Abstract: A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.

Abstract: A method of manufacturing solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet (2) is made porous and a dielectric coating (7) is provided on the porous face (3); an element forming stage where a solid electrolytic layer (8) and a collector layer (10) are formed on the dielectric coating (7); and a terminal forming stage where a connecting terminal (16) for connecting to an external electrode is formed. The element forming stage includes the steps of forming the solid electrolytic layer (8); a forming through-hole electrode (9) in a through-hole (5) that is prepared on the valve metal sheet (2); and forming the collector (10) on the solid electrolytic layer (8).

Abstract: A solid electrolytic capacitor having a high capacitance and excellent high frequency response including a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet.

Abstract: A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.

Abstract: A solid electrolytic capacitor includes a bulb-metal sheet of which first face has a porous section. A dielectric film, a solid electrolyte layer, and a current-collecting layer are formed in this order on the porous section. On top of the current-collecting layer, a reinforcing plate is bonded. A second face opposite to the first face of the sheet has a connecting terminal conductive to the current-collecting layer. This connecting terminal is coupled to a through-hole electrode which extends through the bulb-metal sheet for appearing outside the second face. The second face has another connecting terminal conductive to the bulb-metal sheet. This structure makes the capacitor thin, and allows the capacitor to increase its stress-resistance and be excellent in responsiveness to a high frequency as well as in mounting convenience.

Abstract: A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.

Abstract: A dielectric coating, a solid electrolytic layer and a collector layer are provided to one face of a porous valve metal sheet. An insulating section covers this metal sheet including the layers discussed above. Conductive bodies, which are coupled with a first connecting terminal and a second connecting terminal, respectively, are surfaced on at least one face of the insulating section. Connecting bumps are formed on these conductive bodies, so that ICs and other parts are coupled with these bumps. This structure realizes a thin composite electronic component having an excellent high-frequency response.

Abstract: A solid electrolytic capacitor of the present invention comprises; a valve metal sheet which is made porous, a dielectric layer formed on the porous portion, a solid electrolyte layer formed on the dielectric layer, a collector layer and an electrode exposure area formed on the solid electrolyte layer, and an insulating section electrically insulating the electrode exposure area from the collector layer, in which the electrode exposure area and the collector layer are formed on the same surface of the valve metal sheet. It is also possible to laminate a plurality of the capacitor elements. According to the present invention, a solid electrolytic capacitor realizing a reduction in size while achieving a high capacitance and excellent high frequency response is provided.

Abstract: The present invention provides a Y-type hexagonal ferrite thin film suitable for high frequency devices, having a crystal structure with the c-axis oriented perpendicular to the surface of the thin film. The present invention also provides a method of producing the Y-type hexagonal ferrite thin film, comprising the steps of preparing a viscous solution containing a metal-organic complex which is formed using a primary component including a Fe+3 ion, and a secondary component including a Ba2+ ion, at least one transition metal ion selected from the group consisting of Fe2+, Co2+, Ni2+, Zn2+, CU2+ and Mn2+; and optionally at least one metal ion selected from the group consisting of Sr2+, Ca2+ and Pb2+, forming a film having a Y-type ferrite composition on a surface made of noble metal through a coating process using the viscous solution, and burning the film at a temperature of 750° C. or more.

Abstract: A turbine generating apparatus includes a control unit which controls the turbine generating apparatus as follows. During a system connection running mode, a fuel is fed to the gas turbine at a fuel flow rate corresponding to a preset load. The converter prepares a pseudo-system in which a frequency conforms to a set rotational speed of the gas turbine at the preset load, and converts an output of the generator to a direct current in a state that a number of revolutions of the gas turbine is specified by operating the generator synchronously with the pseudo-system. A power to be taken out is controlled depending on a magnitude of a turbine output. The inverter converts a DC voltage output from the converter to an AC voltage by a pulse width modulation at a system voltage and a system frequency so as to keep the DC voltage output from the converter at a predetermined voltage.

Abstract: A method of manufacturing the solid electrolytic capacitors that can be directly connected to semiconductor components and have a faster response to a high frequency as well as a larger capacitance includes: a dielectric forming stage where a valve metal sheet (2) is made porous and dielectric coating (7) is provided on the porous face (3); an element forming stage where solid electrolytic layer (8) and collector layer (10) are formed on the dielectric coating (7); and a terminal forming stage where connecting terminal (16) to an external electrode is formed. The element forming stage includes the steps of: forming solid electrolytic layer (8); forming through-hole electrode (9) in through-hole (5) that is prepared on valve metal sheet (2); and forming collector (10) on solid electrolytic layer (8).

Abstract: A management apparatus and a management method which can forecast inspection time before the lowering of performance or the occurrence of abnormality in a heat source unit for an air conditioner are provided. The operating condition of the air conditioner heat source unit is monitored by a central monitoring unit of the management apparatus connected to the heat source unit through an information communication network. Operating data of the heat source unit is analyzed so that the lowering of the performance and the advance of the degree of abnormality in the heat source unit are diagnosed. Thus, the loss of a user caused by the failure stop or the performance lowering of the heat source unit is reduced. Further, the load on the heat source unit is grasped by the central monitoring unit so that remote central control is carried out to make the operating cost minimal.

