Abstract: This invention is a filter circuit having a filter element. A filter element (4) is a parallel resonator circuit including a pair of first resonator lines (19a) (19b) formed by a thick film forming technique and a pair of second resonator lines (20a) (20b). As the thickness of the pair of second resonator lines (20a) (20b) is significantly reduced, the impedance ratio between the pair of second resonator lines (20a) (20b) and the pair of first resonator lines (19a) (19b) is increased. Therefore, the length of these pairs of resonator lines (19a) (19b) (20a) (20b) is reduced and miniaturization of the filter element is realized.

Abstract: The object of the present invention is providing cheap, minimized and thin circuit device having desired frequency characteristic. The conductive pattern, which determines the behavior of the circuit device, is formed in inside layer of the dielectric substrate 11 and the earthed conductor is formed in outside layer of the substrate 11. The conductive parts are formed on the area without the earthed conductor as the lattice-shaped pattern. If the area 15 and position of the area 15 become to variable, you have only to change the area and number of the earthed conductor 12 to change the distribution of the electromagnetic field, the circuit device can get the desired frequency characteristic.

Abstract: The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.

Abstract: This invention is a filter circuit provided in a radio communication module. First to third conductor patterns (8 to 10) having a length shorter than ?/4 of a passing wavelength ? and electromagnetically coupled with each other are formed as distributed line patterns parallel to each other in a dielectric board (2), and a first capacitor (16) and a second capacitor (17) add parallel capacitance to the first conductor pattern (8) and the second conductor pattern (9) having their distal ends short-circuited. The third conductor pattern (10) has its both end opened. As the first conductor pattern (8) and the second conductor pattern (9) carry out inductive operation and the third conductor pattern (10) is capacitive-coupled with these conductor patterns, resonance is made in a band lower than a frequency band prescribed by the length of the lines.

Abstract: The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate (2) which has multiple pattern wiring layers (6a) (6b) (9a) (9b) and dielectric insulating layers (5) (8) (11) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer (4) formed on the buildup surface, which has an inductor (20) formed therein via an insulating layer (19) formed on the buildup surface. The base substrate (2) is provided with a region (30) where the pattern wiring layers (6a) (6b) (9a) (9b) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor (20) of the high-frequency element layer (4) is formed directly above the region (30).

Abstract: The present invention is an antenna apparatus attached to an electronic device and includes an antenna section (11) having an antenna element (18) provided with two or more power supply points (19) and two or more earth points (20); and an earth point switch (21) which is provided correspondingly to each earth point (20) and connects or disconnects the earth point (20) from a ground. Selectively turning on or off the earth point switch (21) selects the earth point to adjust the resonance frequency.

Abstract: This invention is a filter circuit having a filter element. A filter element (4) is a parallel resonator circuit including a pair of first resonator lines (19a) (19b) formed by a thick film forming technique and a pair of second resonator lines (20a) (20b). As the thickness of the pair of second resonator lines (20a) (20b) is significantly reduced, the impedance ratio between the pair of second resonator lines (20a) (20b) and the pair of first resonator lines (19a) (19b) is increased. Therefore, the length of these pairs of resonator lines (19a) (19b) (20a) (20b) is reduced and miniaturization of the filter element is realized.

Abstract: This invention is a circuit board device having a filter element. It has a base board (4), a circuit part (2) mounted on the base board (4), a filter element (5) arranged between the circuit part (2) and the base board (4), and a semiconductor component (3) mounted on the same plate as the circuit part (2) on the base board (4). The semiconductor component (3) is mounted on a thin plate region (17) that is thinner than a thick plate region (16) having its thickness increased by mounting the circuit part (2) on the base board (4). Thus, the thickness of the whole circuit board device is reduced and the filter element (5) is covered with a sufficiently thick dielectric insulating material so as to prevent deterioration in filter characteristic.

Abstract: A high frequency module substrate device used in a high frequency module apparatus, which is adapted for switching pass-frequency characteristic of band-pass filter by switching and is adapted so that optimum band-pass filter characteristic is obtained in all pass-frequency bands, wherein a thin film capacitor element (18) is constituted between a base substrate (2) in which the uppermost layer is flattened with organic substrate being as core substrates (5), (6) to constitute a buildup formation surface (16) and a high frequency circuit unit (3) of lumped parameter design formed on the buildup formation surface in a laminated manner to carry out switching of load of parallel capacity with respect to a coupler (11) having frequency characteristic of &lgr;/4 which has been caused to undergo distributed parameter design at the base substrate portion side of the thin film capacitor through switch means (4).

Abstract: The present invention relates to a high frequency module board device having a high frequency transmitting and receiving circuit for modulating and demodulating a high frequency signal. The high frequency module board device comprises a base board (2) whose main surface is formed as a build-up surface (2a) and a high frequency circuit part (3) formed on the build-up surface of the base board (2) and having passive elements formed. The base board (2) has an area (29) in which wiring is not formed in a lower layer from a fourth wiring layer (8b). The high frequency circuit part (3) has an upper electrode part (36) and a lower electrode part (35) in positions corresponding to the area (29) in which the wiring is not formed. Thus, since a capacitance (18) is provided just above the area (29) in which the wiring is not formed, a parasitic capacity that the capacitance (18) receives from ground patterns (14) is reduced. Accordingly, the characteristics of the capacitance (18) can be improved.

