Abstract: A rotary valve (1) includes a valve body (2) formed with a chamber communication passage (24) for flowing a main fluid and a vent communication passage (25) for discharging the main fluid and a cylindrical valve member (3) rotatably held in the valve body (2) and formed with a main passage (31) for flowing the main fluid. The cylindrical valve member (3) is rotated to switch the connection of the main passage (31) between the chamber communication passage (24) and the vent communication passage (25). The rotary switching valve (1) further includes a purge gas passage for passing purge gas in a clearance (11) between the valve body (2) and the cylindrical valve member (3), the purge gas being supplied to the clearance (11) to prevent the main fluid from leaking out of the main passage (31).

Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.

Abstract: A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates.

Abstract: [Object] To provide a low-cost production method for a heat transportation device with which efficient production with a small number of steps is possible. [Solving Means] A capillary member (5) having a larger thickness than a frame member (2) is mounted on an inner surface (11) of a lower plate member (1). Subsequently, the frame member (2) is mounted on the inner surface (11) of the lower plate member (1), and an upper plate member (3) is mounted on the capillary member (5). Due to a difference between the thickness of the capillary member (5) and the thickness of the frame member (2), a squashing amount (G) is provided between the frame member (2) and the upper plate member (3). Then, the lower plate member (1) and the upper plate member (3) are diffusion-bonded with the frame member (2). At this time, the capillary member (5) is compressed by an amount corresponding to the squashing amount (G).

Abstract: A method for heat treatment of a coiled spring includes cold forming a coiled spring, annealing the coiled spring after the cold forming, thereby removing of residual stress generated in the cold forming, in which the annealing is performed by electric resistance heating.

Abstract: An electronic apparatus includes: a semiconductor device including an electrically conductive portion to be grounded, the semiconductor device being configured to be mounted on a circuit board; a heat sink configured to radiate heat generated by the semiconductor device; a fastener configured to fasten the heat sink to the circuit board; and a first spring member wound around the fastener to electrically connect the heat sink to the electrically conductive portion.

Abstract: To provide a low-cost air-operated valve, an air-operated valve comprises a piston, a cylinder in which the piston is allowed to slide by operation air, and a valve section to be driven by sliding movement of the piston. The cylinder includes an outer member having a hollow portion and an inner member loaded in the hollow portion of the outer member to define a piston chamber in which the piston is allowed to slide.

Abstract: [Object] To provide a heat transport device manufacturing method and a heat transport device that has a high hermeticity and is manufactured without increasing a load applied at a time of performing diffusion bonding. [Solving Means] A bonding surface (1a) of an upper member (1) that is subjected to diffusion bonding to a bonding surface (21) of a frame member (2) is formed into a convex shape, which can make a contact area of the bonding surface (1a) and the bonding surface (21) small. Therefore, a pressure (load per unit area) applied to the bonding surfaces (1a and 21) is increased, and thus the diffusion bonding of the bonding surfaces (1a and 21) is performed by a high pressure. Similarly, a bonding surface (3a) of a lower member (3) and a bonding surface (23) of the frame member (2) are also subjected to the diffusion bonding by a high pressure.

Abstract: [Object] To provide a phase-change-type heat spreader, a flow-path structure, an electronic apparatus including the phase-change-type heat spreader, a flow-path structure used therein, and the like that are capable of improving a thermal efficiency by a phase change and lowering a thermal resistance. [Solving Means] Capillary boards (401 to 404) in which a plurality of openings (408) penetrating the capillary boards are formed on a wall surface constituting grooves (405) in a longitudinal direction of the grooves (405), are laminated while each being rotated 90 degrees to be deviated within an X-Y plane so that the grooves (405) of those layers extend in mutually-orthogonal directions, and the plurality of openings (408) function as a part of a vapor-phase flow path through which a vapor refrigerant evaporated by heat received by a heat-receiving plate circulates.

Abstract: According to an aspect of the present invention, there is provided an electronic device including: a substrate board; a semiconductor device mounted on the substrate board; a heat sink configured to radiate heat from the semiconductor device; a first conductive portion provided on the substrate board; and a second conductive portion provided on the substrate board, the second conductive portion separated from the first conductive portion by a discharge gap, wherein: the heat sink is electrically connected to the first conductive portion; and the second conductive portion is grounded.

