Patents by Inventor Takeo Nakagawa
Takeo Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080318746Abstract: An exemplary machine tool (20) includes a base (31) and a plurality of components (33, 34, 35). The movable components are made of metal or metallic alloy with density in a range from about 1.7×103 kg/m3 to about 3.3×103 kg/m3. The movable components have relatively small weight. Therefore, the machine tool can remain stable, when machining, although the base is small and light because of the light movable components. A precision of the machine tool is not decreased, and miniaturizing the machine tool is practicable.Type: ApplicationFiled: November 23, 2007Publication date: December 25, 2008Applicant: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.Inventors: TAKEO NAKAGAWA, JUN-QI LI, QING LIU
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Patent number: 7398603Abstract: An exemplary distance measuring probe (100) includes a tube track (12), a tip extension (16), a pair of hollow tubes (14), a pair of air discharge systems (115), a linear measuring scale (18), and a displacement sensor (19). The tip extension is configured to touch a surface of an object (50). The linear measuring scale and the displacement sensor are respectively fixed relative to one of the tube track and the tip extension. The hollow tubes contain a flux of air, and are configured to cooperatively push the tip extension to move. Each air discharge system ejects part of air in the corresponding hollow tube out of the hollow tube. The linear measuring scale displays values of displacements of the tip extension. The displacement sensor detects and reads the displacement values displayed by the linear measuring scale.Type: GrantFiled: December 15, 2006Date of Patent: July 15, 2008Assignees: Hon Hai Precision Industry Co., Ltd., FINE TECH CorporationInventors: Qing Liu, Jun-Qi Li, Takeo Nakagawa
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Publication number: 20080072442Abstract: An exemplary contour measuring device (100) includes a pair of guide rails (13), a movable fixture (14), a first probe (15), a second probe (16), and an error correcting unit (17). The movable fixture is movably disposed on the guide rails. The first probe is configured for measuring an object along a contour measuring direction and obtaining a first measured contour value from the object to be measured. The second probe is configured for measuring a standard object whose contour is known along the contour measuring direction and obtaining a second measured contour value from the standard object. The error correcting unit is configured for compensating the first measured contour value according to the second measured contour value.Type: ApplicationFiled: August 23, 2007Publication date: March 27, 2008Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD., FINE TECH CorporationInventors: QING LIU, JUN-QI LI, TAKEO NAKAGAWA
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Publication number: 20070137058Abstract: An exemplary distance measuring probe (100) includes a tube track (12), a tip extension (16), a pair of hollow tubes (14), a pair of air discharge systems (115), a linear measuring scale (18), and a displacement sensor (19). The tip extension is configured to touch a surface of an object (50). The linear measuring scale and the displacement sensor are respectively fixed relative to one of the tube track and the tip extension. The hollow tubes contain a flux of air, and are configured to cooperatively push the tip extension to move. Each air discharge system ejects part of air in the corresponding hollow tube out of the hollow tube. The linear measuring scale displays values of displacements of the tip extension. The displacement sensor detects and reads the displacement values displayed by the linear measuring scale.Type: ApplicationFiled: December 15, 2006Publication date: June 21, 2007Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FINE TECH CORPORATIONInventors: QING LIU, JUN-QI LI, TAKEO NAKAGAWA
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Publication number: 20060055085Abstract: This invention is to offer the metal mold for injection molding and the metal mold for diecast molding with an excellent temperature controlling property that can be manufactured with lower manufacturing cost and shorter manufacturing time. The purpose of this invention is to offer the method to use the metal mold for injection molding capable of producing accurate products. The metal mold 1 for injection molding has the fixed metal mold part 2 configured by processing, layering and bonding a plurality of metal plates 10, the movable metal mold part 4 configured by processing, layering and bonding a plurality of metal plates 13, and the temperature controlling passages 3 and 5 formed by processing, layering and bonding a plurality of metal plates 10 and 13 in at least, one of the fixed metal mold part 2 and the movable metal mold part 4.Type: ApplicationFiled: March 14, 2005Publication date: March 16, 2006Applicants: Tokyo University of Agriculture and Technology, Sekisou Forming Tool LaboratoriesInventors: Takeo Nakagawa, Hisao Yamazaki, Hideo Yoshimura, Masanori Kunieda, Akira Sato, Masayuki Suzuki
