Patents by Inventor Thomas Dory

Thomas Dory has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant multi-composition interconnects
    Publication number: 20050239275
    Abstract: A compliant interconnect with two or more layers of metal of two or more compositions with internal stresses is described herein.
    Type: Application
    Filed: April 26, 2004
    Publication date: October 27, 2005
    Inventors: Sriram Muthukumar, Thomas Dory
  • Deep via seed repair using electroless plating chemistry
    Publication number: 20050067295
    Abstract: Methods of forming a continuous seed layer in a high aspect via and its associated structures are described. Those methods comprise forming a recess in a substrate, forming a non-continuous metal layer within the recess, activating the non-continuous metal layer and a plurality of non-deposited regions within the recess, electrolessly depositing a seed layer on the activated non-continuous metal layer and the plurality of non-deposited regions within the recess, and electroplating a metal fill layer over the seed layer, to form a substantially void-free metal filled recess.
    Type: Application
    Filed: September 25, 2003
    Publication date: March 31, 2005
    Inventors: Thomas Dory, Kenneth Wong