Abstract: A covered wire connection structure is formed by the steps of: pinching a covered wire with a pair of resin chips; pressing and exciting a cover portion of the wire by ultrasonic vibration so as to conductively connect conductive portions of both the covered wires at the connection portion; and melting a pair of the resin chips so as to seal the connection portion. The resin chip comprises main melting portions for pinching the connection portion which are melted to a mating resin chip so as to seal the connection portion, and auxiliary melting portions which are formed of material compatible with the cover portion of the covered wire introduced from the main melting portions and pinch the cover portion such that they are melted to the mating resin chip. The auxiliary melting portions and cover portion of the covered wire are melted together and integrated so as to seal an introductive portion of the covered wire from the resin chips.

Abstract: A semiconductor memory device includes a first test row decoder (9a) for selecting memory cells in normal rows in a test mode, a second test row decoder (9b) for selecting spare memory cell rows, a first test column decoder (10a) for selecting memory cells in normal columns, and a second test column decoder (10b) for selecting spare memory cell columns. A control circuit (11) may perform switching between four combinations of the row and column decoders by using a control signal (SRT) and a control signal (SCT). All spare memory cells are tested prior to reparation of a defective memory cell for yield enhancement.

Abstract: In a muffler for internal combustion engine which is provided with a valve capable of closing and opening an open end of by-pass inner pipe, the opening and closing operation of the valve is performed via the exhaust gas pressure, without being affected by external factors. Also, the structure is simple and easy to be assembled. On a fixed shaft (36) supported in the vicinity of an open end (28a) of a by-pass inner pipe (28) is a valve (32) rotatably mounted. The valve (32) is urged against the open end (28a) by a coil spring (42), and when fitted in a flange part (38), it closes the open end (28a). When the revolving speed of the internal combustion engine is low, the pressure inside the by-pass inner pipe (28) is smaller than the operative force which is an addition of the urging force by the coil spring (42) and the external pressure. The open end (28a) is therefore closed.

Abstract: In a semiconductor memory device, a self refresh cycle program circuit is provided and a refresh operation is conducted in accordance with one of the refresh cycles programmed in the refresh-cycle program circuit. The refresh cycle of the self-refresh mode is selected from a plurality of refresh-cycle types. A plurality of refresh modes allows a refresh cycle to be selected from a plurality of refresh-cycle types in accordance with a selected refresh mode.

Abstract: A waterproof structure for a wire leading part of a housing is provided. The structure includes two cover bodies and two waterproof members carried by the cover bodies. The waterproof members are made of elastic materials which are soluble in each other and fusible in insulating covers of wires by ultrasonic oscillation under pressure. At the mutual welding of the cover bodies by the ultrasonic oscillation, the waterproof members are fused in each other, the waterproof members are fused in the insulating covers and the cover bodies are welded to the housing.

Abstract: Two NAND gates are provided corresponding to each of a plurality of pads. By connecting a mode switching pad to power supply potential or ground potential, one of the two NAND gates provided corresponding to each pad is activated, and the other NAND gate is non-activated. As a result, different mode select signals are provided from the output of each NAND gate.

Abstract: In a muffler for an internal combustion engine which is provided with a valve capable of closing and opening an open end of a by-pass inner pipe, the opening and closing operation of the valve is performed by means of the exhaust gas pressure, without being affected by external factors. Also, the structure is simple and easy to be assembled. On a fixed shaft (36) supported proximate an open end (28a) of a by-pass inner pipe (28) is a valve (32), rotatably mounted. The valve (32) is urged against the open end (28a) by a coil spring (42), and when fitted in a flange part (38), it closes the open end (28a). When the revolving speed of internal combustion engine is low, the pressure inside the by-pass inner pipe (28) is smaller than the operative force which is an addition of the urging force by the coil spring (42) and the external pressure. The open end (28a) is therefore closed.

Abstract: A semiconductor memory device includes a first test row decoder (9a) for selecting memory cells in normal rows in a test mode, a second test row decoder (9b) for selecting spare memory cell rows, a first test column decoder (10a) for selecting memory cells in normal columns, and a second test column decoder (10b) for selecting spare memory cell columns. A control circuit (11) may perform switching between four combinations of the row and column decoders by using a control signal (SRT) and a control signal (SCT). All spare memory cells are tested prior to reparation of a defective memory cell for yield enhancement.

