Patents by Inventor Takayuki Aoki

Takayuki Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130076016
    Abstract: A vehicle steering column support structure efficiently supports a steering column. A steering support bracket that supports a steering column is fixed to instrument panel reinforcement disposed along the vehicle width direction between left and right front pillars. A floor brace spans between a side portion of a first support member of the steering support bracket and a side wall portion of a floor tunnel portion. A steering brace spans between a side portion of the first support member and a lower portion of the front pillar. Up-down vibration of the steering column can accordingly be supported by axial force of the floor brace and the steering brace.
    Type: Application
    Filed: June 8, 2010
    Publication date: March 28, 2013
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Takayuki Aoki
  • Patent number: 8329298
    Abstract: A method that heat-expandable microspheres includes the use of a shell of thermoplastic resin and a non-fluorine blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin. The method includes, a step of dispersing an oily mixture containing a polymerizable component, the blowing agent, and a polymerization initiator containing a peroxydicarbonate in an aqueous dispersing medium to polymerize the polymerizable component contained in the oily mixture. The resultant heat-expandable microsphres have a shell which is less apt to become thinner than its theoretical value, contain minimum amount of resin particle inside their shell, and have excellent heat-expanding performance.
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: December 11, 2012
    Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
    Inventors: Toshiaki Masuda, Kenichi Kitano, Katsushi Miki, Takeshi Inohara, Takayuki Aoki
  • Patent number: 8328207
    Abstract: An engine generator movable on left and right wheels. The wheels are provided on a rear section of a bottom cover via an axle. A cylinder of an engine is disposed so as to incline upwards towards the direction of the axle. Inclining the cylinder lowers the center of gravity of the engine and disposes the axle positioned below the cylinder at a high position, thereby reducing the height of the engine generator. The orientation of the engine generator during travel is stabilized.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: December 11, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Tadafumi Hirose, Masanori Shin, Makoto Uchimi, Takayuki Aoki
  • Patent number: 8324286
    Abstract: Heat-expandable microspheres include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin, have a maximum expanding ratio not lower than 50 times, and are thermally expanded into hollow particulates having a repeated-compression durability not lower than 75 percent. The method of producing the heat-expandable microspheres includes the steps of dispersing an oily mixture containing a polymerizable component and the blowing agent in an aqueous dispersing medium containing a specific water-soluble compound and polymerizing the polymerizable component contained in the oily mixture.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: December 4, 2012
    Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
    Inventors: Toshiaki Masuda, Ichiro Takahara, Kenichi Kitano, Katsushi Miki, Takeshi Inohara, Takeyoshi Fukuda, Takayuki Aoki, Satoshi Kawanami
  • Publication number: 20120295514
    Abstract: This invention relates to a nest box (1) for bumblebees that provides sufficient ventilation inside the nest box (1). The provided nest box (1) with a bumblebees hive (2) inside resolves the problems of insufficient ventilation, by being mounted with a ventilation panel (14), comprising ventilation holes (13) in size(s) that enable ventilation but at the same time bumblebees from passing through.
    Type: Application
    Filed: January 24, 2011
    Publication date: November 22, 2012
    Applicants: TOKAI TRADING CO., LTD., BIOBEST BELGIUM NV
    Inventors: Willem Steven Paul Keppens, Tim Bollens, Felix Leopold Wackers, Hidetoshi Yokoi, Masahiro Yoneda, Takayuki Aoki
  • Patent number: 8210133
    Abstract: Engine cooling structure directs cooling air, introduced into a case by operation of a fan, to a cylinder block of an engine and then discharges the cooling air out of the case through an outlet port along meandering flow passages. Case cooling structure directs cooling along the inner surface of the case. Further cooling flow passage directs the air to vertically-oriented heat radiating fins so that the cooling air flows upward along the fins and then is discharged through the outlet port. Metal cooling-fan cover is supported by the lower cover via mounting members, and a resin-made cover guide is fastened to the engine together with supporting portions and interposed between the fan cover and the engine.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: July 3, 2012
    Assignee: Honda Motor Co., Ltd.
