Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: A power consumption reduction circuit for reducing power consumed by a clock tree network including a transmission control circuit. The power consumption reduction circuit includes a transmission control circuit for controlling transmission of the clock signal to the buffer circuit group so as to selectively provide and interrupt the clock signal. A switch circuit disconnects the buffer circuit group from a power supply when the transmission control circuit interrupts the clock signal.

Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: A winching and drawing machine comprising a drive shaft 1 for driving a load sheave 10, a pressure receiving member 2 fitted onto the drive shaft 1, brake plates 3 installed in contact with the pressure receiving member 2 and fitted onto the drive shaft 1, a pawl wheel 4 interposed between the brake plates 3, a drive member 5 screwed on the drive shaft 1 so as to be pressed to and separated from the brake plates 3, an idler spring 6 installed between the drive shaft 1 and the drive member 5, and a lever 24, and characterized in that a stopper 7 engaging with the drive shaft 1 is provided at an end face of the drive member 5 and an idler grip 8 is fixed on an outer face of the stopper 7. Lever latching means at a drive-shaft end of the winching and drawing machine has the function of adjusting the chain length, and the winching and drawing machine includes a small number of parts, and is small-sized, lightweight and inexpensive.

Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.

Abstract: The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.

Abstract: An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure part formed between a feed pipe and the cooling part, and having a liquid path cross-sectional profile that is gradually reduced in the short-side direction of the cooling part and that is gradually enlarged in the long-side direction thereof; and a second partial structure part formed between the cooling part and a drain pipe, and having a liquid path cross-sectional profile that is gradually enlarged from the short-side of the cooling part and that is gradually reduced from the long-side thereof.

Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Abstract: A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

Abstract: In a hoisting/pulling device comprising a pinion gear 4, reduction gears 5a which are meshed with the pinion gear 4 and are rotatably mounted in a frame 1, and a load sheave which is interlocked with reduction gears 5b and is rotatably mounted in a frame 1, reduction gear bearings 8 are contiguously formed with a load sheave bearing 7 which is formed in the center of the frame 1. By making the distance between the axes of the reduction gears small and by forming the load gear and the load sheave integrally, it becomes possible to provide the hoisting/pulling device which can make the whole device compact and lightweight and can reduce the number of parts and man hours for machining the device.

Abstract: In a hoisting/pulling device comprising a pinion gear 4, reduction gears 5a which are meshed with the pinion gear 4 and are rotatably mounted in a frame 1, and a load sheave which is interlocked with reduction gears 5b and is rotatably mounted in a frame, reduction gear bearings 8 are contiguously formed with a load sheave bearing 7 which is formed in the center of the frame 1. By making the distance between the axes of the reduction gears small and by forming the load gear and the load sheave integrally, it becomes possible to provide the hoisting/pulling device which can make the whole device compact and light-weighted and can reduce the number of parts and man-hours for machining.

Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Abstract: According to the invention, there is provided a water cooled inverter structure forming a plurality of shallow cavities and deep cavities in a housing, fixing a bottom surface of power semiconductor modules to shallow cavities to form a shallow water channel and directly cooling the power semiconductor modules using this shallow water channel. Since cooling water flows fast in the shallow water channel, it is possible to improve a cooling efficiency and also reduce pressure loss using a deep water channel with deep cavities. Furthermore, providing a plurality of cavities makes it possible to reduce a size of the power semiconductor modules and provide a plurality of power semiconductor modules, thus improving reliability. It is possible to place a control board below the water channel to thermally cut off the control board from the power semiconductor modules, which makes it possible to reduce temperature of a control circuit.

Abstract: A plasma display apparatus has an electronic circuit module including a rigid substrate attached to a chassis thereof and a flexible substrate partially overlapped with the rigid substrate. The rigid substrate has chips and the flexible substrate has a first portion with apertures for exposing the chips and bonding pads and a second portion positioned on the outside of the rigid substrate. Bonding wires connect terminals of the chips with the bonding pads of the flexible substrate. A reinforcing pattern or a dummy pattern is provided in at least the first portion of the flexible substrate. The reinforcing pattern provides for rigidity for the first portion of the flexible substrate for accurate positioning of the bonding pads relative to the chips.