Abstract: For providing a simultaneous both-sided ironing-deep drawing process, producing vessels like metallic cans which strong enough in their use and, after having been used, can easily be squashed by hand or foot, the height difference between the inner die and outer die and the profile radii of the inner die and outer die have been changed to changed the longitudinal wall strength of tubular structures in the simultaneous both-sided ironing-deep drawing process, holding a work material between the inner die and outer die, and simultaneously ironing both-sides of the work wall, and thereby obtaining tubular structures.

Abstract: In press forming including ironing, an elastically deformable material is used for a part of ironing die contacting to the work material under a higher pressure than designed, for taking the formed product out from the die easily in a case that the ironing die and the formed product are very close in size to each other, and thereby improving the efficiency of production.

Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

Abstract: A support system for a laser beam machine is provided which includes an inferred value production unit which produces an inferred value for each of a plurality of processing condition parameters indicative of conditions under which laser processing is performed, by use of an artificial intelligence function, and a display unit which displays the inferred value produced by the inferred value production unit. The support system further includes an input unit which allows an operator to enter a plurality of evaluation parameters that represent results of evaluation on a current processing state.

Abstract: An epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) catalyzed microcapsules containing an imidazole compound or organic phosphorus compound and having a mean particle size of 0.5-50 &mgr;m, the quantity of the catalyst leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire catalyst quantity. The composition is suited for semiconductor package encapsulation since it has satisfactory catalyst latency, storage stability and cure.

Abstract: An epoxy resin composition comprising (A) a biphenyl skeleton epoxy resin, (B) a biphenyl skeleton phenolic resin as a curing agent, (C) molybdenum compound, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract: In semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a curing agent and an inorganic filler, 1-90% by weight of the inorganic filler is spherical cristobalite. The compositions are able to achieve higher loadings of inorganic filler, allow easy control of the coefficient of thermal expansion, and provide high-quality cured products having improved thermal conductivity and low moisture absorption.

Abstract: A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.

Abstract: An epoxy resin composition comprising (A) a biphenyl skeleton-bearing epoxy resin, (B) a biphenyl skeleton-bearing phenolic resin as a curing agent, (C) an organosiloxane containing phenyl and organooxy groups, and (D) an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into a part having improved reflow crack resistance, moisture resistance, and flame retardance. It does not pose a hazard to human health or the environment.

Abstract: An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.

Abstract: An epoxy resin composition contains (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a skeleton having a structure in which two benzene rings are conjugable to each other directly or via an aliphatic unsaturated double bond, carbon atoms having an atomic orbital of SP.sup.2 type accounting for at least 50% of the carbon number, (B) a phenolic resin having a hydroxyl equivalent of at least 160, carbon atoms having an atomic orbital of Sp.sup.2 type accounting for at least 85% of the carbon number, (C) a polyimide resin in an amount of 1-20 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) 70-85% by volume of the entire composition of an inorganic filler. The composition cures into products having flame retardancy and high-temperature reliability even though it is free of bromine compounds and antimony compounds.

Abstract: An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.

Abstract: A high-pressure discharge lamp includes an external tube, and two luminescent tubes which extend in the tube axis direction in such a manner that one tube twists with respect to the other or vice versa and which are close to each other at least at one end of each tube and are more separate in the middle of the tubes than the ends close to each other.

Abstract: An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.

Abstract: In a discharge lamp having a discharge medium sealed in a discharge tube assembly including electrodes for producing a discharge, a nitride layer is formed on a surface of an envelope tube of the discharge tube assembly. The nitride layer is formed by substituting an oxygen component of an oxide constituting the tube wall of the envelope tube with nitrogen, and exhibits a continuous and smooth reduction in nitride content in the direction of depth. This chemically stable nitride layer prevents a reaction between the discharge medium and the tube wall material, and removal or injection of the discharge medium. In addition, since the nitride layer also exhibits a continuous change in thermal expansion coefficient in the direction of depth, the thermal stress is reduced, and cracking, peeling, removal, and the like do not occur.

Abstract: The present invention relates to a chemical luminescence-detecting apparatus that is provided with a plurality of optical detectors different in sensitivity in the vicinity of a photometric cell. A ratio of outputs from the optical detectors based on intensity of luminescence is previously determined and stored. Signal processing can multiply an output of a low sensitivity optical detector by a factor determined by the stored ratio to measure the intensity of luminescence so that a conversion value corresponding to an equivalent output from a high sensitivity optical detector may be obtained when the output from the high sensitivity optical detector has become saturated.

Abstract: An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a specific phenolic resin preferably in admixture with a conventional phenolic resin, especially naphthalene ring-containing phenolic resin, and (C) an inorganic filler shows good flow and cures to products having low modulus of elasticity, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

Abstract: A chromating composition including hexavalent and trivalent chromium, phosphate ions, silica, and a silane coupling agent and with ratios among its components within certain specified ranges produces a protective layer on the surface of zinc coated steel treated with the composition that has an excellent alkali resistance, corrosion resistance, coatability, and welding tolerance.

Abstract: Novel organic silicon compounds are based on a benzene ring having two epoxy radicals and an alkoxysilane radical. They are useful as resin modifiers, adhesive aids for epoxy resins, and silane coupling agents. Inorganic fillers such as silica surface treated with the compounds are useful in encapsulating resin compositions.