Abstract: A color filter for a liquid crystal display is made by depositing a layer (22) of colored dye in a pattern on a transparent substrate (20). The pattern is in pixel format, covering most of the substrate surface and leaving portions (23) of the surface between the pixels uncovered. A layer of silver halide (25) covers both the colored dye pixels and the exposed portions of the substrate surface. The silver halide layer is treated by exposing it to light so that those portions of the silver halide layer that lie directly over the colored dye pattern become transparent and those portions of the silver halide layer that lie between the pixels become black, blocking any transmitted light.

Abstract: A stepped pattern is formed in a photoresist film (10) by heating the photoresist at a first temperature to soft bake it, and then applying a mask (10) that allows only a selected portion (15) of the photoresist to be heated. That portion of the photoresist film is then heated at a temperature sufficient to partially degrade the photoresist, and the mask is removed. Another portion (22) of the photoresist film is then exposed to ultraviolet light to degrade it more fully than in the earlier step. The photoresist film is then developed under conditions sufficient to completely remove the portion exposed to ultraviolet light, and to partially remove the portion heated using the mask, thereby creating a stepped feature in the photoresist film.

Abstract: A stepped pattern is formed in a photoresist film (10) by heating the photoresist at a first temperature to soft bake it, and then heating only a selected portion (15) of the photoresist. That portion of the photoresist film is then heated at a temperature sufficient to partially degrade the photoresist. Another portion (22) of the photoresist film is then exposed to ultraviolet light to degrade it more fully than in the earlier step. The photoresist film is then developed under conditions sufficient to completely remove the portion exposed to ultraviolet light, and to partially remove the portion heated in the first step, thereby creating a stepped feature in the photoresist film.

Abstract: A dual function electro-optical display device operates as a bistable display when driven at one voltage, and operates as a nematic display when driven at another voltage. In the first mode, the image in the display zone is formed by applying a first electrical signal to the device, and the image persists upon removal of the first electrical field. In the second mode, the image is formed by applying a second electrical signal to the device, and the image disappears upon removal of the second electrical signal. In a liquid crystal display, the liquid crystal fluid (9) is a blend of at least one liquid crystal nematic compound and at least one liquid crystal cholesteric compounds, and is maintained in a gap (4) between two substrates (1).

Abstract: One method for fabricating solderable pads (406) onto a substrate (220) for direct chip attachment uses a multilayer metallization coating (500). The coating has a bottom layer (202) of indium-tin oxide, with an intermediate layer (204) of copper and a top layer (206) of indium-tin oxide. A masking layer (208) is deposited on the active display area (402) of the substrate, leaving the bonding pads uncovered. The revealed bonding pads are then plasma etched, using the polyimide as an etch resist, and the top layer of ITO is selectively removed to reveal the underlying copper layer. The exposed copper layer (204) is then plated with a solderable metal to the desired thickness to form bonding pads that may be used with direct chip attachment schemes.

Abstract: A method of manufacturing high aspect ratio plated through holes in a circuit carrying substrate. High aspect ratio apertures or holes (16) are formed in a substrate (10). A thin film of copper (20) is sputtered onto the substrate and in the apertures that a macroscopically discontinuous copper film (26) is formed on part of the aperture walls. The macroscopically discontinuous copper film is substantially thinner than the copper film that is deposited on the surface. A catalytic copper coating (30) is plated directly on the vacuum deposited thin film of copper by electroless copper plating in a manner sufficient to form a macroscopically continuous copper layer on the aperture walls.

Abstract: A liquid crystal display is constructed by arranging two transparent substrates (1,1') in parallel fashion, using only one polarizer. The display has an active display area for displaying characters that have an embossed appearance. A single polarizer (8) is on the back side of one substrate (1), and a birefringent film (5) is on the front side of the other substrate (1'). The background (15) and the embossed appearing characters (10) have substantially the same appearance, but are differentiated from each other by a dark border (12), thus rendering the characters with an embossed appearance. The border has a substantially different appearance from the embossed appearing characters and the background, the border being preferably darker than the background. The transparency of the embossed appearing characters and the background are within about .+-.10% of the other.

