Patents by Inventor Tapashree Roy
Tapashree Roy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071792Abstract: A method includes receiving, by a processing device, first data generated by a first sensor of a substrate processing system. The first data is generated responsive to the first sensor receiving electromagnetic radiation from a substrate held by a robot arm of a transfer chamber in the substrate processing system. The method further includes processing the first data to obtain second data. The second data includes a first indication of performance of the substrate processing system. The method further includes causing, in view of the second data, performance of a corrective actions associated with the substrate processing system.Type: ApplicationFiled: August 25, 2022Publication date: February 29, 2024Inventors: Tapashree Roy, Todd Egan, Viswanath Bavigadda, Nitin Gupta
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Publication number: 20230408413Abstract: In one embodiment, an apparatus to identify chemical and spatial properties of nanoparticles in a semiconductor cleaning solution, comprises a broadband light source to provide an excitation beam; a focusing lens in a path of the excitation beam to form a focused excitation beam; a sample cell, the sample cell configured to hold a cleaning solution and one or more insoluble analytes-of-interest therein; a plurality of optical lens in the path of one or more fluorescence signals to focus the one or more fluorescence signals; and an imaging device, wherein the imaging device captures the one or more fluorescence signals to form a plurality of images that contain both spatial data and spectral data about the one or more insoluble analytes-of-interest.Type: ApplicationFiled: June 13, 2023Publication date: December 21, 2023Inventors: Viswanath BAVIGADDA, Shubhayan BHATTACHARYA, Tapashree ROY, Ankur KADAM, Kiran Rangaswamy AATRE, Suraj RENGARAJAN
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Patent number: 11626321Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: GrantFiled: May 22, 2020Date of Patent: April 11, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Ludovic Godet, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Naamah Argaman, Tapashree Roy, Sage Toko Garrett Doshay
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Publication number: 20230056086Abstract: Embodiments of metasurfaces having nanostructures with desired geometric profiles and configurations are provided in the present disclosure. In one embodiment, a metasurface includes a nanostructure formed on a substrate, wherein the nanostructure is cuboidal or cylindrical in shape. In another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein each of the nanostructures has a gap greater than 35 nm spaced apart from each other. In yet another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein the nanostructures are fabricated from at least one of TiO2, silicon nitride, or amorphous silicon, or GaN or aluminum zinc oxide or any material with refractive index greater than 1.8, and absorption coefficient smaller than 0.001, the substrate is transparent with absorption coefficient smaller than 0.001.Type: ApplicationFiled: October 31, 2022Publication date: February 23, 2023Inventors: Tapashree ROY, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN
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Publication number: 20230033741Abstract: A method and apparatus for creating a flat optical structure is disclosed. The method includes etching at least one trench in a substrate, placing a dielectric material in at least one trench in the substrate and encapsulating the top of the substrate with a film.Type: ApplicationFiled: October 11, 2022Publication date: February 2, 2023Inventors: Tapashree ROY, Rutger MEYER TIMMERMAN THIJSSEN, Ludovic GODET, Jinxin FU
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Patent number: 11487139Abstract: Embodiments of metasurfaces having nanostructures with desired geometric profiles and configurations are provided in the present disclosure. In one embodiment, a metasurface includes a nanostructure formed on a substrate, wherein the nanostructure is cuboidal or cylindrical in shape. In another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein each of the nanostructures has a gap greater than 35 nm spaced apart from each other. In yet another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein the nanostructures are fabricated from at least one of TiO2, silicon nitride, or amorphous silicon, or GaN or aluminum zinc oxide or any material with refractive index greater than 1.8, and absorption coefficient smaller than 0.001, the substrate is transparent with absorption coefficient smaller than 0.001.Type: GrantFiled: October 14, 2019Date of Patent: November 1, 2022Assignee: Applied Materials, Inc.Inventors: Tapashree Roy, Wayne McMillan, Rutger Meyer Timmerman Thijssen
