Abstract: Various techniques are disclosed for an illuminator and related methods to be used with a wafer prober to provide illumination (e.g., visible and/or non-visible electromagnetic radiation) to perform testing, calibration, and/or inspection of devices on a wafer. For example, an illuminator may include a plurality of radiation sources, a reflector, an actuator for the reflector, a shutter, an actuator for the shutter, and/or a light pipe. Various components of the illuminator may interface with a wafer prober to provide sufficiently uniform and stable illumination with fast-switching intensities, wavelengths, and/or other properties. Such illumination provided by various embodiments of the illuminator may permit the wafer prober to perform high-throughput testing, calibration, and/or inspection of devices that may be fabricated and/or packaged on a wafer.

Abstract: Various techniques are disclosed for providing systems for providing alignment guide information to selectively direct a visible light source to substantially align the visible light source with a desired subject and to project a visible light beam substantially on the desired subject. For example, a system may include a small form factor infrared imaging module to capture thermal images of a scene, which may be received by a processor to generate alignment guide information such as a user-viewable image of the scene, a user-viewable cue, and a framing reticle. In another example, such a system may be implemented as a camera. In yet another example, such a system may be implemented as a spotlight.

Abstract: Systems and methods are disclosed that provide an infrared-transmissive dome, such as for infrared imaging applications. For example, an infrared-transmissive dome, for an embodiment, includes a main body providing a hollow, hemispherical-shaped dome; wherein the main body is made of an ultra-high molecular weight or a very-high molecular weight polyethylene material; and wherein the main body has a wall thickness equal to or less than approximately 0.012 inches to allow infrared transmittance greater than approximately sixty five percent through the main body for infrared imaging in a wavelength range of approximately three to fourteen micrometers.

Abstract: Wearable systems with thermal imaging capabilities may be provided for detecting the presence and location of persons or animals in an environment surrounding the system in accordance with an embodiment. A wearable system may include a wearable structure such as a helmet with a plurality of imaging modules mounted to the wearable structure. An imaging module may include one or more imaging components such as infrared imaging modules and visible light cameras. Thermal images captured using the infrared imaging modules may be used to detect the presence of a person in the thermal images. The wearable imaging system may include one or more alert components that alert the wearer when a person is detected in the thermal images. The alert components may be used to generate a location-specific alert that alerts the wearer to the location of the detected person. A wearable imaging system may be a multidirectional threat monitoring helmet.

Abstract: Systems and methods are disclosed that provide an infrared-transmissive dome, such as for infrared imaging applications. For example, an infrared camera system includes a housing having a lens coupled to the housing and an infrared detector within the housing configured to receive infrared energy passing through the lens. An infrared-transmissive dome, coupled to the infrared camera system, includes a main body providing a hollow, hemispherical-shaped dome, with the main body made of an ultra-high molecular weight or a very-high molecular weight polyethylene material. The main body may have a wall thickness equal to or less than approximately 0.012 inches to allow infrared transmittance greater than approximately sixty five percent through the main body to the lens for infrared imaging in a wavelength range of approximately three to fourteen micrometers.

Abstract: An infrared camera architecture includes, for an embodiment, an infrared detector, a substrate, a plurality of electrical components coupled to the substrate, and a pedestal made of a thermally conductive material and having a leg coupled to the substrate. The infrared detector is supported by and thermally coupled to the pedestal, with the pedestal thermally isolating the infrared detector from the plurality of electrical components.

Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

Abstract: Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Triple fusion processing, including selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

Abstract: Various techniques are provided for using one or more shielded (e.g., blinded, blocked, and/or obscured) infrared sensors of a thermal imaging device. In one example, a method includes capturing a signal from a shielded infrared sensor that is substantially blocked from receiving infrared radiation from a scene. The method also includes capturing a signal from an unshielded infrared sensor configured to receive the infrared radiation from the scene. The method also includes determining an average thermographic offset reference for the shielded and unshielded infrared sensors based on the captured signal of the shielded infrared sensor. The method also includes determining an absolute radiometric value for the scene based on the average thermographic offset reference and the captured signal of the unshielded infrared sensor.