Abstract: An imidazoline derivative or possible tautomer thereof, represented by the formula (1), wherein n represents one of integers "1" through "4", and R.sub.1 and R.sub.2 represent hydrogen atom, lower alkyl, aryl, aralkyl group, or R.sub.1 and R.sub.2 cooperate to represent alkylene, alkylidene or arylalkylidene group, while R.sub.3 represents a nitrogen-containing aromatic ring that may be substituted by lower alkyl, alkoxy or alkanoyl group, or a substituted phenyl group represented by the formula (2), wherein R.sub.4 and R.sub.5 represent hydrogen atom, lower alkyl group that may be substituted by halogen atom or hydroxyl group, cycloalkylalkyl group, lower alkenyl group, lower alkanoyl group that may be substituted by halogen atom, lower alkoxyalkyl or alkoxycarbonyl group, arylcarbonyl, arylalkyl or arylalkoxycarbonyl group, lower alkylaminocarbonyl or alkylsulfonyl group or arylsulfonyl group, or R.sub.4 and R.sub.5 cooperate with an adjacent nitrogen atom to constitute a cyclic structure, while R.sub.

Abstract: An imidazole derivative represented by one of formulas (1), wherein R.sub.1, R.sub.2 represents hydrogen atom, lower alkyl, aryl, aralkyl group, or R.sub.1 and R.sub.2 cooperate to represent alkylene, alkylidene, arylalkylidene group, R.sub.3 representing hydrogen atom, lower alkyl or alkanoyl group, or aralkyl or arylcarbonyl group, wherein at least one of A and B represents a group represented by formula (2), wherein m represents an integer 1-4, R.sub.4 representing nitrogen-containing aromatic ring that may be substituted by lower alkyl, alkoxy or alkanoyl group, or phenyl group represented by formula (3), R.sub.5, R.sub.6 representing hydrogen atom, lower alkyl or alkenyl group, or lower alkanoyl or arylcarbonyl group which may be substituted by a halogen atom, R.sub.

Abstract: A cylindrical waterproof rubber plug to be inserted into a hole formed in a housing is provided. The center of the waterproof rubber plug, has a through-hole into which a wire of outer diameter A is inserted. The plug consists of a main body part and a crimping part of inner diameter B formed integral with the main body part. The dimensions A and B are related by the equation (A-B)/B=0.1.about.0.8. Thus, even when the wire engaged in the plug is obliquely bent, sufficient sealability can be ensured.

Abstract: A copper alloy for use in an electrical and electronic parts contains Fe of 1.8-2.0 weight %, P of 0.025-0.040 weight %, Zn of 1.7-1.9 weight %, Sn of 0.40-1.0 weight %, and Ca of 0.0001-0.01 weight %, the balance being Cu and inevitable impurities. Further the copper alloy may contain one kind or two kinds of the elements selected from the group of Cr of 0.001-0.01 weight % and Mg of 0.001-0.01 weight %, by 0.001-0.01 weight % at a total amount. This copper alloy for use in electrical and electronic parts can dissolve the prior problem that cracking is apt to occur on the ingot during heating on the hot working process or during hot working, and can prevent a short-circuit due to the migration phenomenon of copper which is apt to occur with the high density integration of the electrical and electronic parts made of copper alloy, and further can improve the tool service life (wear resistance) of the die and can decrease the producing cost thereof.

Abstract: A waterproof connector includes a housing having a cavity formed therein, and a male terminal inserted in the housing, the male terminal being connected to a covered wire. A front end portion of a covering of the covered wire of a small diameter is placed on a surface of a base plate, and is clamped. The male terminal, connected to the small-diameter covered wire with a rubber plug, is inserted into the housing, and the rubber plug is fitted in the cavity formed in a rear end portion of the housing. The cavity is formed in the housing in such a manner that a centerline of the cavity is offset from a centerline of the rubber plug in a direction X away from the base plate surface.

