Abstract: A voltage converter includes a high-frequency modulation unit including a first switching tube and a second switching tube, an inductance filtering unit including a filtering inductor, and an inverting paraphase unit. The drain of the first switching tube is connected to a DC voltage, its source connects to the drain of the second switching tube, and the source of the second switching tube is earthed. The grids of the first and second switch tubes are respectively connected to two-path anti-phased PWM pulse signals. The front end of the filtering inductor is connected to the source of the first switching tube. The inverting paraphase unit, with its input terminal connected to the back end of the filtering inductor, is configured for invertedly converting a half-wave pulse voltage output from the back end of the filtering inductor to a sine AC voltage.

Abstract: A long-life intelligent step-down conversion device includes a high-frequency modulation unit including a first switching tube and a second switching tube, an inductance filtering unit including a filtering inductor, and an inverting paraphase unit. The drain of the first switching tube is connected to a DC voltage, its source connects to the drain of the second switching tube, and the source of the second switching tube is carthed. The grids of the first and second switch tubes are respectively connected to two-path anti-phased PWM pulse signals. The front end of the filtering inductor is connected to the source of the first switching tube. The inverting paraphase unit, with its input terminal connected to the back end of the filtering inductor, is configured for invertedly converting a half-wave pulse voltage output from the back end of the filtering inductor to a sine AC voltage. Which of easy to carry, without electrolytic capacitors, improving the service life, avoiding interference to the power grid.

Abstract: A common voltage compensation unit and compensation method, a driving circuit and a display panel are disclosed. In the common voltage compensation unit provided by the disclosure, the first compensation module may be used for outputting a first common voltage to the common electrode line in the pixel charging period of time, and the second compensation module may be used for outputting a second common voltage to the common electrode line in the pixel non-charging period of time.

Abstract: An array substrate, a driving method thereof and a display device are provided. The array substrate includes a base substrate, a pixel electrode located on the base substrate; a first gate line and a second gate line located on the base substrate at both sides of the pixel electrode, respectively, the pixel electrode being partially overlapped with the first gate line and the second gate line respectively to form a first storage capacitor and a second storage capacitor respectively; and a gate driver connected with the first gate line and the second gate line and configured to sequentially provide a gate signal to the first gate line and the second gate line and perform a waveform chamfering operation to the gate signal.

Abstract: A long-life intelligent step-down conversion device includes a high-frequency modulation unit including a first switching tube and a second switching tube, an inductance filtering unit including a filtering inductor, and an inverting paraphase unit. The drain of the first switching tube is connected to, a DC voltage, its source connects to the drain of the second switching tube, and the source of the second switching tube is earthed. The grids of the first and second switch tubes are respectively connected to two-path anti-phased PWM pulse signals. The front end of the filtering inductor is connected to the source of the first switching tube. The inverting paraphase unit, with its input terminal connected t the back eat of the filtering inductor, is configured for invertedly converting a half-wave pulse voltage output from the back end of the filtering inductor to a sine AC voltage. Which of easy to carry, without electrolytic capacitors improving the service life, avoiding interference to the power grid.

Abstract: In one embodiment, a substrate support bushing for a lift pin used in a semiconductor processing chamber is provided. The bushing includes an elongated housing sized to guide the lift pin in a substrate support pedestal. The housing has a longitudinal bore formed through the housing. The housing includes at least one passageway slot extending and open to substantially the entire length of the bore. In another embodiment, a method for transferring a substrate from a substrate support pedestal is provided. The method includes displacing a lift pin through a central bore toward a substrate disposed on a substrate support pedestal. The bore has at least one slot extending substantially along and open to the central bore. The method further includes spacing the substrate from the substrate support pedestal on the lift pin.

Abstract: A method and apparatus for heating or cooling a fluid is provided. In one embodiment, a heat exchanger is provided. The heat exchanger includes a first subassembly comprising an insert. The insert comprises a body having a blind passage formed axially in the body, a plurality of nozzles formed therein, and a first plurality of heat exchange elements disposed within the body. The heat exchanger also comprises a second subassembly comprising a sleeve and a second plurality of heat exchange elements disposed within the sleeve, wherein the insert is sealably engaged inside the sleeve and the insert and the sleeve cooperatively define a thin gap, and wherein each of the plurality of nozzles are disposed radially between the blind passage and the thin gap.

Abstract: A method for manipulating a circuit design includes receiving multiple dummy cell modification parameters, selecting, by a computer processor and based on the dummy cell modification parameters, a dummy cell insertion region on a circuit design, and generating, in the dummy cell insertion region, multiple dummy cells. The method further includes selecting a first dummy cell from the dummy cells, determining, by the computer processor and based on a location of the first dummy cell, an illegal overlap with the first dummy cell, and removing, by the computer processor and from the dummy cells, the first dummy cell. The method further includes inserting, by the computer processor, on the circuit design, and after removing the first dummy cell, the dummy cells to obtain a modified circuit design, and presenting the modified circuit design.

Abstract: A method for manipulating a circuit design includes receiving multiple dummy cell modification parameters, selecting, by a computer processor and based on the dummy cell modification parameters, a dummy cell insertion region on a circuit design, and generating, in the dummy cell insertion region, multiple dummy cells. The method further includes selecting a first dummy cell from the dummy cells, determining, by the computer processor and based on a location of the first dummy cell, an illegal overlap with the first dummy cell, and removing, by the computer processor and from the dummy cells, the first dummy cell. The method further includes inserting, by the computer processor, on the circuit design, and after removing the first dummy cell, the dummy cells to obtain a modified circuit design, and presenting the modified circuit design.