Abstract: Various techniques are disclosed for smart surveillance camera systems and methods using thermal imaging to intelligently control illumination and monitoring of a surveillance scene. For example, a smart camera system may include a thermal imager, an IR illuminator, a visible light illuminator, a visible/near IR (NIR) light camera, and a processor. The camera system may capture thermal images of the scene using the thermal imager, and analyze the thermal images to detect a presence and an attribute of an object in the scene. In response to the detection, various light sources may be selectively operated to illuminate the object only when needed or desired, with a suitable type of light source, with a suitable beam angle and width, or in otherwise desirable manner. The visible/NIR light camera may also be selectively operated based on the detection to capture or record surveillance images containing objects of interest.

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Abstract: Techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor aspects of a power system. A system may include one or more infrared imaging modules, a processor, a memory, a display, a communication module, and modules to control components of a power system. Infrared imaging modules may be mounted on, installed in, or otherwise integrated with a power system having one or more power system components. The infrared imaging modules may be configured to capture thermal images of portions of the power system. Various thermal image analytics and profiling may be performed on the captured thermal images to determine the operating conditions and temperatures of portions of the power system. Monitoring information may be generated based on the determined conditions and temperatures and then presented to a user of the power system.

Abstract: Various techniques are provided for systems and methods to process images to reduce consumption of an available output dynamic range by the sky in images. For example, according to one or more embodiments of the disclosure, a region or area in images that may correspond to the sky may be identified based on the location of the horizon in the images. A distribution of irradiance levels in the identified sky region may be analyzed to determine a dynamic range attributable to the sky region. A transfer function that compresses the dynamic range attributable to the sky region may be generated and applied so that the sky in the images may be suppressed, thereby advantageously preserving more dynamic range for terrestrial objects and other objects of interest in the images.

Abstract: An infrared camera architecture includes, for an embodiment, an infrared detector, a substrate, a plurality of electrical components coupled to the substrate, and a pedestal made of a thermally conductive material and having a leg coupled to the substrate. The infrared detector is supported by and thermally coupled to the pedestal, with the pedestal thermally isolating the infrared detector from the plurality of electrical components.

Abstract: Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

Abstract: Various techniques are disclosed for systems and methods using thermal imaging to intelligently monitor thoroughfares. For example, an intelligent monitoring system may include an infrared imaging module, a processor, a communication module, a memory, and an adjustable component. The system may be mounted, installed, or otherwise disposed at various locations along thoroughfares, and capture thermal images of a scene that includes at least a portion of the thoroughfares. Various thermal image processing and analysis operations may be performed on the thermal images to generate comprehensive monitoring information including an indication of detected objects in the scene and at least one attribute associated with the objects. Various actions may be taken, such as generating various alarms and intelligently adjusting operation of various adjustable devices on thoroughfares, based on the monitoring information.

Abstract: Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select the current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.

Abstract: Techniques are disclosed for measurement devices and methods to obtain various physical and/or electrical parameters in an integrated manner. For example, a measurement device may include a housing, an optical emitter, a sensor, a distance measurement circuit, a length measurement circuit, an electrical meter circuit, a display, an infrared imaging module, and/or a non-thermal imaging module. The device may be conveniently carried and utilized by users to perform a series of distance measurements, wire length measurements, electrical parameter measurements, and/or fault inspections, in an integrated manner without using multiple different devices. In one example, electricians may utilize the device to perform installation of electrical wires and/or other tasks at various locations (e.g., electrical work sites). In another example, electricians may utilize the device to view a thermal image of one or more scenes at such locations for locating potential electrical faults.

Abstract: Techniques are provided to implement line based processing of thermal images and a flexible memory system. In one example, individual lines of a thermal image frame may be provided to an image processing pipeline. Image processing operations may be performed on the individual lines in stages of the image processing pipeline. A memory system may be used to buffer the individual lines in the pipeline stages. In another example, a memory system may be used to send and receive data between various components without relying on a single shared bus. Data transfers may be performed between different components and different memories of the memory system using a switch fabric to route data over different buses. In another example, a memory system may support data transfers using different clocks of various components, without requiring the components and the memory system to all be synchronized to the same clock source.