Abstract: In a dynamic random access memory device, first, second and third switches and an internal signal generator therefor are provided besides circuit portions of an ordinary random access memory such as a memory cell. A data input circuit includes data input pins for receiving an input data and data-in-buffers for storing the input data. The first switch can connect one of data input pins to either one of data in buffers or an end of a signal line. The second switch can connect the data-in-buffers to a data output circuit. The third switch can connect the internal voltage supply line to either an internal voltage generator or the other end of the signal line. When a memory is tested, the switch signal generator generates signals so as to make the first switch connect the one of said input pins to the end of the signal line, to make the second switch to connect the data in buffer to the data output circuit, and to make the third switch to connect an internal voltage supply line to the other end of the signal line.

Abstract: Disclosure is to provide a terminal for a connector including an engagement mechanism which assures that the terminal can reliably be held in an electrical insulative housing in the engaged state while generating excellent terminal holding force and exhibiting high reliability. The terminal is made of a sheet of metallic material having electrical conductivity and includes an cable connecting portion, a rectangular column-shaped electrical contact portion, engagement pieces formed by cutting and bending a part of one wall of the electrical contact portion in the upward direction, and shock absorbing portions formed by inwardly folding rear edge portions of the engagement pieces. Engagement projections projecting from an insert pin of the connector including an engagement mechanism are brought into contact with the engagement pieces of the terminal with an increased contact area.

Abstract: A connector comprising a housing comprising a polybutylene terephthalate resin composition comprising:(A) 100 parts by weight of a polybutylene terephthalate resin having an intrinsic viscosity of from 1.10 to 1.30 dl/g as measured in o-chlorophenol at 25.degree. C.;(B) from 40 to 60 parts by weight of a copolymer of acrylonitrile and styrene;(C) from 10 to 20 parts by weight of a graft copolymer comprising:(C1) from 65 to 75% by weight of copolymer comprising from 75 to 85% by weight of ethylene and from 25 to 15% by weight of glycidyl methacrylate, and(C2) from 25 to 35% by weight of a copolymer of acrylonitrile and styrene;(D) from 0.05 to 0.5 part by weight of a hindered phenol compound represented by formula (I): ##STR1## (E) from 0.05 to 0.5 part by weight of a thioether compound represented by the following formula (II):(R.sub.3 SR.sub.4 COOCH.sub.2).sub.m C(CH.sub.2 OH).sub.4-m (II)wherein the variables are defined in the specification.

Abstract: Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.

Abstract: A connector comprising a housing comprising a resin composition comprising (A) from 30 to 90% by weight of an aromatic polyester, (B) from 5 to 40% by weight of a modified polyolefin, and (C) from 5 to 30% by weight of a polyglutarimide having a repeating unit represented by the following formula (1): ##STR1## wherein R.sup.1 and R.sup.2 each represents a hydrogen atom or a lower alkyl group, and R.sup.3 represents a hydrogen atom, an alkyl group, an aryl group, an alkaryl group, or an aralkyl group.

Abstract: A connector comprising a housing comprising a resin composition comprising:(A) from 50 to 95 parts by weight of a semi-aromatic polyamide comprising (A1) an adipate of hexamethylenediamine and (A2) a terephthalate of hexamethylenediamine, where the weight ratio of the adipate of hexamethylenediamine (A1) to the terephthalate of hexamethylenediamine (A2) is from 80/20 to 50/50; and(B) from 5 to 50 parts by weight of a modified polyolefin comprising (B1) a polyolefin copolymer comprising (B11) propylene and (B12) ethylene where the molar ratio of propylene (B11) to ethylene (B12) is from 90/10 to 99/1, the polyolefin copolymer (B1) being graft-modified with (B2) from 0.05 to 5 parts by weight of an .alpha.,.beta.-unsaturated carboxylic acid, an anhydride thereof, or a derivative thereof per 100 parts by weight of the polyolefin copolymer (B1).

Abstract: A connector comprising a housing comprising a resin composition comprising (A) 100 parts by weight of a 4,6-nylon resin, (B) from 80 to 120 parts by weight of a polyphenylene ether resin modified with an unsaturated organic acid compound, and (C) from 0.1 to 0.4 part by weight of a copper halide.