Abstract: A dielectric coating (3), a solid electrolytic layer (4) and a collector layer (5) are provided to one face of a porous valve metal sheet (1). An insulating section (7) covers overall this metal sheet (1) including the layers (3, 4, 5) discussed above. Conductive bodies (101, 111), which are coupled with a first connecting terminal (2) and a second connecting terminal (6) respectively, are surfaced on at least one face of the insulating section (7). Connecting bumps (12) are formed on these conductive bodies (101, 111), so that ICs (17) and other parts are coupled with these bumps (12). This structure realizes a thin composite electronic component excellent in high-frequency response.

Abstract: A method of manufacturing aluminum-substituted hematite represented by &agr;-(Fe1−xAlx)2O3 where x=0.01 to 0.15, by mixing an iron compound and an aluminum compound such that an atomic ratio of Fe to Al falls within the range of 99:1 to 85:15, adding citric acid and ethylene glycol to the mixture of the iron compound and aluminum compound to produce a gel, and pyrolyzing the gel, followed by calcining the pyrolyzed product.

Abstract: A method for manufacturing solid electrolytic capacitor that can be mounted direct on a semiconductor component and offers a superior high frequency characteristic. An aluminum foil 20 is provided on one surface with a resist film 23 and then with a through hole 24. Next, an insulation film 25 is formed to cover the other surface of aluminum foil 20 and to fill the first through hole, and then the resist film 23 is removed; and then the surface of aluminum foil 20 is roughened to be provided with a dielectric layer 27 thereon. A second through hole 36 is formed in the insulation film 25, which is filling the first through hole 24. A through hole electrode 28 is formed in the second through hole; and then, on the surface of the dielectric layer 27, a solid electrolytic layer 29 and a collector layer 30 are formed. After an opening 37 is provided, a first connection terminal 31 is formed therein, and a second connection electrode 32 on the exposed surface of the through hole electrode 28.

Abstract: A method for manufacturing large capacitance solid electrolytic capacitors that can be connected direct with semiconductor component, and offer a superior high frequency characteristic. An aluminum foil 3 is made porous in one of the surfaces, a dielectric layer 2 is formed on the porous portion, a through hole 4 is provided in the aluminum foil 3 at a certain specific location. An insulation layer 5 is formed to cover the other surface, viz. non-porous surface, of the aluminum foil 3 and the inner wall surface of through hole 4, a solid electrolytic layer 6 is provided on the dielectric layer 2, and a through hole electrode 7 is formed in the through hole 4, and then a collector layer 8 is formed on the solid electrolytic layer 6. The insulation layer 5 disposed on aluminum foil 3 is provided with an opening 9 at a certain specific location, and a connection terminal 10 is provided at the opening 9 of insulation layer 5 and the exposed surface of the through hole electrode 7, respectively.

Abstract: A management apparatus and a management method which can forecast inspection time before the lowering of performance or the occurrence of abnormality in a heat source unit for an air conditioner are provided. The operating condition of the air conditioner heat source unit is monitored by a central monitoring unit of the management apparatus connected to the heat source unit through an information communication network. Operating data of the heat source unit is analyzed so that the lowering of the performance and the advance of the degree of abnormality in the heat source unit are diagnosed. Thus, the loss of a user caused by the failure stop or the performance lowering of the heat source unit is reduced. Further, the load on the heat source unit is grasped by the central monitoring unit so that remote central control is carried out to make the operating cost minimal.

Abstract: The anisotropic conductive adhesives containing the conductive, multilayer-structured resin particles in which at least one inner layer is more flexible than the outermost layer and is chemically bound to at least one of the two adjacent layers and the surface of the outermost layer is covered with a metal make connections at lowered pressure enough to suppress development of cracking of the ITO electrode and also can provide enhanced stability, especially stability of connection over a prolonged period of time.

Abstract: A two-stage absorption refrigerating apparatus includes an integrated drum in which a low-pressure evaporator and a low-pressure absorber are arranged in an upper part and a high-pressure evaporator and a high-pressure absorber are arranged in a lower part. Uncondensed gas resulted in a high-temperature generator and elsewhere successively moves toward a low-pressure side along with a circulation of refrigerant and solution. The uncondensed gas deposited in the high-pressure absorber is extracted by bleeding device, and the uncondensed gas deposited in the low-pressure absorber is extracted by an ejector. The extracted uncondensed gas is stored into a gas storage tank via a gas-liquid separator. A valve is provided on the gas storage tank.

Abstract: A liquid distributor, a falling film heat exchanger and an absorption refrigerating machine, which are inexpensive and favorably ensure uniform distribution of a liquid even in the case where the liquid distributor is installed in oblique position and foreign matters such as metal particles or the like are mixed in the liquid. The liquid distributor comprise a primary distribution duct of box-shaped cross section having an opening serving as a liquid inlet, and distribution holes serving as liquid outlets and formed on side surfaces of the primary distribution duct, and a group of box-shaped secondary distribution trays spaced from outer side surface and lower side surface of the primary distribution duct, and formed to be compartmented into a plurality of regions in a longitudinal direction of the primary distribution duct. Liquid dripping holes, through which the liquid is dropped, are formed in bottom surfaces of the secondary distribution trays.