    Inventors: Tadafumi Hirose, Hitoshi Yuki, Takayuki Aoki, Ryosuke Shibata, Hiroki Iikura, Makoto Uchimi, Masashi Kai
  • Patent number: 8199364
    Abstract: When a second detector determines that a character image has a halftone (YES in #1) and a third detector (48) determines that a font size of the character image is equal to or greater than a threshold value ? and equal to or smaller than a threshold value ? (YES in step #4), a fourth detector determines whether a presently focused pixel constitutes a particular portion of a character (step #5). When the fourth detector determines that the pixel data of the presently focused pixel constitutes the particular portion of the character (YES in step #5), the image processing section sets the pixel data to be subjected to a second screen processing which is performed at a higher gradation level (step #6).
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: June 12, 2012
    Assignee: Kyocera Mita Corporation
    Inventor: Takayuki Aoki
  • Publication number: 20120132841
    Abstract: Oxide film formed on a spring-retaining flange by heat treatment gets unlikely to peel off, thereby improving wear resistance of a contact surface of the spring-retaining flange with a valve spring. The oxide film 15 of the part of the spring-retaining flange 3 with the valve spring 7 is at least partially removed to make thickness of the oxide film to 0.00 to 0.02 ?m.
    Type: Application
    Filed: April 27, 2010
    Publication date: May 31, 2012
    Applicant: FUJI OOZX INC.
    Inventors: Takayuki Aoki, Takeshi Sassa
  • Publication number: 20120121907
    Abstract: The present invention provides heat-expanded microspheres having high packing efficiency, and a production method thereof. The heat-expanded microspheres are produced by expanding heat-expandable microspheres, which comprise shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.
    Type: Application
    Filed: January 23, 2012
    Publication date: May 17, 2012
    Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Toshiaki MASUDA, Ichiro TAKAHARA, Kenichi KITANO, Katsushi MIKI, Takeshi INOHARA, Takayuki AOKI
  • Publication number: 20120080131
    Abstract: In heat-expandable microspheres as a starting material for hollow fine particles, which have excellent performances required for giving not only a durability in steady running region but also a durability in high-speed running region to a tire-rim assembly, and each consisting of an outer shell made of a thermoplastic resin obtained by polymerizing a monomer component in the presence of a polymerization initiator, and a foaming agent encapsulated in the outer shell and having a boiling point not higher than a softening point of the thermoplastic resin, the polymerization initiator comprises a peroxydicarbonate as an essential component, and the foaming agent comprises a fluorine-containing compound having an ether structure and a carbon number of 2-10 and containing no chlorine atom and bromine atom.
    Type: Application
    Filed: November 21, 2011
    Publication date: April 5, 2012
    Applicants: MATSUMOTO YUSHI-SEIYAKU CO., LTD., BRIDGESTONE CORPORATION
    Inventors: Hiroyuki TERATANI, Toshiaki MASUDA, Kenichi KITANO, Katsushi MIKI, Takayuki AOKI, Takeshi INOHARA
  • Patent number: 8129020
    Abstract: Heat-expanded microspheres having high packing efficiency are produced by expanding heat-expandable microspheres, which include a shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: March 6, 2012
    Assignee: Matsumoto Yushi-Seiyaku Co., Ltd.
    Inventors: Toshiaki Masuda, Ichiro Takahara, Kenichi Kitano, Katsushi Miki, Takeshi Inohara, Takayuki Aoki
  • Patent number: 7943706
    Abstract: An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: May 17, 2011
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yasuo Kimura, Eiichi Asano, Toshio Shiobara, Takayuki Aoki
  • Patent number: 7930092
    Abstract: A control apparatus for an internal combustion engine, includes: a fuel injection unit; an ignition unit; a crank angle detection unit; a fuel pump; a booster unit; an ignition discharge unit; and a control unit that controls the fuel injection unit, the ignition unit, and the fuel pump, that ascertains ignition timings based on crank signals output from the crank angle detection unit, and that performs a startup control sequence that is made up of fuel injection processing, voltage boosting processing, ignition processing, and fuel supply processing.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: April 19, 2011
    Assignee: Keihin Corporation
    Inventors: Kazuhito Tokugawa, Shinichi Ishikawa, Tomoo Shimokawa, Katsuaki Wachi, Satoshi Chida, Hiroyuki Utsumi, Takayuki Aoki
  • Patent number: 7898094
    Abstract: An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: March 1, 2011
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Takayuki Aoki
  • Publication number: 20100180995
    Abstract: In heat-expandable microspheres as a starting material for hollow fine particles, which have excellent performances required for giving not only a durability in steady running region but also a durability in high-speed running region to a tire-rim assembly, and each consisting of an outer shell made of a thermoplastic resin obtained by polymerizing a monomer component in the presence of a polymerization initiator, and a foaming agent encapsulated in the outer shell and having a boiling point not higher than a softening point of the thermoplastic resin, the polymerization initiator comprises a peroxydicarbonate as an essential component, and the foaming agent comprises a fluorine-containing compound having an ether structure and a carbon number of 2-10 and containing no chlorine atom and bromine atom.