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Patent number: 11480712Abstract: Embodiments described herein relate to nanostructured trans-reflective filters having sub-wavelength dimensions. In one embodiment, the trans-reflective filter includes a film stack that transmits a filtered light within a range of wavelengths and reflects light not within the first range of wavelengths. The film stack includes a first metal film disposed on a substrate having a first thickness, a first dielectric film disposed on the first metal film having a second thickness, a second metal film disposed on the first dielectric film having a third thickness, and a second dielectric film disposed on the second metal film having a fourth thickness.Type: GrantFiled: March 25, 2021Date of Patent: October 25, 2022Assignee: Applied Materials, Inc.Inventors: Tapashree Roy, Rutger Meyer Timmerman Thijssen, Robert Jan Visser
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Publication number: 20220336270Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: ApplicationFiled: July 1, 2022Publication date: October 20, 2022Inventors: Ludovic GODET, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN, Tapashree ROY, Sage Toko Garrett DOSHAY
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Patent number: 11473191Abstract: A method for creating a flat optical structure is disclosed, having steps of providing a substrate, etching at least one nanotrench in the substrate, placing a dielectric material in the at least one nanotrench in the substrate and encapsulating a top of the substrate with a film.Type: GrantFiled: April 25, 2019Date of Patent: October 18, 2022Assignee: Applied Materials, Inc.Inventors: Tapashree Roy, Rutger Meyer Timmerman Thijssen, Ludovic Godet, Jinxin Fu
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Publication number: 20220064474Abstract: Embodiments described herein relate to flat optical devices and encapsulation materials for flat optical devices. One or more embodiments include a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d. The first arrangement of the first plurality of pillars includes a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first adhesion-promoting material is disposed over the first arrangement of the first plurality of pillars. A first encapsulation layer is disposed over the first adhesion-promoting material. The first encapsulation layer fills the gap g between adjacent pillars of the first plurality of pillars. The first encapsulation layer includes a fluoropolymer.Type: ApplicationFiled: August 27, 2020Publication date: March 3, 2022Inventors: Srobona SEN, Tapashree Roy, Prerna Sonthalia Goradia, Robert Jan Visser
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Publication number: 20210208308Abstract: Embodiments described herein relate to nanostructured trans-reflective filters having sub-wavelength dimensions. In one embodiment, the trans-reflective filter includes a film stack that transmits a filtered light within a range of wavelengths and reflects light not within the first range of wavelengths. The film stack includes a first metal film disposed on a substrate having a first thickness, a first dielectric film disposed on the first metal film having a second thickness, a second metal film disposed on the first dielectric film having a third thickness, and a second dielectric film disposed on the second metal film having a fourth thickness.Type: ApplicationFiled: March 25, 2021Publication date: July 8, 2021Inventors: Tapashree ROY, Rutger Meyer Timmerman Thijssen, Robert Jan Visser
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Patent number: 11001535Abstract: Embodiments of the present disclosure generally relate to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A substrate, such as a silicon wafer, is provided as a base for forming an optical device. A transparent layer is disposed on a first surface of the substrate, and a structure layer is disposed on the transparent surface. An etch mask layer is disposed on a second surface of the substrate opposite the first surface, and a window or opening is formed in the etch mask layer to expose a portion of the second surface of the substrate. A plurality of nanostructures is then formed in the structure layer, and a portion of the substrate extending from the window to the transparent layer is removed. A portion of the transparent layer having nanostructures disposed thereon is then detached from the substrate to form an optical device.Type: GrantFiled: June 25, 2019Date of Patent: May 11, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Tapashree Roy, Rutger Meyer Timmerman Thijssen
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Patent number: 10989840Abstract: Embodiments described herein relate to nanostructured trans-reflective filters having sub-wavelength dimensions. In one embodiment, the trans-reflective filter includes a film stack that transmits a filtered light within a range of wavelengths and reflects light not within the first range of wavelengths. The film stack includes a first metal film disposed on a substrate having a first thickness, a first dielectric film disposed on the first metal film having a second thickness, a second metal film disposed on the first dielectric film having a third thickness, and a second dielectric film disposed on the second metal film having a fourth thickness.Type: GrantFiled: March 15, 2018Date of Patent: April 27, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Tapashree Roy, Rutger Meyer Timmerman Thijssen, Robert Jan Visser
