Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d?h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A circuit board is mounted on a package via an adhesive agent as an elastic member. A sensor element is stacked in fixed relation onto the circuit board. The sensor element, the circuit board, and the package are wired with bonding wires. A magnetic member made of a ferromagnetic material is disposed between the adhesive agent and the circuit board.

Abstract: A bonding structure of a vibration isolation target is disclosed. The structure includes: a base; a vibration isolation target mounted to the base; and a vibration isolator bonds together the base and the vibration isolation target. A lift-up portion is formed on one of the base and the vibration isolation target, and is lift-upped from the one toward the other of the base and the vibration isolation target. The lift-up portion has an apex surface located at an apex of the lift-up portion. The vibration isolator is on the apex surface.

Abstract: A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d?h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The stopper limits a displacement of the second chip when the adhesive member is deformed. The stopper is disposed around the second chip. Since the displacement of the second chip is restricted, deformation of the bonding wire between the first and the second chips is also restricted.

Abstract: A circuit board is mounted on a package via an adhesive agent as an elastic member. A sensor element is stacked in fixed relation onto the circuit board. The sensor element, the circuit board, and the package are wired with bonding wires. A magnetic member made of a ferromagnetic material is disposed between the adhesive agent and the circuit board.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: An angular rate sensor includes a sensor chip having an oscillator vibrating at a predetermined frequency and detecting an angular velocity applied to this oscillator around a predetermined rotation axis. A circuit chip, laminated with the sensor chip, has a circuit formed on a surface thereof to detect the angular velocity based on a signal obtained from the sensor chip. The sensor chip and the circuit chip are bonded with an adhesive film. A resonance frequency of the sensor chip is smaller than (½)1/2 times a driving frequency of the oscillator in a condition that adjustment is applied to at least one of configuration or elastic coefficient of the adhesive film.

Abstract: An angular velocity mount arrangement includes an angular velocity sensor and a mount member. The angular velocity sensor includes an oscillator, an angular velocity sensing element, a package, and a plurality of lead frames. The angular velocity sensing element senses an angular velocity based on an oscillation of the oscillator in a first axis direction. The mount member is arranged relative to the angular velocity sensor in a second axis direction, which is generally orthogonal to the first axis direction. The angular velocity sensor is mounted to the mount member through the plurality of lead frames. At least one extending segment is a middle segment of each of the plurality of lead frames and extends toward the mount member in the second axis direction. The at least one extending segment of each of the plurality of lead frames is able to oscillate in the first axis direction.

Abstract: A physical quantity sensor includes a package, a circuit chip disposed and held in the package, a sensor chip stacked and fixed on the circuit chip, and a wiring member having flexibility, through which the circuit chip and the package are electrically and mechanically bonded together. In the physical quantity sensor, unwanted external vibrations transmitted to the sensor chip are reduced without an external vibration dumping system such as a rubber pad, because the wiring member weakens the vibrations.

Abstract: The angular velocity sensor includes a container, a sensing element in the container and a viscous fluid between the container and the sensing element. The sensing element is supported by the viscous fluid such as an ER fluid or an MR fluid. The angular velocity sensor detects acceleration of the body in which the angular velocity sensor is installed. The angular velocity sensor controls the viscosity of the viscous fluid depending on the acceleration of a body, by changing a voltage applied to the viscous fluid.

Abstract: A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The stopper limits a displacement of the second chip when the adhesive member is deformed. The stopper is disposed around the second chip. Since the displacement of the second chip is restricted, deformation of the bonding wire between the first and the second chips is also restricted.

Abstract: A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The stopper limits a displacement of the second chip when the adhesive member is deformed. The stopper is disposed around the second chip. Since the displacement of the second chip is restricted, deformation of the bonding wire between the first and the second chips is also restricted.

Abstract: In a capacitive semiconductor sensor, a sensor chip and a circuit chip are contained in a package. First bump members are mounted on second electrodes disposed on a second surface of the circuit chip, respectively. The sensor chip is mounted at its first surface on the second surface of the circuit chip so that first electrodes disposed on the first surface of the sensor chip are electrically mechanically connected to the second electrodes through the first bump members, respectively. Second bump members are mounted on third electrodes disposed on the second surface of the circuit chip, respectively. The third electrodes are electrically mechanically connected to lead electrodes disposed to the package through the second bump members, respectively.