    Type: Application
    Filed: October 24, 2006
    Publication date: July 22, 2010
    Inventors: Hiroyuki Teratani, Toshiaki Masuda, Kenichi Kitano, Katsushi Miki, Takayuki Aoki, Takeshi Inohara
  • Publication number: 20100104794
    Abstract: A thermosetting epoxy resin composition characterized by containing as a resin ingredient a product of pulverization of a solid matter obtained by reacting a triazine derivative/epoxy resin with an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups.
    Type: Application
    Filed: July 28, 2006
    Publication date: April 29, 2010
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takayuki Aoki, Toshio Shiobara
  • Publication number: 20090320772
    Abstract: Engine cooling structure directs cooling air, introduced into a case by operation of a fan, to a cylinder block of an engine and then discharges the cooling air out of the case through an outlet port along meandering flow passages. Case cooling structure directs cooling along the inner surface of the case. Further cooling flow passage directs the air to vertically-oriented heat radiating fins so that the cooling air flows upward along the fins and then is discharged through the outlet port. Metal cooling-fan cover is supported by the lower cover via mounting members, and a resin-made cover guide is fastened to the engine together with supporting portions and interposed between the fan cover and the engine.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 31, 2009
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tadafumi Hirose, Hitoshi Yuki, Takayuki Aoki, Ryosuke Shibata, Hiroki Iikura, Makoto Uchimi, Masashi Kai
  • Publication number: 20090322046
    Abstract: An engine generator movable on left and right wheels. The wheels are provided on a rear section of a bottom cover via an axle. A cylinder of an engine is disposed so as to incline upwards towards the direction of the axle. Inclining the cylinder lowers the center of gravity of the engine and disposes the axle positioned below the cylinder at a high position, thereby reducing the height of the engine generator. The orientation of the engine generator during travel is stabilized.
    Type: Application
    Filed: June 24, 2009
    Publication date: December 31, 2009
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tadafumi Hirose, Masanori Shin, Makoto Uchimi, Takayuki Aoki
  • Publication number: 20090280328
    Abstract: The present invention provides heat-expanded microspheres having high packing efficiency, and a production method thereof. The heat-expanded microspheres are produced by expanding heat-expandable microspheres, which comprise shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.
    Type: Application
    Filed: September 14, 2006
    Publication date: November 12, 2009
    Applicant: Matsumoto Yushi-Seiyaku Co. Ltd
    Inventors: Toshiaki Masuda, Ichiro Takahara, Kenichi Kitano, Katsushi Miki, Takeshi Inohara, Takayuki Aoki
  • Publication number: 20090176098
    Abstract: A method that heat-expandable microspheres includes the use of a shell of thermoplastic resin and a non-fluorine blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin. The method includes a step of dispersing an oily mixture containing a polymerizable component, the blowing agent, and a polymerization initiator containing a peroxydicarbonate in an aqueous dispersing medium to polymerize the polymerizable component contained in the oily mixture. The resultant heat-expandable microspheres have a shell which is less apt to become thinner than its theoretical value, contain minimum amount of resin particle inside their shell, and have excellent heat-expanding performance.
    Type: Application
    Filed: October 4, 2006
    Publication date: July 9, 2009
    Applicant: Matsumoto Yushi-Seiyaku Co., Ltd.
    Inventors: Toshiaki Masuda, Kenichi Kitano, Katsushi Miki, Takeshi Inohara, Takayuki Aoki