Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Abstract: The present application provides an optical zoom camera module, including: at least two camera module components and glue material; each of the at least two camera module components has at least one lens group, and each lens group includes at least one lens, all of the lens groups of the at least two camera module components together constitute an imagable optical system, and wherein at least two of the lens groups are a movable lens group, and the at least two movable lens groups are respectively fixed with different motor carriers, so as to move separately under the driving of a motor; and the cured glue material fixes and supports the at least two camera module components, so that relative positions of the at least two camera modules are maintained at relative positions determined by an active alignment. The application also provides a corresponding method for assembling the optical zoom camera module.

Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

Abstract: Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

Abstract: A molded circuit board (10) of a camera module (100), manufacturing equipment (200) and a manufacturing method for the molded circuit board. The manufacturing equipment (200) comprises a forming mold (210), which comprises a first mold (211) and a second mold (212) that can be opened or closed, where the first mold (211) and the second mold (212) form a forming cavity (213) when closed. Also, a light window forming block (214) and a base forming guide groove (215) located at the periphery of the light window forming block (214) are provided within the forming cavity (213).

Abstract: The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

Abstract: The present application provides an optical lens, comprising: a first lens component, a second lens component and a first glue material. A first lens sheet group of the first lens component and a second lens sheet group of the second lens component together constitutes an imageable optical system, wherein a second lens barrel of the second lens component has an outer top surface and an inner top surface, and the second lens sheet group bears against the inner top surface. The outer top surface comprises a glue spreading surface suitable for arranging the first glue material and an extension surface formed by extending from the glue spreading surface to a central axis of the second lens barrel, there is a first thickness from the glue spreading surface to the inner top surface, there is a second thickness from the extension surface to the inner top surface, and the first thickness is greater than the second thickness.

Abstract: A lens group assembly includes a lens barrel and a plurality of lenses. The lenses are embedded in the lens barrel to assemble the lens group, and there is an adhesive material between at least two of the lenses and/or between at least one of the lenses and the lens barrel to reinforce the structural strength of the assembled lens group. A corresponding optical lens, a camera module and a lens group assembling method are also included. Assembling accuracy and assembling stability of the high-sensitivity multi-lens optical system is improved by increasing the adhesion between the lenses. Variation of the optical lens is reduced based on an active calibration process. Adhesive material that might otherwise overflow is accommodated. Defects caused by the assembly of the optical lens are reduced based on the active calibration process, especially the field curvature and peak variation.

Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.

Abstract: A semiconductor module for an image-sensing device is disclosed. The semiconductor module may include: a printed circuit board (PCB), a photosensitive member, at least an electric component and a molding component. The PCB may have a first surface, and the photosensitive member and the electric component are positioned on the first surface of the PCB. The molding component may be formed along with the first surface of the PCB, and separate the photosensitive member and the electric component from the ambient environment. The molding component may be in direct contact with the photosensitive member, the electric component and the first surface of the PCB. At least a portion of the molding component may be transparent to allow at last 50% of the incident light to pass through the molding component to reach the photosensitive member.

Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.

Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.

Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

Abstract: Provided are a transparent fluorescent sialon ceramic having fluorescence and optical transparency; and a method of producing the same. Such a transparent fluorescent sialon ceramic includes a sialon phosphor which contains a matrix formed of a silicon nitride compound represented by the formula Mx(Si,Al)y(N,O)z (here, M represents at least one selected from the group consisting of Li, alkaline earth metals, and rare earth metals, 0?x/z<3, and 0<y/z<1) and a luminescent center element.

Abstract: A sound signal processing device performs sound field control by controlling each virtual sound source position of a primary sound source and an ambient sound source that are separated sound signals obtained from an input sound source, in accordance with changes in velocity and traveling direction of an automobile. The sound signal processing device includes: a velocity information acquisition unit that acquires velocity information about a mobile apparatus; a steering information acquisition unit that acquires steering information about the mobile apparatus; and a sound control unit that controls output sounds from speakers disposed at a plurality of different positions in the mobile apparatus. The sound control unit performs sound field control by controlling the respective virtual sound source positions of the primary sound source and the ambient sound source that are separated sound signals obtained from the input sound source, in accordance with the velocity information and the steering information.

Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

Abstract: Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.

Abstract: The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.

Abstract: Provided are a transparent fluorescent sialon ceramic having fluorescence and optical transparency; and a method of producing the same. Such a transparent fluorescent sialon ceramic includes a sialon phosphor which contains a matrix formed of a silicon nitride compound represented by the formula Mx(Si,Al)y(N,O)z (here, M represents at least one selected from the group consisting of Li, alkaline earth metals, and rare earth metals, 0?x/z<3, and 0<y/z<1) and a luminescent center element.