Abstract: A cleaning device, comprises: a plurality of brush rolls being contact with a surface of the image carrier that a toner is attached; and a biasing unit applying bias voltages having different polarities from each other to at least two of the brush rolls, the plurality of brush rolls including a first brush roll and a second brush roll, a bias having a polarity opposite to a normal polarity of the toner being applied to the first brush roll, a bias having the same polarity as the normal polarity of the toner being applied to the second brush roll, a surface circulating speed of the first brush roll being set to be higher than the surface circulating speed of the second brush roll.

Abstract: A wastewater treatment control system for controlling a wastewater treatment of using a microorganism that can degrade a specific compound, comprises measuring a specific value corresponding to a concentration of the specific compound in wastewater, and controlling the wastewater treatment on the basis of the specific value.

Abstract: A wastewater treatment control system for controlling a wastewater treatment of using a microorganism that can degrade a specific compound, comprises measuring a specific value corresponding to a concentration of the specific compound in wastewater, and controlling the wastewater treatment on the basis of the specific value.

Abstract: A wastewater treatment control system for controlling a wastewater treatment of using a microorganism that can degrade a specific compound, comprises measuring a specific value corresponding to a concentration of the specific compound in wastewater, and controlling the wastewater treatment on the basis of the specific value.

Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Abstract: A polishing solution for metal comprises a specific compound represented and an oxidizing agent. A chemical mechanical polishing method for a semiconductor substrate, comprises: supplying a polishing solution for metal comprising a specific compound; and an oxidizing agent; allowing a polishing face and a face to be polished to be moved relatively to each other while the polishing face and the face to be polished are in contact with each other via the polishing solution for metal; and performing polishing with a contact pressure between the polishing face and the face to be polished in the range of from 1000 to 25000 Pa.

Abstract: The present invention relates to a method of reading an image, which comprises exposing a color photosensitive material having at least three photosensitive layers containing blue-, green- and red-photosensitive silver halide emulsions, respectively, on a transparent support, processing the exposed color photosensitive material at a processing temperature of 50° C. or more to form a silver image, and substantially reading the silver image.

Abstract: A method of enabling reuse of photographic processing waste solutions with ease at low cost without discharging effluents in a substantial sense, and a photographic processing agent regenerated by such a method are provided, which is a method of reusing a photographic processing waste solution, in which a solidified matter is prepared from the photographic processing waste solution by a dry-solidification according to a thin film concentration method without removing ingredients accumulated during a processing, the solidified matter is formed into granules, and the granules is reused as a solid photographic processing agent: and a regenerated processing agent prepared by the aforesaid method.

Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Abstract: It is an object to provide a print service system capable of easily giving, from a moving destination, a print order of a digital image photographed at the moving destination and immediately acquiring a necessary print. A user requiring to print a digital image fetches digital image information to a mobile telephone 5 and transmits the digital image information, together with order request information, to a print order receiving server through a network 1. The order request information includes print condition information. When receiving the digital image information and the print condition information, the print order receiving server 2 transmits digital image information to be printed to a printer server to be a printing destination corresponding to a print condition. At the printing destination, an order print created based on the information transmitted to the print server is delivered to a registered delivery destination which is transmitted.

Abstract: In a mounting method for mounting a bump-equipped electronic component 5 with a plurality of metallic bumps 6 on a substrate 2 with a plurality of electrodes 3, during the process of connecting the metallic bumps 6 to the electrodes 3 by aligning the metallic bumps with the electrodes 3 with thermosetting resin 4 intervening between the electronic component 5 and substrate 2 and by pressing the electronic component 5 to the substrate 2 while exerting ultrasonic oscillation, heat and applied pressure on the electronic component 5, all of the metallic bumps 6 are brought into contact with the electrodes so that they are electrically connected to each other, and when some of the metallic bumps are metallic-bonded to the electrodes, ultrasonic oscillation is stopped. Thus, it is possible to prevent occurrence of damage owing to the excessive exertion of ultrasonic oscillation on the metallic bumps which have precedently started their metallic-bonding.

Abstract: A photographic processing system, which contains: solidifying a photographic processing waste solution, to give a solidified matter thereof; and reusing part of the solidified matter as a solid processing agent.

Abstract: A method of enabling reuse of photographic processing waste solutions with ease at low cost without discharging effluents in a substantial sense, and a photographic processing agent regenerated by such a method are provided, which is a method of reusing a photographic processing waste solution, in which a solidified matter is prepared from the photographic processing waste solution by a dry-solidification according to a thin film concentration method without removing ingredients accumulated during a processing, the solidified matter is formed into granules, and the granules is reused as a solid photographic processing agent: and a regenerated processing agent prepared by the aforesaid method.

Abstract: An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Abstract: A photographic processing system, which contains: solidifying a photographic processing waste solution, to give a solidified matter thereof; and reusing part of the solidified matter as a solid processing agent.

Abstract: A wastewater treatment control system for controlling a wastewater treatment of using a microorganism that can degrade a specific compound, comprises measuring a specific value corresponding to a concentration of the specific compound in wastewater, and controlling the wastewater treatment on the basis of the specific value.

Abstract: A method of processing a silver halide color photographic material comprises the steps of color-developing an image-wise exposed silver halide color photographic material and subjecting the developed material to desilvering in a processing bath having a fixing function and containing a thiosulfate compound and the following compound or analogue thereof in a molar ratio of 1/0.05 to 1/0.30. In this process, the fixing speed is extremely high even when the replenishing rate is low and the processed photosensitive material has an excellent resistance to fading by light.

Abstract: A method for processing a silver halide color photographic light-sensitive material is disclosed, comprising processing a silver halide color photographic light-sensitive material A for photographing containing a high silver bromide emulsion having a silver bromide content of from 50 to 100 mol % and a silver halide color photographic light-sensitive material B for photographing containing a high silver chloride emulsion having a silver chloride content of from 50 to 100 mol % with a common color developer, wherein both the replenishing amount and the concentration of the replenisher for the color developer are changed according to the processed amount of said two types of light-sensitive materials.

Abstract: A screen image observing device and method provides the sensations of virtual reality to the observer and reduces, to the extent possible, the discrepancy that is perceived by the observer between the movement of the observer's head and the displayed screen image. The device has a head tracking means, which detects the movement of the observer's head, and a screen image generating means, which generates image data based upon the result of the detection performed by the head tracking means. Image data is supplied to a display means.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.