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Publication number: 20060006559Abstract: A light guide plate mold (100) includes a surface (103) and a plurality of micro structures formed at the surface according to a predetermined pattern. Some micro structures have angular cross-sections and other micro structures have arcuate cross-sections. The light guide plate mold can manufacture light guide plates with simple structures, and the light guide plates can obtain emission light beams with good uniformity and brightness. Therefore, the manufactured light guide plates can be advantageously applied in back light systems of liquid crystal display devices. Furthermore, a method for manufacturing the light guide plate mold is also provided, the method has a relatively low cost, and can be executed with high speed and precision.Type: ApplicationFiled: June 28, 2005Publication date: January 12, 2006Applicant: HON HAI Precision Industry CO., LTD.Inventors: Takeo Nakagawa, Fumio Nakamura, Norio Goto, Jun-Qi Li
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Publication number: 20060000101Abstract: A probe (30) for use in surface measurement equipment such as a profilometer. The probe includes a holder (32), a head member (35), and a connecting member (37). The connecting member has a first end and a second end. The holder has a first recess (33) at one end thereof for receiving the first end of the connecting member. The head member has a second recess spanning from an outer surface to a central portion thereof for receiving the second end of the connecting member. The first end of the connecting member has a similar shape to the first recess of the holder and is fixed in first recess by adhering, welding or doweling. The second end of the connecting member has a similar shape to the second recess of the head member and is fixed in the second recess by adhering or welding.Type: ApplicationFiled: June 29, 2005Publication date: January 5, 2006Applicant: HON HAI Precision Industry CO., LTD.Inventors: Takeo Nakagawa, Qing Liu, De-Cheng Chen
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Publication number: 20060002138Abstract: A light guide plate (100) includes an incidence surface (101), an emission surface (102) and a reflection surface (103) opposite to the emission surface. Numerous recesses are formed on at least one of the three surfaces according to a predetermined pattern. Some recesses have angular cross-sections and can determine a direction of emission of light beams, and the other recesses have arcuate cross-sections and can determine the degree of uniformity of the emitted light beams. Therefore, the light beams can be emitted from a predetermined region of the light guide plate, and this ensures the emission light beams with improved uniformity and brightness. Thus the light guide plate can be advantageously applied in back light systems of liquid crystal display devices. A method for manufacturing the light guide plate is also provided.Type: ApplicationFiled: June 28, 2005Publication date: January 5, 2006Applicant: HON HAI Precision Industry CO., LTD.Inventors: Takeo Nakagawa, Fumio Nakamura, Norio Goto, Jun-Qi Li
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Publication number: 20050286009Abstract: A glass substrate for packing liquid crystals includes a mechanically treated surface covered by a transparent coating. This ensures that the glass substrate has a high transparence. A method for manufacturing such a glass substrate includes the steps of: (a) providing an original glass substrate including a mechanically treated surface having a plurality of dents; and (b) forming a transparent coating on the surface to fill the dents. The steps can be completed in a relatively short time, and thus the manufacturing cost is reduced. An LCD device using such glass substrates includes a plurality of liquid crystals and two glass substrates packing the liquid crystals therebetween.Type: ApplicationFiled: June 1, 2005Publication date: December 29, 2005Applicant: HON HAI Precision Industry CO., LTD.Inventors: Takeo Nakagawa, Masayuki Muranaka
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Patent number: 6589459Abstract: A lead-free super-highly conductive plastic is formed of a conductive resin composition which includes a thermoplastic resin, a lead-free solder that melts during plasticization, and metal powder or a mixture of metal powder and metal short fibers that promotes the fine dispersion of particles of the lead-free solder within the thermoplastic resin. In the lead-free super-highly conductive plastic, since particles of the lead-free solder are connected with each other via solder melted within the plastic, the particles of the lead-free solder are mutually joined, so that high conductivity is attained.Type: GrantFiled: September 17, 2001Date of Patent: July 8, 2003Assignee: Japan Science and Technology CorporationInventors: Takeo Nakagawa, Hiroyuki Noguchi
