Abstract: For inspection of a pattern such as a semiconductor device, it is useful to selectively detect a defect on the specific pattern in order to estimate the cause of the occurrence of the defect. An object of the invention is to provide a charged particle beam apparatus capable of setting, on the basis of the shape of the pattern on a sample, a region to be inspected. The invention is characterized in that the contour of the pattern on the sample is extracted using a template image obtained on the basis of an image of the sample, the region to be inspected is set on the basis of the contour of the pattern, a defect candidate is detected by comparing the image to be inspected with a comparative image, and the sample is inspected using a positional relationship between the region to be inspected and the defect candidate included in the region to be inspected.

Abstract: In imaging a sample using an electron microscope, in order to reduce a time for focusing, a scanning range of a Z coordinate is reduced to complete focusing by obtaining SEM images such that: for a first predetermined number of portions, focal positions of an electron beam in obtaining each SEM image are moved in a predetermined range; then, a curved surface shape of the surface of the sample is estimated by using information relating to the focal positions of the electron beam in the first predetermined number of portions; after the images are taken, the range in which the focal positions of the electron beam are moved for scanning the electron beam on the surface of the sample is made to be narrower than the predetermined range by using the curved surface information estimated, thereby performing scanning to take the images of the sample.

Abstract: An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction.

Abstract: A candidate-defect classification method includes the steps of acquiring a scanning electron microscope (SEM) image of a candidate defect detected in an inspection from a sample including a pattern formed thereon, the inspection being preliminarily performed by an other inspection device; computing a feature value of the candidate defect by processing the SEM image; executing defect classification of the candidate defect as any one of a pattern shape defect and an other defect by using the computed feature value; acquiring positional information contained in design data of the pattern with respect to a candidate defect classified as the pattern shape defect; and extracting a systematic defect from among candidate defects classified as the pattern shape defects by performing a comparison of the positional information contained in the design data of the acquired candidate defect to positional information of a portion that has a high probability of causing a pattern formation failure and that has been obtained f

Abstract: In a defect classification system using plural types of observation devices that acquire images having different characteristics, classification performance and operability of the system are improved. The a defect classification system includes plural imaging part that acquire images of an inspection target, a defect classification device that classifies the acquired images acquired by the plural imaging part, and a communication part that transmits data between the plural imaging devices and the defect classification device, in which the defect classification device includes an image storage part that stores the acquired image data acquired by the plural imaging part, an information storage part that stores associated information about the input image data, and a part for changing a processing method or a display method depending on the associated information.

Abstract: A defect observation device supplied with a taught defect and an ideal output obtained by conducting image processing on the taught defect as its input and capable of conducting work of setting image processing parameters required to classify defect kinds easily and fast is provided.

Abstract: Provided is a charged particle beam device that prevents the increase in processing trouble caused by deterioration in the reviewing performance (e.g., overlooking of defects) by detecting an operation abnormality affecting the performance of the device or a possibility of such an abnormality in the middle of a processing sequence of a sample and giving a feedback in real time. In each processing step of the charged particle beam device, monitoring items representing the operating status of the device (control status of the electron beam, an offset amount at the time of wafer positioning, a defect coordinate error offset amount, etc.) are monitored during the processing sequence of a sample and stored as history information. In the middle of the processing sequence, a comparative judgment between the value of each monitoring item and the past history information corresponding to the monitoring item is made according to preset judgment criteria.

Abstract: Disclosed is a method of inspecting an object to be inspected in a semiconductor manufacturing process, for resolving the problem to increase defect detection sensitivity. An image capture means is used to image capture a designated area of the object to be inspected; a defect is detected in the captured image; a circuit pattern is recognized from the captured image; a characteristic value is computed, relating to an image tone and shape, from the detected defect; a characteristic value is computed, relating to the image tone and shape, from the recognized circuit pattern; either a specified defect or circuit pattern is filtered and extracted from the detected defect and the recognized circuit pattern; a mapping characteristic value is determined from the characteristic value of either the filtered and extracted specified defect or circuit pattern; and the distribution of the determined characteristic values is displayed onscreen in a map format.

