Abstract: According to one embodiment, an automatic analyzing apparatus includes a probe and a liquid level detector. The liquid level detector is electrically connected to the probe and detects contact between the probe and a liquid surface, wherein the liquid level detector comprises an adjuster configured to adjust electrostatic capacitance of one or more capacitors for circuitry for use in liquid level detection.

Abstract: A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Abstract: In a substrate of a liquid ejection head, there are formed a first through-hole which constitutes a liquid supply path, and a second through-hole in which a through-hole electrode electrically connected to a wiring layer is formed on the inner surface. The first through-hole has a first hole having a first opening and a second hole having a second opening, and the second through-hole has a third hole having a third opening and a fourth hole having a fourth opening. When the minimum width of the first opening is represented by D1, the minimum width of the second opening is represented by D2, the minimum width of the third opening is represented by D3, and the minimum width of the fourth opening is represented by D4, the first to fourth openings satisfy a relation of D1>D3>D4>D2.

Abstract: In a substrate of a liquid ejection head, there are formed a first through hole which constitutes a liquid supply path, and a second through hole in which a through-hole electrode electrically connected to a wiring layer is formed on the inner surface. The first through hole has a first hole having a first opening and a second hole having a second opening, and the second through hole has a third hole having a third opening and a fourth hole having a fourth opening. When the minimum width of the first opening is represented by D1, the minimum width of the second opening is represented by D2, the minimum width of the third opening is represented by D3, and the minimum width of the fourth opening is represented by D4, the first to fourth openings satisfy a relation of D1>D3>D4>D2.

Abstract: A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.

Abstract: A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.

Abstract: A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X?30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

Abstract: A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.

Abstract: A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.

Abstract: A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.

Abstract: There is provided a method for laminating a smooth thin resin layer on a substrate in manufacturing a liquid ejection head by a casting method. To achieve this, a resin layer having a sufficient thickness to fill a concave portion already existing on the substrate is applied and smoothed. Thereafter, a plurality of opening patterns (concave portions) are formed and then smoothed again to obtain a thin resin layer having a desired thickness.

Abstract: A method for manufacturing a structure having a substrate in which holes are formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes includes a process of preparing a substrate in which holes formed by a surface in which a wavelike shape is formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes and an exposure process of exposing the photosensitive resin layer on the substrate.

Abstract: A method of forming a space includes a step of tenting, on a substrate having a recessed portion, a dry film including a dry film material that is to be a top plate on the recessed portion. The step of tenting the dry film includes a press period and a release period and performs a press-release cycle of the press period and the release period a plurality of times, a pressed state in which the dry film is pressed against the substrate by using a pressing member is maintained during the press period, and a released state in which the pressed state is released is maintained during the release period.

Abstract: There is provided a method for forming a smooth resin layer on a substrate having a concavo-convex portion in manufacturing a liquid ejection head by a casting method. To achieve this, after forming an opening pattern on the resin layer formed on the substrate, a mold is brought into contact with the resin layer at a predetermined pressure so as to smooth a surface of the resin layer.

Abstract: A method for manufacturing a structure includes, preparing a substrate with a recessed portion provided therein, attaching a film including a photosensitive resin layer containing photosensitive resin therein and a support layer to the substrate to cover the recessed portion with the photosensitive resin layer, irradiating the photosensitive resin layer covering the recessed portion with light via the support layer to form a latent image pattern on the photosensitive resin layer, heating the photosensitive resin layer at 30 degrees Celsius or higher and X degrees Celsius or lower for one minute or longer, wherein a softening point of the photosensitive resin is X degrees Celsius (X?30), separating the support layer from the photosensitive resin layer, heating the photosensitive resin layer at X+10 degrees Celsius or higher, and carrying out development on the photosensitive resin layer.

Abstract: A manufacturing method of a liquid ejection head, which includes a step of preparing a substrate including a first layer, a step of forming a flow path mold for forming the flow path and a member located outside the mold with a gap between the mold and the member from the first layer, a step of providing a second layer so that the second layer fills the gap and covers the mold and the member located outside the mold with the gap between them, a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer, a step of removing the member located outside the mold with the gap between them, and a step of forming a wall member located outside the ejection orifice forming member with at least a partial gap between the ejection orifice forming member and the wall member.

Abstract: A liquid ejection head capable of suppressing a change in pressure of a pressure chamber, a liquid ejection apparatus, and a manufacturing method are provided. For that reason, a lid member is formed on a wafer-shaped element board and the element board is cut into chips to manufacture a print element board.

Abstract: A mold unit and base units are formed on a substrate. A covering resin layer is formed by coating a liquid-like resin composition to cover the surfaces of the mold unit and the base unit. When interval between one end of the base unit and the mold unit adjacent thereto is ?1, the interval of the plurality of base units is ?2, a distance between the center of the ejection opening and the other end of the base unit is L, the height of the unevenness between the surface of the base unit and the surface of the mold unit is ?H, and the covering resin layer has a thickness H2, when the base unit is established to ?2?30 ?m, the base unit and the covering resin layer are formed so that the relations ?1?30 ?m and ?H=0 ?m or H2/?H?3 are satisfied.

Abstract: There is provided a method for forming a smooth resin layer on a substrate having a concavo-convex portion in manufacturing a liquid ejection head by a casting method. To achieve this, after forming an opening pattern on the resin layer formed on the substrate, a mold is brought into contact with the resin layer at a predetermined pressure so as to smooth a surface of the resin layer.

Abstract: There is provided a method for laminating a smooth thin resin layer on a substrate in manufacturing a liquid ejection head by a casting method. To achieve this, a resin layer having a sufficient thickness to fill a concave portion already existing on the substrate is applied and smoothed. Thereafter, a plurality of opening patterns (concave portions) are formed and then smoothed again to obtain a thin resin layer having a desired thickness.