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Publication number: 20020043398Abstract: A lead-free super-highly conductive plastic is formed of a conductive resin composition which includes a thermoplastic resin, a lead-free solder that melts during plasticization, and metal powder or a mixture of metal powder and metal short fibers that promotes the fine dispersion of particles of the lead-free solder within the thermoplastic resin. In the lead-free super-highly conductive plastic, since particles of the lead-free solder are connected with each other via solder melted within the plastic, the particles of the lead-free solder are mutually joined, so that high conductivity is attained.Type: ApplicationFiled: September 17, 2001Publication date: April 18, 2002Inventors: Takeo Nakagawa, Hiroyuki Noguchi
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Patent number: 6342680Abstract: A lead-free super-highly conductive plastic is formed of a conductive resin composition which includes a thermoplastic resin, a lead-free solder that melts during plasticization, and metal powder or a mixture of metal powder and metal short fibers that promotes the fine dispersion of particles of the lead-free solder within the thermoplastic resin. In the lead-free super-highly conductive plastic, since particles of the lead-free solder are connected with each other via solder melted within the plastic, the particles of the lead-free solder are mutually joined, so that high conductivity is attained.Type: GrantFiled: February 20, 1998Date of Patent: January 29, 2002Assignee: Japan Science and Technology CorporationInventors: Takeo Nakagawa, Hiroyuki Noguchi
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Patent number: 6224469Abstract: A tool is constructed by a plurality of diamond columns 22 arranged so as to protrude from a working surface and a conductive bond member 24 for integrally fixing the diamond columns. The conductive bond member is electrolytically dressed while a conductive liquid is supplied between the bond member and an electrode 4 which faces the bond member at a distance, thereby enabling the diamond columns 22 to protrude. By this construction, the tool can be applied to both an efficient rough cutting for a ductile material and a precise grinding for a brittle material without detaching or re-attaching a workpiece, the relatively soft ductile material such as aluminum, copper, or plastic can be worked with a deep cut, the brittle material such as monocrystal silicon, glass, or tungsten carbide can be efficiently and stably ground, so that a fluctuation of a working position due to wear can be compensated.Type: GrantFiled: February 5, 1999Date of Patent: May 1, 2001Assignee: The Institute of Physical and Chemical ResearchInventors: Hitoshi Ohmori, Sei Moriyasu, Takeo Nakagawa
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Patent number: 6180050Abstract: The purpose of the invention is to provide a solid model creation apparatus that is small in size and inexpensive. A multiplicity of blue LEDs are prepared, optical fibers are connected thereto, and GRIN lenses are arranged at the ends of the tips of the respective optical fibers to constitute an exposing head 23. The exposing head 23 forms images of the end faces of the respective optical fibers in a photocurable resin exposure region 24 as light spots 55. The diameter of a light spot 55 is, for example, 0.5 mm, but the size of a pixel 71 within the exposure region 24 is much smaller; for example, 62.5&mgr;. The multiplicity of optical fibers at the exposing head 23 are arrayed in a matrix such that they are displaced in staggered fashion so that respective light spots 55 are lined up at the pitch 62.5&mgr; of the pixels 71 in the primary scan (Y-axis) direction.Type: GrantFiled: July 9, 1999Date of Patent: January 30, 2001Assignees: The Institute of Physical and Chemical Research, NTT Data CorporationInventors: Mahito Arai, Toshiki Niino, Takeo Nakagawa
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Patent number: 6126523Abstract: A photo-reactive grinding wheel 1 is irradiated with light by a light irradiation device 2 which is provided opposite to the grinding wheel, to bring about a chemical reaction and change in property, and dissolved/removed by a solution 4. Simultaneously, a workpiece 5 is processed by the photo-reactive grinding wheel 1. Thus, processing can be performed without causing clogging in the grinding wheel of a resin bond containing fine abrasive grains, high-grade surface roughness can be realized, and processing efficiency is relatively high. The controllability of the dressing is excellent, automation of dressing and in-process dressing can also be realized, a system which contains no metal ion in the whole processing can be designed, an expensive device is not required, and handling is easy.Type: GrantFiled: August 9, 1999Date of Patent: October 3, 2000Assignee: The Institute of Physical and Chemical ResearchInventors: Sei Moriyasu, Hitoshi Ohmori, Takeo Nakagawa, Kazuyuki Horie, Shinjirou Machida, Takashi Yamashita
