Abstract: An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers.

Abstract: Packaged optoelectronic device include a first barrier layer having a plurality of feedthrough apertures communicating with at least one electrode layer of the device, and a plurality of conductive patches disposed on at least one of the plurality of feedthrough apertures for electrically connecting the device to a power supply. Each conductive patch includes a conductive metal surface layer and a non-conducting surface layer having an opening exposing the metal surface layer.

Abstract: Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator.

Abstract: A method of forming a waveguide including a core region, a cladding region, and an index contrast region situated therebetween includes depositing a polymerizable composite on a substrate to form a layer, patterning the layer to define an exposed area and an unexposed area of the layer, irradiating the exposed area of the layer, and volatilizing the uncured monomer to form the waveguide, wherein the polymerizable composite includes a polymer binder and sufficient quantities of an uncured monomer to diffuse into the exposed area of the layer and form the index contrast region. The resulting waveguide includes an index contrast region which has a lower index of refraction than that of the core and cladding regions.

Abstract: A base composition is provided. The base composition includes a binder, a reactive monomer, and an anti-haze additive. The binder may include an optically transmissive polymer. The reactive monomer may be both curable and volatile. The binder and the reactive monomer have differing refractive indices relative to each other. A cured layer formed from the base composition may be formed into an article have particular properties. A method of making the layer is provided.

Abstract: An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers.

Abstract: Disclosed is an optical device structure comprising a low shrinkage mixture wherein the shrinkage of the mixture is limited after the curing of the mixture during optical device formation. Disclosed also are methods for forming optical devices which comprise the low shrinkage mixture.

Abstract: A barrier coating for a composite article is provided. The barrier coating includes an organic zone; an inorganic zone; and an interface zone between the organic zone and the inorganic zone.

Abstract: An optical device structure includes a first cladding having a first refractive index, a second cladding having a second refractive index, a core disposed between the first and second claddings, wherein the core has a third refractive index, and wherein the first and second refractive indices are relatively lower than the third refractive index, and a diffusion region disposed between the core and one of the first cladding, the second cladding, or both. A method for making the aforementioned optical device structure is provided.

Abstract: A method of fabricating a stamping mold suitable for use in the formation of a tapered waveguide structure includes defining a stamping pattern upon the surface of a silicon wafer, and removing portions of the silicon wafer surface in accordance with the stamped pattern, thereby creating tapered vertical surfaces within the wafer.

Abstract: Disclosed herein are data storage media and methods of making the same. The data storage media, comprises: primary surface features disposed on at least one side of said data storage media; and secondary features superimposed over at least a portion of said surface features. In one embodiment, the method for manufacturing the data storage media comprises: disposing an identifier layer onto a surface of a stamper, said stamper having primary surface features on a first side of said stamper opposite said identifier layer; forming secondary features on an exposed surface of said identifier layer; installing said stamper into a mold; injecting a molten plastic material into the mold, wherein said molten plastic physically contacts said first side; cooling said plastic to form said data storage media, such that a positive image of said primary surface features and of said secondary features are formed into at least a portion of a surface of said plastic; and releasing said data storage media from said mold.

Abstract: A method for manufacturing an embossed surface including a polymer composition having reactive moieties and a first glass transition temperature of Tg1. The method includes embossing the surface at temperature Temb; and raising the first glass transition temperature Tg1 of the embossed polymeric surface to a second glass transition temperature Tg2 such that Tg2>Temb. In another embodiment, a method for improving the release of a polymeric surface from an embossing tool includes incorporating of one or more of fluorine atoms, silicon atoms, or siloxane segments into the backbone of the polymer. The methods are particularly suited for direct patterning of photoresists, fabrication of interdigitated electrodes, and fabrication of data storage media.

Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

Abstract: In one embodiment, the method for producing a stamper, comprises: forming a nickel plated substrate having desired surface features on one side; disposing a managed heat transfer layer on a second side of said substrate; forming a thickness of said managed heat transfer layer having a variation of less than about 5%; and altering said exposed surface of said managed heat transfer layer. Also disclosed are a method and apparatus for producing data storage media.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip, and an encapsulant comprising a composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: In one embodiment, the method for producing a stamper, comprises: forming a nickel plated substrate having desired surface features on one side; disposing a managed heat transfer layer on a second side of said substrate; forming a thickness of said managed heat transfer layer having a variation of less than about 5%; and altering said exposed surface of said managed heat transfer layer. Also disclosed are a method and apparatus for producing data storage media.

Abstract: A method of forming an optical device structure having a first region and a second region. The method comprises: providing a polymerizable composite comprising a polymer binder and an uncured monomer, depositing the polymerizable composite on a substrate to form a layer, patterning the layer to define an exposed area and an unexposed area of the layer, irradiating the exposed area of layer, and volatilizing the uncured monomer to form the optical device structure. The step of volatilizing the uncured monomer forms a surface topography and a compositional change between the first region and the second region. The compositional change creates a gradient in refractive index between the first region and the second region.

Abstract: An optical device structure comprising a substrate and at least one topological feature. The topological feature comprises a polymeric composite material formed from a polymerizable binder and an uncured monomer. The topological feature has a controlled topological profile and a controlled refractive index across the topological feature. The optical device structure may be a multimode waveguide device, a single mode waveguide device, an optical data storage device, thermo-optic switches, or microelectronic mechanical system.

Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip, and an encapsulant comprising a composition of the invention. A method of encapsulating a solid state device is also provided.