Patents by Inventor Takayuki Hirabayashi
Takayuki Hirabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120280885Abstract: The present invention relates to an antenna apparatus and a communication apparatus able to provide an antenna apparatus having wide band characteristics or diversity characteristics. A first antenna element 11, a second antenna element 12, and a divider circuit 13 to which both the antenna elements 11 and 12 are coupled via respectively separate transmission lines 15 and 16 are included. Additionally, a delay process is conducted on one of the transmission lines by modifying the lengths of the transmission line 15 coupling the first antenna element 11 to the divider circuit 13 and the transmission line 16 coupling the second antenna element 12 to the divider circuit 13. By conducting this delay adjustment, the input impedance and/or phase of the first and second antenna elements are adjusted, and wider band characteristics than the antenna characteristics of the first and second antenna elements individually are configured.Type: ApplicationFiled: December 27, 2010Publication date: November 8, 2012Applicant: SONY CORPORATIONInventors: Hiroyuki Arai, Takayuki Hirabayashi, Takashi Enomoto, Sunghyuk Yoon
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Patent number: 7952525Abstract: An antenna device has a substrate of insulation and a conductive flat antenna main body having a predetermined shape. The flat antenna main body is positioned on the substrate. The antenna device also has conductive polarization control elements that are positioned along a transverse line across the flat antenna main body over an insulation region of the substrate. The antenna device further has switching elements each being connected with the flat antenna main body and each of the polarization control elements. The switching elements switch the polarization control elements to select polarization that a flat antenna radiates.Type: GrantFiled: May 31, 2006Date of Patent: May 31, 2011Assignee: Sony CorporationInventor: Takayuki Hirabayashi
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Publication number: 20100265648Abstract: An information processing device, includes: a display means including a receiving surface for receiving data transmitted by wireless communication; and a supporting means including a transmitting surface for transmitting the data by the wireless communication and supporting the display means, wherein the supporting means supports the display means in a position in which the wireless communication can be performed.Type: ApplicationFiled: April 8, 2010Publication date: October 21, 2010Applicant: Sony CorporationInventor: Takayuki Hirabayashi
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Publication number: 20100238074Abstract: An electronic device includes: a circuit substrate; and an antenna element installed on the circuit substrate, wherein the antenna element is installed at a position apart from an end of the circuit substrate by a given offset so that distribution variation of irradiation characteristics of the antenna element within a horizontal surface is reduced both in cases where the electronic device in which the antenna element is installed is set in portrait orientation and in landscape orientation.Type: ApplicationFiled: March 16, 2010Publication date: September 23, 2010Applicant: Sony CorporationInventor: Takayuki Hirabayashi
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Patent number: 7656360Abstract: An antenna device has semi-conductive antenna bodies each having a predetermined length, which are positioned on a dielectric substrate, and control electrodes that are respectively connected with the semi-conductive antenna bodies. Direct-current biased voltage applied across each of the control electrodes is controlled to switch each of the antenna bodies between their insulation state and their conductive state.Type: GrantFiled: June 21, 2006Date of Patent: February 2, 2010Assignee: Sony CorporationInventor: Takayuki Hirabayashi
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Patent number: 7511668Abstract: An antenna apparatus 1 has an antenna substrate 21 composed of a separator 23 and electrolyte layers 24a and 24b disposed on both surfaces of the separator 23; an antenna pattern 22a disposed on the solid electrolyte layer 24a; and an antenna pattern 22b disposed on the solid electrolyte layer 24b. The antenna patterns 22a and 22b are made of an electroconductive plastic. When a DC voltage is applied between the antenna patterns 22a and 22b, ions can be doped to one of the antenna patterns 22a and 22b, whereas ions can be undoped form the other of the antenna patterns 22a and 22b. In other words, one of the antenna patterns 22a and 22b can become a conductor, whereas the other thereof can become an insulator.Type: GrantFiled: December 15, 2004Date of Patent: March 31, 2009Assignee: Sony CorporationInventor: Takayuki Hirabayashi
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Patent number: 7366629Abstract: The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.Type: GrantFiled: April 12, 2005Date of Patent: April 29, 2008Assignee: Sony CorporationInventors: Tatsuya Ogino, Akihiko Okubora, Takayuki Hirabayashi, Takahiko Kosemura, Kuniyuki Hayashi
