Abstract: In a scintillator panel comprising a deliquescent scintillator formed on an FOP and a polyparaxylylene film covering over the scintillator, the FOP comprises a protective film peeling prevention rough at a side wall portion thereon coming into contact with the polyparaxylylene film.

Abstract: The light receiving sections of solid-state image sensing devices (2a and 2b) are disposed on a base (1) to adjoin each other, and are fixed with an adhesive resin (11). A transparent film (3) is formed on the light receiving sections so as to wholly cover a gap (25) and have a flat surface on which a layer of a scintillator (4) is formed.

Abstract: A scintillator panel 1 uses a glass substrate 5, having heat resistance, as a base member for forming a scintillator 10. Glass substrate 5 also functions as a radiation entry window. Also, a dielectric multilayer film mirror 6 is disposed as a light-reflecting film between the scintillator 10 and the glass substrate 5. Furthermore, a light-absorbing film 7 is disposed on the radiation entry surface of glass substrate 5 and this absorbs the light that has been emitted from scintillator 10 and has passed through the dielectric multilayer film mirror 6 and the glass substrate 5. Light components that are reflected by the radiation entry surface, etc., and return to the dielectric multilayer film mirror 7 and the scintillator 10 therefore do not occur and the optical output of the scintillator panel 1 is not subject to degrading effects.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element. Around a support surface wherein the solid-state imaging element 2 of the substrate 1 is mounted, positioning portions 14 to 16 are formed, which project higher than the support surface and position the solid-state imaging element 2 with side walls. The top surfaces of these positioning portions are formed such that a light-receiving surface 2a of the solid-state imaging element 2 is higher than the top surfaces.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1 having external connection electrodes 12 and electrode pads 11 electrically connected to them. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element 2. The electrodes pads 11 and 22 are electrically connected by wiring lines 4. An electrical insulating organic film 51 tightly seals the scintillator 3 and covers the electrode pads 11 and 22 and the wiring lines 4. A metal thin film 52 is formed on the organic film 51.

Abstract: A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element. Around a support surface 10 where the solid-state imaging element 2 of the substrate 1 is mounted, holding portions 14 and 15 are formed on opposing side walls to hold and project the surface of the light-receiving portion from a vapor deposition holder toward a vapor deposition chamber in forming the scintillator 3.

Abstract: In a scintillator panel comprising a deliquescent scintillator formed on an FOP and a polyparaxylylene film covering over the scintillator, the FOP comprises a protective film peeling prevention rough at a side wall portion thereon coming into contact with the polyparaxylylene film.

Abstract: The surfaces of an amorphous carbon substrate 10 of a scintillator panel 1 have undergone sandblasting, and an Al film 12 serving as a reflecting film is formed on one surface. A columnar scintillator 14 for converting incident radiation into visible light is formed on the surface of the Al film 12.

Abstract: A radiation image sensor comprises (1) an image sensor 1 having a plurality of light receiving elements arranged one or two dimensionally, (2) scintillator 2 having columnar structure formed on the light-receiving surface of this image sensor 1 to convert radiation into light including wavelengths that can be detected by the image sensor 1, (3) a protective film 3 formed so as to cover and adhere to the columnar structure of the scintillator 2, and (4) a radiation-transmittable reflective plate 4 that has a reflective surface 42 disposed to face the image sensor across the protective film 3.

Abstract: An Ag film as a light-reflecting film is formed on one surface of an a-C substrate of a scintillator panel. The entire surface of the Ag film is covered with an SiN film for protecting the Ag film. A scintillator having a columnar structure, which converts an incident radiation into visible light, is formed on the surface of the SiN film. The scintillator is covered with a polyparaxylylene film together with the substrate.

Abstract: In an X-ray image pickup apparatus comprising first and second semiconductor image sensor chips 14A, 14C arranged adjacent each other on a base plate 20, and a single scintillator panel 40 disposed on the first and second semiconductor image sensor chips, respective planes including surfaces of photosensitive regions of the first and second semiconductor image sensor chips have normals intersecting at a predetermined angle.

Abstract: Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said scintillator, introduced into said vapor deposition chamber.

Abstract: Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said, scintillator, introduced into said vapor deposition chamber.

Abstract: The surfaces of an amorphous carbon substrate 10 of a scintillator panel 1 have undergone sandblasting, and an Al film 12 serving as a reflecting film is formed on one surface. A columnar scintillator 14 for converting incident radiation into visible light is formed on the surface of the Al film 12.

Abstract: In a scintillator panel comprising a deliquescent scintillator formed on an FOP and a polyparaxylylene film covering over the scintillator, the FOP comprises a protective film peeling prevention rough at a side wall portion thereon coming into contact with the polyparaxylylene film.

Abstract: A scintillator panel (2) comprises a radiation-transparent substrate(10), aflat resin film (12) formed on the substrate (10), a reflecting film (14) formed on the flat resin film (12), a deliquescent scintillator (16) formed on the reflecting film (14), and a transparent organic film (18) covering the scintillator (16).

Abstract: A radiation image sensor has a scintillator panel and an imaging device, and the scintillator panel comprises a radiation-transparent substrate, a deliquescent scintillator formed on the substrate, and an elastic organic film covering the scintillator, the scintillator panel and imaging device being bonded to each other with a matching oil interposed therebetween, whereas side wall portions of the scintillator panel and imaging device are firmly attached to each other with a resin.

Abstract: A scintillator having a columnar structure adapted to convert incident radiation into visible light is formed on one surface of a substrate made of Al in a scintillator panel. All surfaces of the substrate and scintillator are covered with a first polyparaxylylene film, whereas an SiO2 film is formed on the surface of polyparaxylylene film on the scintillator side. Further, a second polyparaxylylene film is formed on the surface of SiO2 film and the surface of polyparaxylylene film on the substrate side, so that all surfaces are covered with the second polyparaxylylene film.

Abstract: A scintillator panel (2) comprises a radiation-transparent substrate (10), a flat resin film (12) formed on the substrate (10), a reflecting film (14) formed on the flat resin film (12), a deliquescent scintillator (16) formed on the reflecting film (14), and a transparent organic film (18) covering the scintillator (16).

Abstract: A surface of a substrate made of Al in a scintillator panel 1 is sandblasted, whereas one surface thereof is formed with an MgF2 film as a low refractive index material. The surface of MgF2 film is formed with a scintillator having a columnar structure for converting incident radiation into visible light. Together with the substrate, the scintillator is covered with a polyparaxylylene film.