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Patent number: 5942138Abstract: Process of producing a laminar structure including metal sheets which are superposed on each other, wherein a plurality of sheet metal blanks corresponding to and having the same thickness values as the metal sheets, respectively, are superposed on each other, the process comprising the steps of (a) effecting preliminary bonding of two adjacent sheet metal blanks including an endmost one of the sheet metal blanks, by welding at predetermined portions of the two adjacent sheet metal blanks, when each of the plurality of sheet blanks is superposed as the endmost sheet blank on the other of the two adjacent sheet metal blanks, and (b) cutting the endmost sheet metal blank along a predetermined cutting line, after the preliminary bonding, by a laser beam generated from a laser cutting apparatus such that the laser beam spot formed on an exposed surface of the endmost sheet blank is moved along the cutting line.Type: GrantFiled: September 8, 1997Date of Patent: August 24, 1999Assignee: Toyota Jidosha Kabushiki KaishaInventors: Munetaka Toda, Hideo Endo, Takeo Nakagawa
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Patent number: 5919012Abstract: There is provided a method of three-dimensionally cutting a mold including the steps, in sequence, of (a) rotating a single ball end mill at a rate in the range of 50,000 rpm to 200,000 rpm, the ball end mill being made of material having high thermal resistance, (b) driving the ball end mill in horizontal, reciprocating movement at a rate in the range of 10 m/min to 100 m/min, and driving the ball end mill in transverse movement at a predetermined depth of cut in a direction perpendicular to a direction in which the ball end mill is reciprocated, at opposite ends of the reciprocating movement to cut a workpiece in a surface thereof at a common depth of cut, and (c) vertically feeding the ball end mill at a predetermined depth of cut. This method makes it possible to significantly increase a rotation speed and a feeding speed of a cutting tool to thereby remarkably reduce time necessary for cutting a mold.Type: GrantFiled: September 27, 1996Date of Patent: July 6, 1999Assignee: The Institute of Physical and Chemical Research (RIKEN)Inventors: Takeo Nakagawa, Masahiro Anzai, Ichiro Takahashi, Toshitaka Matsuoka
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Patent number: 5910040Abstract: An electrode (4) is disposed spaced away from and in facing relation with an electrically conductive grinding wheel (2). There is applied a voltage across the grinding wheel and the electrode with making electrically conductive fluid (7) flow between the grinding wheel and the electrode. A position of the grinding wheel is numerically controlled with the grinding wheel being dressed by electrolysis to thereby grind a work with the grinding wheel. The work is ground in accordance with command data Zx.sup.(i), and then a shape of a ground surface is measured by means of a measuring device (12). The measurement data is filtered to thereby record shape error data e.sub.x.sup.(i). There is established new command data Zx.sup.(i+1) by adding compensation, and then the work is ground again with the thus established new command data. The compensation refers to past command data, and determines new command data to be equal to an expected value of the past command data.Type: GrantFiled: December 26, 1996Date of Patent: June 8, 1999Assignee: The Institute of Physical and Chemical ResearchInventors: Sei Moriyasu, Hitoshi Ohmori, Takeo Nakagawa, Ichirou Yamaguchi, Jun-Ichi Kato
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Patent number: 5780070Abstract: There is provided an apparatus for solidifying and shaping fluid which can be optically cured, including (a) an optically scanning device for scanning a level of fluid which can be optically cured, with a light beam, (b) a sinking device for sinking a layer having been cured by scanning carried out by the optically scanning device, below a level of the fluid, and (c) a recoat device for covering a cured layer having been sunk in the step (b), with a fluid which is not yet cured. The recoat device is formed with a recoater blade which horizontally moves above a level of the cured layer with a predetermined gap kept therebetween to smooth a level of the not yet cured fluid. The optically scanning device scans a level of not yet cured fluid having been smoothed by the recoater blade, with a light beam, simultaneously with scanning of the optically scanning device.Type: GrantFiled: February 13, 1997Date of Patent: July 14, 1998Assignees: Institute of Physical and Chemical Research (RIKEN), Shimat Co., Ltd.Inventors: Kenji Yamazawa, Toshiki Niino, Takeo Nakagawa, Seiji Hayano
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Patent number: 5647410Abstract: A powder molding machine capable of providing a uniform density of molding powders filled in a molding cavity of a die for improving the strength of molded products includes a die, upper and lower punches and a feeder, and is further provided with a feeder driving unit, which reciprocates a feed shoe between an advanced position at which molding powder is supplied to the die and a retracted position at which no interference occurs during a pressing operation by the punches. The feed driving unit includes a mechanism for enabling the feeder shoe to pass over the die and also to be swung in left and right directions while retracting and while still over the die.Type: GrantFiled: March 14, 1994Date of Patent: July 15, 1997Assignee: Fanuc, Ltd.Inventors: Takeo Nakagawa, Hideaki Tsuru, Yoshiharu Inaba, Takayuki Taira, Masaki Muranaka