Patents by Inventor Takeshi Fujikawa
Takeshi Fujikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240097402Abstract: The present disclosure provides an optical member for use in a laser module that includes a surface emitting laser, the optical member being capable of detecting damage (cracking, peeling, and the like), a method for manufacturing the optical member, a laser module including the optical member, and a laser device.Type: ApplicationFiled: November 27, 2023Publication date: March 21, 2024Applicant: Daicel CorporationInventors: Takahiro Iwahama, Takeshi Fujikawa, Sadayuki Fukui
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Patent number: 11927884Abstract: The present invention provides a method for producing a resin molded article through which air bubbles are not easily formed during imprint molding when a curable composition is applied to a mold having a pattern shaped section.Type: GrantFiled: February 8, 2018Date of Patent: March 12, 2024Assignee: DAICEL CORPORATIONInventors: Takeshi Fujikawa, Sadayuki Fukui
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Patent number: 11862936Abstract: The present disclosure provides an optical member for use in a laser module that includes a surface emitting laser, the optical member being capable of detecting damage (cracking, peeling, and the like), a method for manufacturing the optical member, a laser module including the optical member, and a laser device.Type: GrantFiled: July 25, 2022Date of Patent: January 2, 2024Assignee: DAICEL CORPORATIONInventors: Takahiro Iwahama, Takeshi Fujikawa, Sadayuki Fukui
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Publication number: 20230405940Abstract: A manufacturing method for an optical unit includes: molding a first wafer in which a plurality of the first optical elements are formed; molding a second wafer in which a plurality of the second optical elements are formed; forming a bonding portion in a first peripheral portion surrounding the first optical element or a second peripheral portion corresponding to the first peripheral portion and surrounding the second optical element; bonding the first wafer and the second wafer with the bonding portion to seal the first optical element and/or the second optical element; and cutting the first wafer and the second wafer at the first and second peripheral portions in a state where the first and second wafers are bonded to each other to dice an optical unit, in which the adhesive in the bonding portion formed in the forming the bonding portion is in a semi-cured state.Type: ApplicationFiled: June 15, 2023Publication date: December 21, 2023Applicant: Daicel CorporationInventors: Takeshi Fujikawa, Makoto Yasuhara, Sadayuki Fukui
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Publication number: 20230408836Abstract: A technology that can improve efficiency of or simplify a structure of an optical system having a collimating function configured to collimate incident light and a function configured to diffuse or condense parallel light is provided. An optical element includes a function configured to make parallel light into outgoing light by diffusing the parallel light or condensing the parallel light to form a specific pattern, on one surface, and a collimating function configured to make incident light into parallel light by an aspherical lens shape, on the other surface. This makes it possible to achieve a function configured to make outgoing light by diffusing incident light or condensing the incident light to form a specific pattern with a simpler structure. Incident light can be made into parallel light more efficiently even in a case of using a surface light source.Type: ApplicationFiled: June 15, 2023Publication date: December 21, 2023Applicant: Daicel CorporationInventors: Takeshi Fujikawa, Makoto Yasuhara, Sadayuki Fukui
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Publication number: 20220385037Abstract: The present disclosure provides an optical member for use in a laser module that includes a surface emitting laser, the optical member being capable of detecting damage (cracking, peeling, and the like), a method for manufacturing the optical member, a laser module including the optical member, and a laser device.Type: ApplicationFiled: July 25, 2022Publication date: December 1, 2022Applicant: Daicel CorporationInventors: Takahiro Iwahama, Takeshi Fujikawa, Sadayuki Fukui
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Patent number: 11404847Abstract: The present disclosure provides an optical member for use in a laser module that includes a surface emitting laser, the optical member being capable of detecting damage (cracking, peeling, and the like), a method for manufacturing the optical member, a laser module including the optical member, and a laser device.Type: GrantFiled: December 24, 2020Date of Patent: August 2, 2022Assignee: DAICEL CORPORATIONInventors: Takahiro Iwahama, Takeshi Fujikawa, Sadayuki Fukui
