring circuit layer can be separated from the substrate 1, and that the connecting conductor part 21 is exposed on the upper face of the wiring circuit layer. The wiring circuit layer 2 is laminated on the element 3 while in a wafer state, and the connecting conductor part 21 and the electrode 31 are connected. Subsequently, the support substrate 1 is peeled from the wiring circuit layer 2, and the wafer is diced, whereby individual semiconductor devices are obtained.

Abstract: Provided is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a substrate, a pressure-sensitive adhesive layer containing a lipophilic layered clay mineral, in which the layered clay mineral is in a state of being peeled and dispersed, and the interlayer distance of the layered clay mineral is 50 ? or more.

Abstract: A resin composition which provides a molded article capable of effectively blocking off heat rays from sunlight and having excellent transparency, color and moist heat resistance and a molded article thereof. The resin composition which comprises (A) 100 parts by weight of a polycarbonate resin (component A), (B) 0.0001 to 0.05 part by weight of coated hexaboride particles, each composed of a hexaboride particle of at least one element selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sr and Ca and a coating layer (component B), and (C) 0.0001 to 0.05 part by weight of nitride particles (component C).

Abstract: An electronic component includes a functional element, first and second collectors joined to the functional element, and an outer package integrally covering the functional element and the first and second collectors. The functional element has first and second end surfaces having circular shapes and a side surface having a cylindrical shape extending along a center axis. The element includes first and second electrode foils rolled about the center axis and exposed from the first and second surfaces, respectively. The outer package has first and second surfaces parallel to the first and second end surfaces of the functional element, and has first to fourth corners as seen from a direction of the center axis. The first corner is adjacent to the second corner. The first and second terminals are arranged at the first and second corners of the outer package, respectively. This electronic component can have a small size and a small height while reducing its equivalent series resistance.

Abstract: Surface-coated aluminum oxide nanoparticles capable of being uniformly blended into polycarbonate resin in a good dispersed state while maintaining a molecular weight of the polycarbonate resin at a specific level or more. Surfaces of the surface-coated aluminum oxide nanoparticles are coated with a dispersant and a silylation reagent. In a case where a monochromated Al-K? ray is irradiated onto a sample surface by using an X-ray photoelectron spectroscope, when a surface element composition is calculated from an obtained photoelectron peak area, contents (atm %) of nitrogen atoms, thiol-derived sulfur atoms, and halogen atoms in the surface-coated aluminum oxide nanoparticles are individually 2 or less, and when the surface element composition is calculated from obtained photoelectron peak areas of Al2p and Si2s, a concentration (mol %) of silicon atoms with respect to aluminum atoms is 0.05 to 30.

Abstract: First, a catalyst for performing electroless plating in a subsequent step is caused to adhere to surfaces of uneven portions of a matrix. Next, an insulating layer made of a resin material is prepared. Then, the insulating layer is heated to be softened while the uneven portions of the matrix are pressed against one surface of the insulating layer. Thus, grooves corresponding to shapes of the uneven portions of the matrix are formed in the insulating layer while the catalyst is transferred to bottom surfaces and side surfaces of the grooves. The insulating layer is then subjected to electroless plating. In this case, metal is deposited by reduction reaction on portions of the insulating layer where the catalyst exists. Accordingly, conductor traces are formed in the grooves of the insulating layer.

Abstract: A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

Abstract: A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the thin metal film layer exposed by electroplating. Then, the plating resist layer is removed, and the thin metal film layer in the region having the plating resist layer is removed. In this way, a conductive pattern including the thin metal film layer and the metal plating layer is formed. The upper surface of the base insulating layer in the region without the conductive pattern is subjected to roughening treatment. A cover insulating layer is formed on the upper surfaces of the base insulating layer and the conductive pattern. In this way, a printed circuit board is completed.

Abstract: A printed circuit board having prescribed conductive patterns formed on an insulating layer is provided about 20 mm apart from an AC electrode provided in a plasma etching device. An earth electrode is provided on the side opposing the AC electrode. More specifically, the printed circuit board is provided outside a sheath layer that is a region having a high plasma density generated in the vicinity of the AC electrode. The frequency of an AC power supply is preferably not more than 1 GHz. The pressure in the device is preferably in the range from 1.33×10?2 Pa to 1.33×102 Pa. The inter-electrode distance between the AC electrode and the earth electrode is preferably not more than 150 mm, more preferably from 40 mm to 100 mm.

Abstract: An alumina particle (1) of the present invention has an alumina body with a short axis length (b) of 1 to 10 nm, a long axis length (a) of 20 to 400 nm and an aspect ratio (a/b) of 5 to 80. The alumina body is expressed by a Formula I, and n is not less than 0. Al2O3.

Abstract: A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.

Abstract: A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.

Abstract: A computer readable recording medium storing a program causing a computer to execute a process for a combination printing function for collectively printing out contents of plural pages into one page, the process which includes selecting a test printing target page from printing target data, generating image data in which at least two pages regarding the selected page are reduced to different scales and are collected into one page, and transmitting the generated image data to a printing device.

Abstract: A computer readable recording medium storing a printer driver causing a computer to execute a process for generating, based on printing target data, printing data and sending to a printing device, the process which includes: selecting a character with a specific typeface from the printing target data; performing conversion of the selected character with the specific typeface into a character with other typeface; and generating the printing data based on the printing target data including the converted character.

Abstract: A printer driver for holding the setting of various parameters for a printer and effecting conversion of print data from an application, the printer driver includes: a specific character string detecting unit which detects from the print data a specific character string designated by a user; a code converting unit which converts the specific character string detected by the specific character string detecting unit to a code; and a code imparting unit which imparts the code converted by the code converting unit to the print data.