Abstract: A first object is to use both ADC (automatic defect classification) and MDC (manual defect classification) and reduce the amount of MDC operation. A second object is to prevent a DOI (defect of interest) from being missed. The first object is achieved by displaying judgment information on a screen. The judgment information is necessary when part of the classification is performed by ADC and part of the classification is performed by MDC and used to judge which classification is used, ADC or MDC. In the display operation, ADC classification results and MDC classification results are also displayed in the form of matrix. Further, a missed DOI rate is calculated for each classification threshold used in the defect classification and displayed on the screen.

Abstract: In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.

Abstract: Generated is a template edition screen on which to display components of a report as modules by OSD by use of icons. One of the icons is selected by use of a pointing device including a mouse. By a drag-and-drop operation, the icon is placed at a desired position in an output format setup area formed in the same screen. The icon is set in a desired size by another drag-and-drop operation. Details of a module shown by the icon thus placed can be set up in a detail setup area in the same screen. Information on a format thus set up is retained as a template through a retention function, and accordingly can be used easily by simply calling the information. Moreover, the retained template can be edited as well. This makes it possible not only to create a new template, but also to modify an existing template.

Abstract: A semiconductor device includes a circuit portion including at least one real feature, and a plurality of dummy feature groups each including a plurality of dummy features spaced apart from each other by a first distance. The plurality of dummy feature groups are spaced apart from each other by a second distance larger than the first distance, and the circuit portion and the plurality of dummy feature groups are spaced apart from each other by the second distance.

Abstract: It is an object of the present invention to provide a technique capable of accurately inspecting a circuit pattern in which the contrast of an observation image is not clear, like a circuit pattern having a multilayer structure. A pattern inspection method according to the present invention divides a circuit pattern using the brightness of a reflection electron image and associates the region in the reflection electron image belonging to each division with the region in a secondary electron image (see FIG. 3).

Abstract: An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction.

Abstract: Provided is a technique for a wafer inspection conducted by simple operation, which is useful even when the inspection covers a variety of items and the inspection items are changed frequently with time like in a start-up period of a semi-conductor process. According to the technique, inspection images are collected, and then a template is prepared from the inspection images. A plurality of regions are defined on the template, and inspection methods and output indexes are registered in correspondence with the respective regions. In the inspection, by reference to the template images corresponding to the derived inspection images, the inspection is conducted based on the inspection information registered therein and the quantitative output levels are calculated.

Abstract: A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified.

Abstract: Disclosed is a technique wherein an object that requires adjustment in order to increase the reliability of automatic classification can be easily identified. A device (140) for adjusting classification classifies defects into a first class group according to the feature amount of the defects that are obtained from image data obtained from an electron microscope (110), and classifies the defects into a second class group according to the feature amount of the defects classified into the first class group. And, the device (140) for adjusting the classification calculates classification performance by comparing the defects that have been classified into the second class group, and outputs the calculated classification performance in a predetermined display format to an output unit (180).

Abstract: An inspection method and an inspection tool are capable of detecting a defect on a specimen. More particularly, the examples relate to an inspection method and an inspection tool for easily setting an inspection condition to be used in a defect inspection of an inspected pattern such as a semiconductor wafer, a liquid crystal display, or a photomask.

Abstract: A surface observation apparatus is achieved, which enables even a beginner to easily select an optimal evaluation indicator for each of various patterns to be evaluated without a trial and error approach. A plurality of images to be evaluated are input from an image processing unit (114) to an evaluation image input unit (113a) (in step 901). The input images to be evaluated are displayed on a display (115). A user rearranges the images in accordance with an evaluation criterion of the user while referencing the display (115), and defines an evaluation criterion (in step 902). Evaluation values are calculated for the input images (to be evaluated) using a plurality of evaluation indicators (in step 903). The evaluation values for each of the evaluation indicators are compared with the evaluation criterion defined by the user, and correlation coefficients are then calculated (in step 904).

Abstract: A review apparatus for reviewing a specimen by moving the specimen to pre-calculated coordinate includes: a function to measure a deviation amount between the pre-calculated coordinates and coordinates of an actual position of the specimen; a function to optimize a coordinate correcting expression to minimize the measured deviation amount; and a function to determine that the deviation amounts have converged. When the deviation amounts have converged, the measurement for the coordinate-correcting-expression optimization is terminated, and a field of view necessary for the specimen to be within the field of view is set according to a convergence value of the calculated deviation amount.