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Patent number: 7327319Abstract: An antenna apparatus 2 has a separator 23; solid electrolytic layers 24a and 24b disposed on both sides of the separator 23; and linear antennas 22a and 22b disposed on the solid electrolyte layers 24a and 24b, respectively, and made of an electroconductive polymer. When a DC voltage is applied between the antenna patterns 22a and 22b, ions can be doped to one of the antenna patterns 22a and 22b and ions can be undoped from the other. In other words, one of the antenna patterns 22a and 22b can become a conductor, whereas the other can become an insulator.Type: GrantFiled: December 15, 2004Date of Patent: February 5, 2008Assignee: Sony CorporationInventor: Takayuki Hirabayashi
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Patent number: 7187559Abstract: This invention is a circuit board device having a filter element. It has a base board (4), a circuit part (2) mounted on the base board (4), a filter element (5) arranged between the circuit part (2) and the base board (4), and a semiconductor component (3) mounted on the same plate as the circuit part (2) on the base board (4). The semiconductor component (3) is mounted on a thin plate region (17) that is thinner than a thick plate region (16) having its thickness increased by mounting the circuit part (2) on the base board (4). Thus, the thickness of the whole circuit board device is reduced and the filter element (5) is covered with a sufficiently thick dielectric insulating material so as to prevent deterioration in filter characteristic.Type: GrantFiled: December 4, 2002Date of Patent: March 6, 2007Assignee: Sony CorporationInventors: Takayuki Hirabayashi, Akihiko Okubora
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Publication number: 20070035463Abstract: An antenna device has a substrate of insulation and a conductive flat antenna main body having a predetermined shape. The flat antenna main body is positioned on the substrate. The antenna device also has conductive polarization control elements that are positioned along a transverse line across the flat antenna main body over an insulation region of the substrate. The antenna device further has switching elements each being connected with the flat antenna main body and each of the polarization control elements. The switching elements switch the polarization control elements to select polarization that a flat antenna radiates.Type: ApplicationFiled: May 31, 2006Publication date: February 15, 2007Applicant: Sony CorporationInventor: Takayuki Hirabayashi
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Publication number: 20070001924Abstract: An antenna device has semi-conductive antenna bodies each having a predetermined length, which are positioned on a dielectric substrate, and control electrodes that are respectively connected with the semi-conductive antenna bodies. Direct-current biased voltage applied across each of the control electrodes is controlled to switch each of the antenna bodies between their insulation state and their conductive state.Type: ApplicationFiled: June 21, 2006Publication date: January 4, 2007Applicant: Sony CorporationInventor: Takayuki Hirabayashi
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Publication number: 20060208949Abstract: An antenna apparatus 1 has an antenna substrate 21 composed of a separator 23 and electrolyte layers 24a and 24b disposed on both surfaces of the separator 23; an antenna pattern 22a disposed on the solid electrolyte layer 24a; and an antenna pattern 22b disposed on the solid electrolyte layer 24b. The antenna patterns 22a and 22b are made of an electroconductive plastic. When a DC voltage is applied between the antenna patterns 22a and 22b, ions can be doped to one of the antenna patterns 22a and 22b, whereas ions can be undoped form the other of the antenna patterns 22a and 22b. In other words, one of the antenna patterns 22a and 22b can become a conductor, whereas the other thereof can become an insulator.Type: ApplicationFiled: December 15, 2004Publication date: September 21, 2006Applicant: Sony CorporationInventor: Takayuki Hirabayashi
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Patent number: 7064630Abstract: The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.Type: GrantFiled: April 25, 2002Date of Patent: June 20, 2006Assignee: Sony CorporationInventors: Takayuki Hirabayashi, Takahiko Kosemura, Akihiko Okubora, Tatsuya Ogino, Kuniyuki Hayashi
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Publication number: 20060050000Abstract: An antenna apparatus 2 has a separator 23; solid electrolytic layers 24a and 24b disposed on both sides of the separator 23; and linear antennas 22a and 22b disposed on the solid electrolyte layers 24a and 24b, respectively, and made of an electroconductive polymer. When a DC voltage is applied between the antenna patterns 22a and 22b, ions can be doped to one of the antenna patterns 22a and 22b and ions can be undoped from the other. In other words, one of the antenna patterns 22a and 22b can become a conductor, whereas the other can become an insulator.Type: ApplicationFiled: December 15, 2004Publication date: March 9, 2006Applicant: Sony CorporationInventor: Takayuki Hirabayashi
