Abstract: Method of manufacturing a circuit board and semiconductor device wherein the circuit board has a plurality of wiring patterns and protrusions located on the wiring patterns, the method including simultaneously and unitarily forming the wiring patterns and protrusions, and alternatively coupling electrically the protrusions with electrodes on a semiconductor chip component when present.

Abstract: A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).

Abstract: A high frequency switch module can handle transmit-receive signals of different frequency bands and realize excellent isolation. The high frequency switch module comprises a discriminating filter, a low-band high frequency switch, and a high-band frequency switch, wherein high-band 90-degree phase shifter that forms at least a high-band high frequency switch is configured by a high-pass filter, and a choke line is parallel-connected to the high-pass filter.

Abstract: A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

Abstract: The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.

Abstract: A module component is provided having a sufficient shield effect and fabricated low in height.

Abstract: In a high-frequency switching module for use mainly in a communications apparatus and a high-frequency apparatus equipped with the same, the high-frequency switching module has a group of high-frequency terminals provided on the mounting side surface of a multi-layer assembly of which the lateral sides are formed as no-electrode provided sides excluding the high-frequency terminals. Thus, the high-frequency switching module and the high-frequency apparatus equipped with the same are less susceptible to the external effect.

Abstract: A small antenna has two or more feeding ports. A radiator is made of a planar conductor having a substantially circular shape having the diameter of a substantially half wavelength or a substantially regularly polygonal shape where the length of a diagonal line passes through the center point is the substantially half wavelength. A ground plate is faced to the radiator. On the radiator, the feeding ports are connected to feeding points on two orthogonal line segments passing through the center of the radiator. This antenna is used as not only a single antenna but also two independent antennas having secured isolation between the feeding ports. A small antenna device used as two independent antennas is thus provided. The radiator is formed in a hat shape having an edge, has an Stepped Impedance Resonator (SIR) structure where the diameter of a crest part is a quarter wavelength, and is shortened.

Abstract: A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

Abstract: A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

Abstract: A DC/DC converter presented herein is capable of operating in both step-up and step-down process of output voltage, lowering the output voltage at high speed at the time of output voltage drop, or raising the output voltage at high speed at the time of output voltage rise, and decreasing generation of power loss at the time of transient response. This DC/DC converter can extend the call time of handy phone. The DC/DC converter comprises a voltage converting circuit connected between the input terminal and output terminal, a fast transient response circuit, a step-up and step-down operation determining circuit, a voltage comparator, and a switch control circuit.

Abstract: A high frequency switch module can handle transmit-receive signals of different frequency bands and realize excellent isolation. The high frequency switch module comprises a discriminating filter, a low-band high frequency switch, and a high-band frequency switch, wherein high-band 90-degree phase shifter that forms at least a high-band high frequency switch is configured by a high-pass filter, and a choke line is parallel-connected to the high-pass filter.

Abstract: A high frequency switch configured particularly with FET switches. One end of second FET switch is connected between I/O port and reception port and the other end is ground. A parallel unit of strip line and capacitor is connected between second FET switch and I/O port. This parallel unit has the electrical length equivalent to ¼ wavelength of the high frequency signal input from transmission port.

Abstract: A high-frequency compound switch module of this invention has a first communication system comprising a switch unit for switching connection of a signal from an antenna to one of a transmission circuit and a reception circuit of the first communication system based on a signal from a control terminal, a filter provided on a first reception circuit side, for filtering out a first reception signal, and a first phase shift line provided between the filter and the switch unit, and a second communication system comprising a second phase shift line provided between the switch unit and the first phase shift line, and a branching filter provided in series to the second phase shift line for branching a signal from the second phase shift line into a second transmission signal and a second reception signal. The switch module is capable of performing at least a receiving process of the first communication system while performing transmission/reception with the second communication system.

Abstract: A high frequency switch configured particularly with two FET switches. One end of a second FET switch is connected between an I/O port and a reception port and the other end is ground. A strip line is connected between the second FET switch and the I/O port, and has the electrical length equivalent to {fraction (1/4 )} wavelength of the high frequency signal input from a transmission port.

Abstract: The method of manufacturing a semiconductor device comprising: forming a wiring pattern on a substrate; forming a thermosetting resin layer on the substrate; aligning and adhering a semiconductor chip to the wiring pattern for electric connection via the thermosetting resin layer; and press-bonding an electrode of the chip onto the wiring pattern while the chip is being heated. During the press-bonding step, the substrate is cooled. By the cooling, the amount of thermal expansion of the substrate is suppressed and therefore comes closer to the thermal expansion of the chip. By mounting the chip on the substrate through the steps described above, the reliability of moisture resistance of the semiconductor device is greatly improved.

Abstract: A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

Abstract: The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.

Abstract: In a high-frequency switching module for use mainly in a communications apparatus and a high-frequency apparatus equipped with the same, the high-frequency switching module has a group of high-frequency terminals provided on the mounting side surface of a multi-layer assembly of which the lateral sides are formed as no-electrode provided sides excluding the high-frequency terminals. Thus, the high-frequency switching module and the high-frequency apparatus equipped with the same are less susceptible to the external effect.

Abstract: A paste of the present invention comprises a precious metal organic acid salt added to precious metal powder as a precious metal component of the conductive paste. The base metal organic acid salts are also used instead of base metal components in the inorganic binders to exclude particles with larger diameters from the conductive paste. The conductive paste of the present invention allows the lumps in the paste caused by the insufficient dispersion to be 10 &mgr;m &PHgr; or less, thereby remarkably reducing the screen blockage during screen printing of wiring pattern of 100 &mgr;m or less in width.