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Patent number: 11247368Abstract: Provided is a silicone mold with which a curable composition containing an epoxy resin can be molded with good precision even if used repeatedly. The silicone mold according to an embodiment of the present invention is a silicone mold for use in molding a curable composition containing an epoxy resin, the silicone mold including a cured product of a silicone resin composition, wherein the cured product has a light transmittance at a wavelength of 400 nm of 80% or higher at a thickness of 1 mm, an elongation at break in accordance with JIS K 7161 of 250% or less, and a thermal linear expansion coefficient of 350 ppm/° C. or less at 20 to 40° C.Type: GrantFiled: February 5, 2018Date of Patent: February 15, 2022Assignee: DAICEL CORPORATIONInventors: Takeshi Fujikawa, Sadayuki Fukui
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Publication number: 20210175686Abstract: The present disclosure provides an optical member for use in a laser module that includes a surface emitting laser, the optical member being capable of detecting damage (cracking, peeling, and the like), a method for manufacturing the optical member, a laser module including the optical member, and a laser device.Type: ApplicationFiled: December 24, 2020Publication date: June 10, 2021Applicant: Daicel CorporationInventors: Takahiro Iwahama, Takeshi Fujikawa, Sadayuki Fukui
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Patent number: 10988568Abstract: Provided is a curable composition which has chargeability into silicone molds and curability at excellent levels, less causes the silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention contains curable compounds and a cationic initiator and is used for production of an optical component by molding using silicone molds. The curable compounds include (A) a cycloaliphatic epoxy compound in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent is a curable compound or compounds having a molecular weight of 400 or more.Type: GrantFiled: August 3, 2016Date of Patent: April 27, 2021Assignee: DAICEL CORPORATIONInventors: Takeshi Fujikawa, Sadayuki Fukui
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Patent number: 10988569Abstract: Provided is a curable composition which has excellent curability, less causes silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention is a curable composition for production of an optical component by molding using silicone molds. The curable composition contains curable compounds and a cationic initiator. The curable compounds include (A) a cycloaliphatic epoxy compound and (B) an oxetane compound. The oxetane compound (B) is present in a content of 10 to 45 weight percent of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 90 weight percent or more is a compound or compounds having a solubility parameter of 9.0 (cal/cm3)½ or more as determined at 25° C. by the Fedors' method.Type: GrantFiled: August 3, 2016Date of Patent: April 27, 2021Assignee: DAICEL CORPORATIONInventors: Takeshi Fujikawa, Sadayuki Fukui
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Publication number: 20210001538Abstract: An object of the present invention is to provide a mold-release method and a mold-release device that enable removal of a high-precision molded article from a mold. The present invention provides a mold-release method for a molded article (2) from a mold (1) and a mold-release device for carrying out the mold-release method, the molded article (2) being formed by curing a curable material supplied to a molding surface (1A) of the mold (1), and having a first surface (2A) onto which a patterned shape of the molding surface (1A) is transferred and a second surface (2B) on a back side opposite to the first surface, the method including: 1: attaching a base material (3) onto the entire second surface (2B) of the molded article (2); and 2: relatively moving the base material (3) and the mold (1) in a direction in which the base material (3) and the mold (1) are separated from each other, and thereby releasing the molded article (2) from the mold (1).Type: ApplicationFiled: March 7, 2019Publication date: January 7, 2021Applicant: DAICEL CORPORATIONInventors: Takeshi FUJIKAWA, Sadayuki FUKUI
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Publication number: 20200376720Abstract: Provided is a mold production method whereby a UV curable composition can be molded with good precision through optical imprinting. The mold production method of the present invention is a method of producing a mold including an elastic body and used for molding a UV curable composition, and the method includes simulating deformation associated with curing of the UV curable composition using finite element analysis using [1] curing shrinkage of the UV curable composition and [2] deformation of the mold associated with the curing shrinkage, and designing the mold in accordance with a result of the simulation.Type: ApplicationFiled: February 18, 2019Publication date: December 3, 2020Applicants: DAICEL CORPORATION, TOKYO INSTITUTE OF TECHNOLOGY, UNIVERSITY PUBLIC CORPORATION OSAKAInventors: Shinsuke ISHIKAWA, Takeshi FUJIKAWA, Yuki ONISHI, Yoshihiko HIRAI
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Patent number: 10843423Abstract: Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.Type: GrantFiled: August 4, 2015Date of Patent: November 24, 2020Assignee: DAICEL CORPORATIONInventors: Takeshi Fujikawa, Sadayuki Fukui
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Patent number: 10829586Abstract: The present invention provides a curable composition excellent in curability and capable of forming, through light irradiation, a cured product excellent in light resistance, heat resistance, and transparency.Type: GrantFiled: December 16, 2019Date of Patent: November 10, 2020Assignee: DAECEL CORPORATIONInventors: Takeshi Fujikawa, Kyohei Ishida
