Abstract: This disclosure discloses a motor including a motor body unit configured to output rotation power, a brake unit fixed to a housing of the motor body unit with a bolt, and a collar. The collar is arranged between the motor body unit and the brake unit, and in which the bolt is inserted. The collar forms a space between the housing of the motor body unit and a fixing member of the brake unit. The collar is fixed with its end portion being inserted into at least one of the housing and the fixing member.

Abstract: A filler plug is configured such that: a head portion is formed on an upper end of an external thread; a sealing portion formed at the head portion strongly contacts a funnel-shaped inclined inner peripheral surface formed at one end of an internal thread of a hydraulic device oil passage by tightening the external thread with respect to the internal thread; an upper peripheral surface of the sealing portion is tapered; a circular constricted portion is formed between the sealing portion and the upper end of the external thread; and a dimensionless value of a head portion height H1 from an upper surface of the head portion to the sealing portion, that is, a dimensionless value obtained by dividing the head portion height H1 by a nominal designation value of the external thread portion, ranges from 0.4 to 0.7.

Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.

Abstract: An apparatus in a system which includes at least a high-level apparatus and a plurality of low-level apparatuses, said apparatus being one of the low-level apparatuses. The apparatus includes a storage unit configured to store an individual certificate set and a common certificate set and a communication unit configured to transmit own authentication information to the high level apparatus to allow the high level apparatus to perform decryption to authenticate the validity of the apparatus.

Abstract: A communication apparatus has a communication part and authenticates a communication partner by using a digital certificate. The communication apparatus includes an authentication part carrying out authentication of the communication partner by using a common certificate. The common certificate is a digital certificate not including identification information of an apparatus. An individualized certificate transmission part acquires, in the case the authentication by the authentication part has been made successfully, an individualized certificate and transmits the individualized certificate to the communication partner. The individualized certificate is a digital certificate including identification information of the communication partner.

Abstract: An agent device is connected with one or more image-forming devices in a local network having a firewall provided therein. A management device carries out remote management of the image-forming devices in the local network through the Internet. The agent device includes a command receiving unit which starts connection with the management device and receives a management command from the management device via the firewall, the command being sent by the management device in response to the connection. An image-forming-device communication unit receives device-state information of a corresponding one of the image-forming devices according to the management command. A command response transmitting unit transmits the device-state information to the management device through the Internet.

Abstract: An agent device is connected with one or more image-forming devices in a local network having a firewall provided therein. A management device carries out remote management of the image-forming devices in the local network through the Internet. The agent device includes a command receiving unit which starts connection with the management device and receives a management command from the management device via the firewall, the command being sent by the management device in response to the connection. An image-forming-device communication unit receives device-state information of a corresponding one of the image-forming devices according to the management command. A command response transmitting unit transmits the device-state information to the management device through the Internet.

Abstract: A filler plug is configured such that: a head portion is formed on an upper end of an external thread; a sealing portion formed at the head portion strongly contacts a funnel-shaped inclined inner peripheral surface formed at one end of an internal thread of a hydraulic device oil passage by tightening the external thread with respect to the internal thread; an upper peripheral surface of the sealing portion is tapered; a circular constricted portion is formed between the sealing portion and the upper end of the external thread; and a dimensionless value of a head portion height H1 from an upper surface of the head portion to the sealing portion, that is, a dimensionless value obtained by dividing the head portion height H1 by a nominal designation value of the external thread portion, ranges from 0.4 to 0.7.

Abstract: An apparatus in a system which includes at least a high-level apparatus and a plurality of low-level apparatuses, said apparatus being one of the low-level apparatuses. The apparatus includes a storage unit configured to store an individual certificate set and a common certificate set and a communication unit configured to transmit own authentication information to the high level apparatus to allow the high level apparatus to perform decryption to authenticate the validity of the apparatus.

Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

Abstract: An apparatus in a system which includes at least a high-level apparatus and a plurality of low-level apparatuses, said apparatus being one of the low-level apparatuses. The apparatus includes a storage unit configured to store an individual certificate set and a common certificate set and a communication unit configured to transmit own authentication information to the high level apparatus to allow the high level apparatus to perform decryption to authenticate the validity of the apparatus.

Abstract: A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.

Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.

Abstract: An insulating bobbin for disposition between a stator core and a stator winding of a stator of a rotating machine, the stator winding being wound around the stator core by way of the insulating bobbin, the insulating bobbin comprising a coil end section at which an end portion of the stator winding is disposed, a slot side section forming a slot for winding thereon the stator winding, and a corner section having a curved surface and connecting between the coil end portion and the slot side portion, the corner section having a first radius of curvature at a side closer to the coil end section and a second radius of curvature at a side closer to the slot side section, the second radius of curvature being larger than the first radius of curvature.

Abstract: A communication apparatus includes an authentication part for authenticating another communication apparatus with a first digital certificate, and a certificate transmission part for transmitting a second digital certificate when the authentication part succeeds in authenticating the other communication apparatus with the first digital certificate.

Abstract: A communication apparatus has a communication part and authenticates a communication partner by using a digital certificate. The communication apparatus includes an authentication part carrying out authentication of the communication partner by using a common certificate. The common certificate is a digital certificate not including identification information of an apparatus. An individualized certificate transmission part acquires, in the case the authentication by the authentication part has been made successfully, an individualized certificate and transmits the individualized certificate to the communication partner. The individualized certificate is a digital certificate including identification information of the communication partner.

Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.

Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.