Abstract: A method of manufacturing a heat transport device includes injecting a working fluid that transports heat by a phase change into a casing through an injection opening of the casing under reduced pressure, sealing an injection path by caulking under the reduced pressure, the injection path being provided in the casing into which the working fluid is injected and causing the injection opening and an action area in which the phase change of the working fluid occurs to communicate with each other, contacting a peripheral area of the injection opening of the casing with an inner surface of the injection path by caulking the peripheral area, the peripheral area including the injection opening, and sealing the injection opening by welding a part of the casing contacted.

Abstract: A resin filler pipe which has lower fuel permeability and excellent moldability. The resin filler pipe, which is to be provided on a fuel supply port side, is composed of an alloy material which comprises a sea phase, an island phase dispersed in the sea phase and a sea-island compatibilizing layer present between the sea phase and the island phase. The sea phase comprises a higher-acid-modification-ratio high-density polyethylene resin (A), a lower-acid-modification-ratio high-density polyethylene resin (B), and an unmodified high-density polyethylene resin (C). The island phase comprises a polyamide resin (D). The proportion of the higher-acid-modification-ratio high-density polyethylene resin (A) is 2 to 19 wt % based on the total weight of the components (A) to (D).

Abstract: A resin fuel-supply component which has lower fuel permeability and excellent weldability to a resin fuel tank. The resin fuel-supply component is composed of an alloy material which comprises a sea phase, an island phase dispersed in the sea phase and a sea-island compatibilizing layer present between the sea phase and the island phase. The sea phase comprises a higher-acid-modification-ratio high-density polyethylene resin (A), a lower-acid-modification-ratio high-density polyethylene resin (B), and an unmodified high-density polyethylene resin (C). The island phase comprises an unmodified polyamide resin (D) and a modified polyamide resin (E). In the resin fuel-supply component, the proportion of the modified polyamide resin (E) is not greater than 8 wt % based on the total weight of resins (A)-(E).

Abstract: A rotary valve (1) includes a valve body (2) formed with a chamber communication passage (24) for flowing a main fluid and a vent communication passage (25) for discharging the main fluid and a cylindrical valve member (3) rotatably held in the valve body (2) and formed with a main passage (31) for flowing the main fluid. The cylindrical valve member (3) is rotated to switch the connection of the main passage (31) between the chamber communication passage (24) and the vent communication passage (25). The rotary switching valve (1) further includes a purge gas passage for passing purge gas in a clearance (11) between the valve body (2) and the cylindrical valve member (3), the purge gas being supplied to the clearance (11) to prevent the main fluid from leaking out of the main passage (31).

Abstract: A heat-transport device, which is suitable for reduction in volume and thickness, includes a wick that generates capillary action to reflux working fluid and a line in which a liquid- or vapor-phase working fluid flows, wherein the surface of at least one of the wick and the line are subjected to coating treatment by ion implantation, thermal oxidation, or steam oxidation to prevent the generation of gas, particularly hydrogen.

Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.

Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, a liquid-phase flow path, and an intermediate layer. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path causes the working fluid in a vapor phase to circulate inside the vessel. The liquid-phase flow path includes a first mesh member having a first mesh number and causes the working fluid in a liquid phase to circulate inside the vessel. The intermediate layer includes a second mesh member and is interposed between the liquid-phase flow path and the vapor-phase flow path, the second mesh member being laminated on the first mesh member and having a second mesh number smaller than the first mesh number.

Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path causes the working fluid in a vapor phase to circulate inside the vessel. The liquid-phase flow path includes a laminated body and causes the working fluid in a liquid phase to circulate inside the vessel, the laminated body including a first mesh member and a second mesh member and being formed such that the first mesh member and the second mesh member are laminated while weaving directions thereof differ relatively.

Abstract: According to an aspect of the present invention, there is provided an electronic device including: a substrate board; a semiconductor device mounted on the substrate board; a heat sink configured to radiate heat from the semiconductor device; a first conductive portion provided on the substrate board; and a second conductive portion provided on the substrate board, the second conductive portion separated from the first conductive portion by a discharge gap, wherein: the heat sink is electrically connected to the first conductive portion; and the second conductive portion is grounded.

Abstract: A heat-transporting device includes a casing, a working fluid, a first substrate, a second substrate, and a third substrate. The casing includes a first side and a second side opposed to the first side. The working fluid is sealed inside the casing and transports heat by a phase change. The first substrate includes an inlet through which the working fluid is injected and constitutes the first side of the casing. The second substrate is disposed opposite to the first substrate and constitutes the second side of the casing. The third substrate includes a contact portion that is brought into contact with the inlet so that the inlet is sealed when the inlet is pressed, the third substrate being interposed between the first substrate and the second substrate.