Abstract: The method of manufacturing a semiconductor device comprising: forming a wiring pattern on a substrate; forming a thermosetting resin layer on the substrate; aligning and adhering a semiconductor chip to the wiring pattern for electric connection via the thermosetting resin layer; and press-bonding an electrode of the chip onto the wiring pattern while the chip is being heated. During the press-bonding step, the substrate is cooled. By the cooling, the amount of thermal expansion of the substrate is suppressed and therefore comes closer to an thermal expansion of the chip. By mounting the chip on the substrate through the steps described above, the reliability of moisture resistance of the semiconductor device is greatly improved.

Abstract: The present invention relates to integrated circuit devices for use in such civilian equipments as an electronic equipment, electrical equipment, communication equipment and measuring and controlling equipment, and its object is to provide an integrated circuit device which has an excellent heat radiating characteristic.

Abstract: A circuit board with protrusions at desired locations on a wiring pattern that on the surface of the board. The protrusions are made of the same conductive material used in the wiring pattern, and formed unitarily and simultaneously with the wiring pattern. Conductive material is filled into grooves having different depths and formed on a film. The filled conductive material is transferred onto the board, and then fired. Thus the circuit board is manufactured. Semiconductor devices and general-purpose components are mounted on the circuit board, whereby a semiconductor device can be manufactured with high reliability and at an inexpensive cost.

Abstract: A circuit board with protrusions at desired locations on a wiring pattern that on the surface of the board. The protrusions are made of the same conductive material used in the wiring pattern, and formed unitarily and simultaneously with the wiring pattern. Conductive material is filled into grooves having different depths and formed on a film. The filled conductive material is transferred onto the board, and then fired. Thus the circuit board is manufactured. Semiconductor devices and general-purpose components are mounted on the circuit board, whereby a semiconductor device can be manufactured with high reliability and at an inexpensive cost.

Abstract: An integrated circuit device is disclosed that comprises a bare integrated circuit chip, having an integrated circuit section and pad sections, said chip being mounted on an insulated surface of a substrate, and an electro-conductive circuit pattern wiring formed on said insulating surface along the periphery of said chip. Tape automated bonding wiring is used to electrically connect the pad sections of the chip to an end of the circuit pattern wiring. Terminals are electrically connected to the other end of the circuit pattern wiring for use in electrically connecting the integrated circuit device to electronic equipment.

Abstract: A plurality of memory modules are stacked so as to form a multilayer integrated memory circuit. All of the memory modules have a plurality of bare memory IC chips mounted thereon, and have the same structure, the same circuit configuration and the same terminal arrangement in lead frames with each other. Each of the memory modules to be stacked in each layer is rotated by 90.degree., 180.degree. or 270.degree. before being stacked and connected to each other. Thus, in the multi-layered memory circuit, it is possible that signals can be selectively input/output to/from a particular layer in the multilayer structure, although the lead terminals of each of memory modules has the same configuration and the same arrangement with each other. As a result, a small-size integrated memory circuit device with a large memory-capacity can be provided, which can be fabricated easily and efficiently. A higher processing speed of digital computers can be also achieved.

Abstract: It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module comprises a terminal section having an annular insulating frame body and a plurality of terminals provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate having wiring patterns each adapted for connection with the respective terminals of the terminal section and packaging to one surface of the circuit substrate surface packaging parts, the circuit substrate being connected to the terminals with the surface packaging parts directed toward the inside of the terminal section. One circuit module is stacked on the other circuit module to be connected to the latter by the terminals. Thus high-density packaging can be readily realized.

Abstract: A keyboard capable of efficiently illuminating push buttons with a small number of light sources, wherein light sources are randomly distributed below a grating-like retainer provided for retaining push buttons of the keyboard and light rays from the light sources are reflected by means of pyramidal reflectors disposed above the light sources so as to illuminate a plurality of push buttons sideways and thereby efficiently illuminate a push button with light rays from light sources positioned along a plurality of directions.