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Patent number: 6975186Abstract: This invention is a filter circuit provided in a radio communication module. First to third conductor patterns (8 to 10) having a length shorter than ?/4 of a passing wavelength ? and electromagnetically coupled with each other are formed as distributed line patterns parallel to each other in a dielectric board (2), and a first capacitor (16) and a second capacitor (17) add parallel capacitance to the first conductor pattern (8) and the second conductor pattern (9) having their distal ends short-circuited. The third conductor pattern (10) has its both end opened. As the first conductor pattern (8) and the second conductor pattern (9) carry out inductive operation and the third conductor pattern (10) is capacitive-coupled with these conductor patterns, resonance is made in a band lower than a frequency band prescribed by the length of the lines.Type: GrantFiled: December 4, 2002Date of Patent: December 13, 2005Assignee: Sony CorporationInventor: Takayuki Hirabayashi
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Patent number: 6972646Abstract: This invention is a filter circuit having a filter element. A filter element (4) is a parallel resonator circuit including a pair of first resonator lines (19a) (19b) formed by a thick film forming technique and a pair of second resonator lines (20a) (20b). As the thickness of the pair of second resonator lines (20a) (20b) is significantly reduced, the impedance ratio between the pair of second resonator lines (20a) (20b) and the pair of first resonator lines (19a) (19b) is increased. Therefore, the length of these pairs of resonator lines (19a) (19b) (20a) (20b) is reduced and miniaturization of the filter element is realized.Type: GrantFiled: April 29, 2005Date of Patent: December 6, 2005Assignee: Sony CorporationInventor: Takayuki Hirabayashi
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Patent number: 6965285Abstract: The present invention provides a small, thin filter circuit showing a desired filter characteristic which is highly accurate, and producible with a high efficiency. The filter circuit includes a pair of dielectric insulating layers 2 and 3, upper and lower, each having a ground pattern 11 (16) formed on the main side thereof, and an inner wiring layer 4 formed between the dielectric insulating layers 2 and 3 and having capacitively coupled resonator conductive patterns 6 and 7 each connected at one end thereof to the ground patterns 11 and 16 via inter-layer connecting vias 12 and open-circuited at the other end.Type: GrantFiled: September 17, 2002Date of Patent: November 15, 2005Assignee: Sony CorporationInventor: Takayuki Hirabayashi
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Publication number: 20050195891Abstract: The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.Type: ApplicationFiled: April 12, 2005Publication date: September 8, 2005Inventors: Tatsuya Ogino, Akihiko Okubora, Takayuki Hirabayashi, Takahiko Kosemura, Kuniyuki Hayashi
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Publication number: 20050190017Abstract: This invention is a filter circuit having a filter element. A filter element (4) is a parallel resonator circuit including a pair of first resonator lines (19a) (19b) formed by a thick film forming technique and a pair of second resonator lines (20a) (20b). As the thickness of the pair of second resonator lines (20a) (20b) is significantly reduced, the impedance ratio between the pair of second resonator lines (20a) (20b) and the pair of first resonator lines (19a) (19b) is increased. Therefore, the length of these pairs of resonator lines (19a) (19b) (20a) (20b) is reduced and miniaturization of the filter element is realized.Type: ApplicationFiled: April 29, 2005Publication date: September 1, 2005Inventor: Takayuki Hirabayashi
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Patent number: 6917259Abstract: A high frequency module substrate device used in a high frequency module apparatus, which is adapted for switching pass-frequency characteristic of band-pass filter by switching and is adapted so that optimum band-pass filter characteristic is obtained in all pass-frequency bands, wherein a thin film capacitor element (18) is constituted between a base substrate (2) in which the uppermost layer is flattened with organic substrate being as core substrates (5), (6) to constitute a buildup formation surface (16) and a high frequency circuit unit (3) of lumped parameter design formed on the buildup formation surface in a laminated manner to carry out switching of load of parallel capacity with respect to a coupler (11) having frequency characteristic of ?/4 which has been caused to undergo distributed parameter design at the base substrate portion side of the thin film capacitor through switch means (4).Type: GrantFiled: September 12, 2002Date of Patent: July 12, 2005Assignee: Sony CorporationInventor: Takayuki Hirabayashi