Abstract: The present disclosure provides an optical lens, which includes a first lens member, a second lens member and a first adhesive. The first lens member includes at least one first lens. The second lens member includes a second lens barrel and at least one second lens mounted in the second lens barrel. The at least one second lens and the at least one first lens together forms an imaging optical system. The second lens member has a second optical region and a second structural region surrounding the second optical region. The second structural region has a second top surface and the second top surface has a groove. The first adhesive locates in a first gap between the first lens member and the second lens member, and the first adhesive is accommodated in the groove. The first adhesive is adapted to flow in the groove when uncured.

Abstract: Disclosed are a lens and a camera module with lens. The lens includes a first lens unit, a second lens unit and an adhesive structure, the first lens unit includes a glass lens and an opaque component, the opaque component is covered on an outer periphery of the glass lens, the first lens unit is arranged at a front end of the second lens unit in an optical axis direction, the adhesive structure includes an adhesive layer and an adhesive fixing unit, the glass lens is adhered to the second lens unit by the adhesive layer, and the adhesive fixing unit is located between the first lens unit and the second lens unit, so that a bonding strength between the glass lens and the second lens unit is enhanced by the adhesive fixing unit.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the

Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Abstract: Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly.

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: Provided is an adjustable optical assembly (900), including a bearing base (921), a driving mechanism (910), a zoom optical assembly (200), and a compensating optical assembly (300). The driving mechanism (910) includes: a bracket (911) having a bottom end connected to the bearing base (921) and a top end having a top groove (911a) open upwards; guide rods (912, 913) supported on the top groove (911a), the guide rods (912, 913) coinciding with the direction of optical axes of the zoom optical assembly (200) and the compensating optical assembly (300); a zoom bearer (914); a compensating bearer (915); a zoom driving assembly; and a compensating driving assembly. The zoom bearer (914) and the compensating bearer (915) are both mounted on the guide rods (912, 913) and slidable along the guide rods (912, 913). Also provided are a corresponding periscopic optical zoom module and an assembly method therefor.

Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the

Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board.

Abstract: The present application provides a camera module array, comprising at least two camera modules, wherein at least one of the camera modules has a free-form lens sheet, and the free-form lens sheet performs active alignment according to an actual imaging result received by a photosensitive chip, so that a difference between an actual reference direction of the free-form lens sheet and a reference direction determined by an optical design is not greater than 0.05 degrees. The present application further provides a corresponding assembly method for camera module array. In the present application, a TTL of the camera modules can be reduced by means of the free-form lens sheet so as to, for example, make a TTL of a wide-angle module equal or approximately equal to a TTL of a telephoto module, so that a dual-camera module composed of the wide-angle module and the telephoto module is easily mounted in a terminal device such as a mobile phone.

Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.

Abstract: Disclosed is a photosensitive module (21), adapted to a camera module, comprising a photosensitive element (211), a light transmitting element (212) and an isolation adhesive layer (213), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the