Abstract: The present invention is an antenna apparatus attached to an electronic device and includes an antenna section (11) having an antenna element (18) provided with two or more power supply points (19) and two or more earth points (20); and an earth point switch (21) which is provided correspondingly to each earth point (20) and connects or disconnects the earth point (20) from a ground. Selectively turning on or off the earth point switch (21) selects the earth point to adjust the resonance frequency.

Abstract: A distributed constant filter capable of being connected to a wiring pattern and the like while simultaneously achieving miniaturization, stable performance and assurance of the reliability and a manufacturing method of the distributed constant filter are provided. In a triplate structure band-pass filter, in place of a high impedance pattern which is, in the prior art, formed on the same face as that of a low impedance pattern in an inner layer, conductor patterns extending in the thickness direction of a stacked substrate are formed. Each of the conductor patterns functions as a via pattern connecting the low impedance pattern in the inner layer and a wiring pattern in the surface layer and also functions as a high impedance line. As long as the filtering characteristic is the same, the line overall length (distance in a plane) of the conductor patterns can be made shorter than the conventional line overall length and the area occupied by the conductor patterns can be reduced.

Abstract: The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.

Abstract: The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate (2) which has multiple pattern wiring layers (6a) (6b) (9a) (9b) and dielectric insulating layers (5) (8) (11) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer (4) formed on the buildup surface, which has an inductor (20) formed therein via an insulating layer (19) formed on the buildup surface. The base substrate (2) is provided with a region (30) where the pattern wiring layers (6a) (6b) (9a) (9b) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor (20) of the high-frequency element layer (4) is formed directly above the region (30).

Abstract: The present invention provides a small, thin filter circuit showing a desired filter characteristic which is highly accurate, and producible with a high efficiency. The filter circuit includes a pair of dielectric insulating layers 2 and 3, upper and lower, each having a ground pattern 11 (16) formed on the main side thereof, and an inner wiring layer 4 formed between the dielectric insulating layers 2 and 3 and having capacitively coupled resonator conductive patterns 6 and 7 each connected at one end thereof to the ground patterns 11 and 16 via inter-layer connecting vias 12 and open-circuited at the other end.

Abstract: Realizing a small-sized antenna device whose protruding length from a main apparatus is made minimum when installed and adding radio communication function thereto and has polarization diversity characteristics. A module main body 5 has a circuit board 22 built therein, an antenna device 1, and a connection terminal 23, and adds radio communication function to a main apparatus 2 when inserted to a slot 3 thereof. The antenna device 1 is mounted to the module main body 5 on a second side 5b located on the opposite.side of a first side 5a which has formed thereon the connection terminal 23. The antenna substrate 8 which has at least an inversed F type antenna pattern and a meander type antenna pattern formed on the main surface 8a thereof by printed wiring is supported perpendicular to the insertion direction toward the main apparatus 2.

Abstract: A circuit device board having a desired characteristic is provided by bonding dielectric substrates. A printed board 11 carrying patterns 11a and 11b incorporating a resonator is joined by a prepreg 13 to a printed board 12 carrying patterns 12a and 12b, which are substantially identical to the patterns 11a and 11b, so that the patterns come opposite to each other. As a grounding conductor is provided on the outer side of each of the printed boards 11 and 12, a band-pass filter having the three-plate structure is completed. The patterns 11a and 12a are connected to each other for determining the signal input while the patterns 11b and 12b are connected to each other for determining the signal output. Accordingly, the frequency response can be obtained at a desired level regardless of the thickness of the prepreg 13.

Abstract: The invention includes a filter element comprising a dielectric substrate and a strip conductive pattern formed on the dielectric substrate. The dielectric substrate has cavities with apertures on the surface of the dielectric substrate. The strip conductive pattern is formed over the apertures of the cavities to serve as inductance. The strip conductive pattern has an approximately uniform line width that effectively improves the production yield and reliability of the filter element.

Abstract: A distributed constant filter capable of being connected to a wiring pattern and the like while simultaneously achieving miniaturization, stable performance and assurance of the reliability and a manufacturing method of the distributed constant filter are provided. In a triplate structure band-pass filter, in place of a high impedance pattern which is, in the prior art, formed on the same face as that of a low impedance pattern in an inner layer, conductor patterns extending in the thickness direction of a stacked substrate are formed. Each of the conductor patterns functions as a via pattern connecting the low impedance pattern in the inner layer and a wiring pattern in the surface layer and also functions as a high impedance line. As long as the filtering characteristic is the same, the line overall length (distance in a plane) of the conductor patterns can be made shorter than the conventional line overall length and the area occupied by the conductor patterns can be reduced.

Abstract: Realizing a small-sized antenna device whose protruding length from a main apparatus is made minimum when installed and adding radio communication function thereto and has polarization diversity characteristics. A module main body 5 has a circuit board 22 built therein, an antenna device 1 and a connection terminal 23, and adds radio communication function to a main apparatus 2 when inserted to a slot 3 thereof. The antenna device 1 is mounted to the module main body 5 on a second side 5b located on the opposite side of a first side 5a which has formed thereon the connection terminal 23. The antenna substrate 8 which has at least an inversed F type antenna pattern and a meander type antenna pattern formed on the main surface 8a thereof by printed wiring is supported perpendicular to the insertion direction toward the main apparatus 2.