Abstract: Methods and substrate processing systems are provided for controlling substrate heating efficiency and generating a desired temperature profile on the surface of a substrate when the substrate is disposed on a substrate support surface of a substrate support assembly. The substrate support assembly is provided with minimum software control and hardware requirement and includes a heating element comprised of multiple heating elements sections. The heating element is connected to a power source for adjusting the temperature outputs of the multiple heating element sections and providing adjustable multi-heating zones and desired temperature distribution over the substrate support surface of the substrate support assembly within a process chamber.

Abstract: A bushing assembly for supporting a substrate within a processing chamber is generally provided. In one aspect, the bushing assembly comprises a tubular body having an outer perimeter and an aperture extending therethrough, a first ring having a first inner edge, the first ring disposed in the aperture in an upper portion of the tubular body, and a second ring having a second inner edge, the second ring disposed in the aperture in a lower portion of the tubular body. In another aspect, the first inner edge has a first radius of curvature, and the second inner edge has a second radius of curvature. In another aspect, a first inner edge diameter, a second inner edge diameter, the first radius of curvature, and the second radius of curvature are selected such that a support pin extending through the aperture contacts the bushing assembly on at most two points.

Abstract: In one embodiment, a substrate support bushing for a lift pin used in a semiconductor processing chamber is provided. The bushing includes an elongated housing sized to guide the lift pin in a substrate support pedestal. The housing has a longitudinal bore formed through the housing. The housing includes at least one passageway slot extending and open to substantially the entire length of the bore. In another embodiment, a method for transferring a substrate from a substrate support pedestal is provided. The method includes displacing a lift pin through a central bore toward a substrate disposed on a substrate support pedestal. The bore has at least one slot extending substantially along and open to the central bore. The method further includes spacing the substrate from the substrate support pedestal on the lift pin.

Abstract: A mounting apparatus includes a mounting base, a securing plate attached to the mounting base, and an enclosure. The mounting base defines an opening. The securing plate includes a securing portion secured to the mounting base. The enclosure extends through the opening and is attached to the securing plate. A circuit board, used to secure a power supply, is received in the enclosure and is attached to the securing plate.

Abstract: A currency transmission apparatus includes a bracket, an image scanner, and a rotating shaft. The bracket includes a guiding plate, which defines a number of cutouts. The image scanner is located below the guiding plate. A gap is defined between the guiding plate and the image scanner. The rotating shaft is pivotally mounted on the bracket. The rotating shaft includes a number of wheels. The wheels are located in the number of cutouts and are configured to rotate along the rotating shaft to move currency through the gap.

Abstract: Methods and substrate processing systems are provided for controlling substrate heating efficiency and generating a desired temperature profile on the surface of a substrate when the substrate is disposed on a substrate support surface of a substrate support assembly. The substrate support assembly is provided with minimum software control and hardware requirement and includes a heating element comprised of multiple heating elements sections. The heating element is connected to a power source for adjusting the temperature outputs of the multiple heating element sections and providing adjustable multi-heating zones and desired temperature distribution over the substrate support surface of the substrate support assembly within a process chamber.

Abstract: A substrate processing system with independent substrate placement capability to two or more substrate support assemblies is provided. Two different sets of fixed-length lift pins are disposed on two or more substrate support lift pin assemblies of two or more process chambers, where the length of each lift pin in one process chamber is different from the length of each lift pin in another process chamber. The substrate processing system includes simplified mechanical substrate support lift pin mechanisms and minimum accessory parts cooperating with a substrate transfer mechanism (e.g., a transfer robot) for efficient and independent loading, unloading, and transfer of one or more substrates between two or more processing regions in a twin chamber or between two or more process chambers. A method for positioning one or more substrates to be loaded, unloaded, or processed independently or simultaneously in two or more processing regions or process chambers is provided.

Abstract: A method and apparatus for heating or cooling a fluid is provided. In one embodiment, a heat exchanger is provided. The heat exchanger includes a first subassembly comprising an insert. The insert comprises a body having a blind passage formed axially in the body, a plurality of nozzles formed therein, and a first plurality of heat exchange elements disposed within the body. The heat exchanger also comprises a second subassembly comprising a sleeve and a second plurality of heat exchange elements disposed within the sleeve, wherein the insert is sealably engaged inside the sleeve and the insert and the sleeve cooperatively define a thin gap, and wherein each of the plurality of nozzles are disposed radially between the blind passage and the thin gap.

Abstract: A method and apparatus for heating or cooling a fluid. An inlet conduit coupled to a plurality of distribution nozzles in fluid communication with a channel at the periphery of the apparatus. An insert and a sleeve cooperatively define a thin gap, in fluid communication with the channel, through which the fluid flows. Thermal inserts near the thin gap generate heat flux into or out of the fluid, which exits through an outlet conduit.

Abstract: An electromagnetic sensing device having a multi-point touch function comprises electromagnetic pens (101) for inputting graphics and an electromagnetic sensing board for detecting trace information of the inputted graphics. Each of the electromagnetic pens (101) has a resonance circuit provided therein, and the electromagnetic sensing board has an electromagnetic wave transmitter (102), an electromagnetic wave receiver (105), a controller (109) and an electric wave frequency switching unit (103) provided therein. The electric wave frequency switching unit (103) of the electromagnetic sensing board receives an instruction from the controller (109) to control the electromagnetic wave transmitter (102) to transmit electromagnetic waves at different frequencies, and the electromagnetic pens (101) generate electromagnetic resonance waves at respective resonance frequencies.