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Publication number: 20200400990Abstract: Embodiments described herein relate to flat optical devices and methods of forming flat optical devices. One embodiment includes a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d, and a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first encapsulation layer is disposed over the first arrangement of the first plurality of pillars. The first encapsulation layer has a refractive index of about 1.0 to about 1.5. The first encapsulation layer, the substrate, and each of the pillars of the first arrangement define a first space therebetween. The first space has a refractive index of about 1.0 to about 1.5.Type: ApplicationFiled: June 18, 2020Publication date: December 24, 2020Applicant: Applied Materials, Inc.Inventors: Ludovic GODET, Tapashree ROY, Prerna Sonthalia GORADIA, Srobona SEN, Robert Jan VISSER, Nitin DEEPAK, Tapash CHAKRABORTY
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Publication number: 20200393599Abstract: An imaging system and a method of manufacturing a metalens array is provided. The imaging system includes a metalens array, and light scattered from an object is split by the metalens array, such that an image is formed in front of an observer. The metalens array is at least partially transparent to visible light, so that the observer can also see the environment. The method of manufacturing the metalens array includes bonding together a plurality of substrates, and dicing the plurality of substrates into metalens arrays. The metalens arrays can be used in the imaging system.Type: ApplicationFiled: August 9, 2019Publication date: December 17, 2020Inventors: Jinxin FU, Tapashree ROY, Ludovic GODET, Wayne MCMILLAN, Robert J. VISSER
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Publication number: 20200339484Abstract: Embodiments of the present disclosure generally relate to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A substrate, such as a silicon wafer, is provided as a base for forming an optical device. A transparent layer is disposed on a first surface of the substrate, and a structure layer is disposed on the transparent surface. An etch mask layer is disposed on a second surface of the substrate opposite the first surface, and a window or opening is formed in the etch mask layer to expose a portion of the second surface of the substrate. A plurality of nanostructures is then formed in the structure layer, and a portion of the substrate extending from the window to the transparent layer is removed. A portion of the transparent layer having nanostructures disposed thereon is then detached from the substrate to form an optical device.Type: ApplicationFiled: June 25, 2019Publication date: October 29, 2020Inventors: Tapashree ROY, Rutger MEYER TIMMERMAN THIJSSEN
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Publication number: 20200286778Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: ApplicationFiled: May 22, 2020Publication date: September 10, 2020Inventors: Ludovic GODET, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN, Tapashree ROY, Sage Toko Garrett DOSHAY
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Publication number: 20200270746Abstract: A method and apparatus for creating a flat optical structure is disclosed. The method includes etching at least one trench in a substrate, placing a dielectric material in at least one trench in the substrate and encapsulating the top of the substrate with a film.Type: ApplicationFiled: April 25, 2019Publication date: August 27, 2020Inventors: Tapashree ROY, Rutger MEYER TIMMERMAN THIJSSEN, Ludovic GODET, Jinxin FU
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Patent number: 10707118Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: GrantFiled: February 22, 2019Date of Patent: July 7, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Ludovic Godet, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Naamah Argaman, Tapashree Roy, Sage Doshay
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Patent number: 10690808Abstract: Aspects disclosed herein relate to color filters for display devices, and more specifically to color filters for transmitting or reflecting and recycling colors of light in liquid crystal display devices. In one aspect, a metasurface is formed between two polarizers in an LCD device. In another aspect, a metasurface is formed on a white light guide of an LCD device. The metasurface is formed to transmit desired color(s) of light and to reflect undesired color(s) of light back into the light guide to be recycled and passed through the LCD device elsewhere. Using the color filter to recycle reflected colors of light increases the efficiency of the display device, such as the LCD device.Type: GrantFiled: August 20, 2018Date of Patent: June 23, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rutger Meyer Timmerman Thijssen, Robert Jan Visser, Tapashree Roy