Abstract: The light receiving sections of solid-state image sensing devices (2a and 2b) are disposed on a base (1) to adjoin each other, and are fixed with an adhesive resin (11). A transparent film (3) is formed on the light receiving sections so as to wholly cover a gap (25) and have a flat surface on which a layer of a scintillator (4) is formed.

Abstract: An image sensor panel (2) has a light receiving section (22) consisting of a plurality of photoelectric detectors (21) two-dimensionally arranged close to corners on a substrate (20). The image sensor panel (2) has a scintillator (3) formed successively from the surface of the light receiving section (22) to sidewall parts (25) close thereto. A screen is enlarged by butting the sidewall parts (25) against each other.

Abstract: An Ag film as a light-reflecting film is formed on one surface of an a-C substrate of a scintillator panel. The entire surface of the Ag film is covered with an SiN film for protecting the Ag film. A scintillator having a columnar structure, which converts an incident radiation into visible light, is formed on the surface of the SiN film. The scintillator is covered with a polyparaxylylene film together with the substrate.

Abstract: A radiation detection device includes a light-receiving device array with a plurality of light-receiving devices arranged on a substrate to form a light-receiving portion and a plurality of bonding pads electrically coupled to the light-receiving devices of the light-receiving portion to form a bonding pad portion. A scintillator layer is deposited over at least a portion of the light-receiving devices for converting radiaton into detectable light. A radiation-transmitable, moisture-resistant protective film covers at least the scintillator. A coating resin is located in proximity to a periphery of the moisture-resistant prptective film, with the periphery of the moisture-resistant protective film being fixed to the light-receiving device array with the coating resin.

Abstract: A radiation image sensor comprises (1) an image sensor 1 having a plurality of light receiving elements arranged one or two dimensionally, (2) scintillator 2 having columnar structure formed on the light-receiving surface of this image sensor 1 to convert radiation into light including wavelengths that can be detected by the image sensor 1, (3) a protective film 3 formed so as to cover and adhere to the columnar structure of the scintillator 2, and (4) a radiation-transmittable reflective plate 4 that has a reflective surface 42 disposed to face the image sensor across the protective film 3.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element. Around a support surface 10 where the solid-state imaging element 2 of the substrate 1 is mounted, holding portions 14 and 15 are formed on opposing side walls to hold and project the surface of the light-receiving portion from a vapor deposition holder toward a vapor deposition chamber in forming the scintillator 3.

Abstract: A surface of a substrate made of Al in a scintillator panel 1 is sandblasted, whereas one surface thereof is formed with an MgF2 film as a low refractive index material. The surface of MgF2 film is formed with a scintillator having a columnar structure for converting incident radiation into visible light. Together with the substrate, the scintillator is covered with a polyparaxylylene film.

Abstract: The surfaces of an amorphous carbon substrate of a scintillator panel have undergone sandblasting, and an Al film 1 serving as a reflecting film is formed on one surface, and a columnar scintillator for converting incident radiation into visible light is formed on the surface of the Al film.

Abstract: A radiation image sensor comprises (1) an image sensor 1 having a plurality of light receiving elements arranged one or two dimensionally, (2) scintillator 2 having columnar structure formed on the light-receiving surface of this image sensor 1 to convert radiation into light including wavelengths that can be detected by the image sensor 1, (3) a protective film 3 formed so as to cover and adhere to the columnar structure of the scintillator 2, and (4) a radiation-transmittable reflective plate 4 that has a reflective surface 42 disposed to face the image sensor across the protective film 3.

Abstract: The surfaces of an amorphous carbon substrate 10 of a scintillator panel 1 have undergone sandblasting, and an Al film 12 serving as a reflecting film is formed on one surface. A columnar scintillator 14 for converting incident radiation into visible light is formed on the surface of the Al film 12.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element. Around a support surface wherein the solid-state imaging element 2 of the substrate 1 is mounted, positioning portions 14 to 16 are formed, which project higher than the support surface and position the solid-state imaging element 2 with side walls. The top surfaces of these positioning portions are formed such that a light-receiving surface 2a of the solid-state imaging element 2 is higher than the top surfaces.

Abstract: A surface of a substrate made of Al in a scintillator panel 1 is sandblasted, whereas one surface thereof is formed with an MgF2 film as a low refractive index material. The surface of MgF2 film is formed with a scintillator having a columnar structure for converting incident radiation into visible light. Together with the substrate, the scintillator is covered with a polyparaxylylene film.

Abstract: Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said scintillator, introduced into said vapor deposition chamber.

Abstract: A light-receiving device array in which a plurality of light-receiving devices are one- or two-dimensionally arranged on a substrate, a scintillator layer is deposited on the light-receiving devices and provided with columnar crystals, and an organic film is formed over the scintillator layer and there outside region of the substrate and it intrudes into gaps among the top part of the columnar crystals to cover the scintillator layer.

Abstract: Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said. scintillator, introduced into said vapor deposition chamber.

Abstract: A surface of a substrate made of Al in a scintillator panel 1 is sandblasted, whereas one surface thereof is formed with an MgF2 film as a low refractive index material. The surface of MgF2 film is formed with a scintillator having a columnar structure for converting incident radiation into visible light. Together with the substrate, the scintillator is covered with a polyparaxylylene film.

Abstract: In an X-ray image pickup apparatus comprising first and second semiconductor image sensor chips 14A, 14C arranged adjacent each other on a base plate 20, and a single scintillator panel 40 disposed on the first and second semiconductor image sensor chips, respective planes including surfaces of photosensitive regions of the first and second semiconductor image sensor chips have normals intersecting at a predetermined angle.

Abstract: An image sensor panel (2) has a light receiving section (22) consisting of a plurality of photoelectric detectors (21) two-dimensionally arranged close to corners on a substrate (20). The image sensor panel (2) has a scintillator (3) formed successively from the surface of the light receiving section (22) to sidewall parts (25) close thereto. A screen is enlarged by butting the sidewall parts (25) against each other.

Abstract: A light-receiving device array in which a plurality of light-receiving devices are one- or two-dimensionally arranged on a substrate, a scintillator layer is deposited on the light-receiving devices and provided with columnar crystals, and an organic film is formed over the scintillator layer and there outside region of the substrate and it intrudes into gaps among the top part of the columnar crystals to cover the scintillator layer.

Abstract: Scintillator panel 1 comprises a radiation transmitting substrate 5, which has heat resistance, a dielectric multilayer film mirror 6, as a light reflecting film and is formed on the radiation transmitting substrate 5, and a scintillator 10, disposed on the dielectric multilayer film mirror 6 and emits light by conversion of the radiation 30 that has been made to enter the radiation transmitting substrate 5 and has passed through the dielectric multilayer film mirror 6. Since the radiation transmitting substrate 5 has heat resistance, the dielectric multilayer film mirror 6 can be vapor deposited at a high temperature and, as a result, can be formed in a state of high reflectance. Also, unlike a metal film, the dielectric multilayer film mirror 6 will not corrode upon reacting with the scintillator 10.