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Publication number: 20200209438Abstract: Provided is an optical component whereby the absence of eccentricity can be instantly confirmed visually even in a case that the optical component has Fresnel lens or other very fine structure. An optical component of the present invention includes an optical part and a peripheral part thereof. The optical component includes recognition marks in positions substantially plane-symmetrical to each other on a front surface side and a rear surface side of the peripheral part, the recognition marks being expressed as a recess or a projection and configured to allow eccentricity to be recognized. Two of the recognition marks are preferably similar to each other in shape, one recognition mark being preferably from 10% to 90% the size of the other recognition mark.Type: ApplicationFiled: July 19, 2018Publication date: July 2, 2020Applicant: DAICEL CORPORATIONInventors: Takeshi FUJIKAWA, Sadayuki FUKUI
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Publication number: 20200174164Abstract: Provided is a Fresnel lens that includes prisms with a mountain-like shape disposed at narrow pitches and having a shape in which a slope from a protruded part to a recessed part is steep, and a production method of the Fresnel lens. The Fresnel lens according to the present invention is a molded and cured product of a curable composition having a contact angle with respect to a mold of 50° or less, wherein the Fresnel lens includes two or more prisms concentrically, and a cross-sectional face of the two or more prisms has a mountain-like shape in which a ratio (h/w) of a height (h) to a width (w) is 0.3 or greater, and the height (h) is 0.5 mm or less. The mold is preferably a silicone mold. A breaking strain of a cured product of the curable composition is preferably from 0.1% to 30%.Type: ApplicationFiled: July 10, 2018Publication date: June 4, 2020Applicant: DAICEL CORPORATIONInventors: Takeshi FUJIKAWA, Sadayuki FUKUI
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Publication number: 20200158920Abstract: Provided is a method for efficiently producing a lens with high accuracy and excellent optical properties. The method for producing a lens of the present invention includes cutting an array of lenses at a junction by a method below, the array of lenses fixed on a support tape and having a configuration wherein two or more lenses are two-dimensionally arranged, and these lenses are connected each other via the junction. Cutting method: advancing a cutting depth from the side opposite to the side adhered to the support tape to a range from 50% or greater and 99.9% or less of a thickness of the junction, temporarily stopping the advance of the cutting depth when the advance reaches the range, and then cutting the junction to a cutting depth of 100%.Type: ApplicationFiled: June 26, 2018Publication date: May 21, 2020Applicant: DAICEL CORPORATIONInventors: Sadayuki FUKUI, Takeshi FUJIKAWA
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Publication number: 20200157392Abstract: The present invention is to provide an optical component array, that is, optical components arranged in an array, that can be directly affixed to a substrate, that allows easy adjustment of the distance between the optical components and the substrate by controlling a pressing force during the affixing, and that can adhere the optical components and the substrate by performing photoirradiation and/or heat treatment. The optical component array provided with an adhesive layer according to an embodiment of the present invention having a structure in which two or more optical components each having an adhesive layer having heat- or photo-curability and having a storage modulus at 25° C. from 0.05×104 to 10000×104 Pa on at least a part of a surface are arranged.Type: ApplicationFiled: February 7, 2018Publication date: May 21, 2020Applicant: DAICEL CORPORATIONInventors: Takeshi FUJIKAWA, Sadayuki FUKUI
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Publication number: 20200115491Abstract: The present invention provides a curable composition excellent in curability and capable of forming, through light irradiation, a cured product excellent in light resistance, heat resistance, and transparency. The curable composition contains the following component (A), the following component (B), and the following component (C): the component (A): an alicyclic epoxy compound represented by the following formula (a): the component (B): a light resistance imparting agent having a maximum absorption wavelength in a region between 280 and 320 nm in an ultraviolet-visible light absorption spectrum from 250 to 400 nm; and the component (C): an optical cationic polymerization initiator: wherein R1 to R18 are the same as or different from one another and represent a hydrogen atom, a halogen atom, a hydrocarbon group that may contain an oxygen atom or a halogen atom, or an alkoxy group that may have a substituent; and X represents a single bond or a linking group.Type: ApplicationFiled: December 16, 2019Publication date: April 16, 2020Applicant: DAICEL CORPORATIONInventors: Takeshi FUJIKAWA, Kyohei ISHIDA