Abstract: A liquid crystal display device (11) is made by sputtering a layer of indium-tin oxide and copper on a transparent substrate. This metal layer is photodelineated to form a pattern of electrodes (17) and heating elements (81), the heating elements being interlaced between the electrodes. The heating elements are converted to a more resistive form by applying a constant voltage signal to only the heating elements in an oxygen-containing atmosphere. The assembled LCD has the heating elements on the inside of the display, so that when the heating elements are pulsed, they heat only a portion of the liquid crystal fluid in the immediate proximity. The heaters are activated by a signal from a display driver.

Abstract: A conformal shield (10) includes a conformal shield base (15), and a conductive layer (16). The conformal shield base (10) has a first conformable insulating material (12) having a characteristic softening point at a first temperature. A second conformable insulating material (14), which has a characteristic softening point at temperature higher than the first temperature, is overlaid on the first conformable insulating material (12). The conductive layer (16) is disposed on the conformal shield base (15) to form the shield (10).

Abstract: A method for fabricating solderable pads (106) onto a glass substrate (101) includes the step of depositing a seed metallization layer (step 406) after the polyimide layer is cured (step 404) but prior to buffing the alignment layer (step 414). The seed metallization layer can done by, for example, sputter depositing indium-tin, tin or copper.

Abstract: Briefly, according to the invention, there is provided a liquid crystal display device (LCD). The LCD has an electrode pattern (14) deposited on one side of a substrate (10). The pattern is formed in a series of elements or pixels (13), that are arranged in a regularly ordered matrix of rows and columns. Metal conductors (16) are also on the face of the substrate and are electrically connected to the electrode elements. A spacer material (27) is formed on metal conductors and a second substrate (10') is placed on the first substrate, and the two substrates are arranged so that a uniform gap (25) is maintained between the substrates by the spacer material. A liquid crystal material (29) is then disposed in the uniform gap. The spacer material can be a photoimaged adhesive, the electrode pattern can be indium/tin oxide, the metal conductors can be copper, and the metal conductors are located between the rows and columns of the plurality of elements in the electrode pattern.

Abstract: A method of photodefining a hardcoat material to cover electrodes on a substrate. The substrate and the circuit pattern are coated (10) with a thin film of a tetramethoxy silane or tetraisopropoxy titanate hardcoat material. A positive photoresist is applied (30) over the thin film of hardcoat material and selectively exposed to actinic radiation(40). The photoresist is developed (50) to expose portions of the underlying hardcoat film, and the hardcoat film is etched (50) with an alkaline etchant solution to form a pattern. The etching and developing take place in the same step. The photoresist is then removed (60), and the patterned hardcoat material is baked (70).

Abstract: A substrate having an optically transparent EMI/RFI shield. A transparent substrate (10) has a thin film metallization pattern (20) on one surface, and some of the pattern is covered with an optically transparent EMI/RFI shield (32). The shield comprises a vapor deposited layer of indium-tin oxide on the substrate surface and on the metallization pattern. The indium-tin oxide is optically transparent. It is patterned to expose one portion (34) of the metallization pattern and to cover a second portion (32) of the metallization pattern. The shield is electrically connected to a part (26) of the metallization pattern that is covered, thus providing electrical shielding and transparency.

Abstract: A method of forming electrode patterns on a substrate. A substrate (30) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (32) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then flood exposed to actinic radiation (19). The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.

Abstract: A substrate (100) includes a surface (102) having a hook and loop fastener area (106). The area (106) is selectively metallized to produce interconnect points (108). The area (106) is used to attach a connector, another substrate, or a flex circuit to the substrate (100) without the use of solder or other conductive adhesives. The area (106) provides for the mechanical coupling. The selectively metallized areas (108) provide for the electrical coupling of the two substrates.

Abstract: An electrical energy storage device (10). An electrode (12) consisting of a thin film of metal or metal oxide is deposited on a substrate (24), preferably by sputtering. Spherical plastic spacers (16) are uniformly dispersed on the electrode at a maximum density of about 1000 spacers per square millimeter of the electrode area. A second substrate also has an electrode (14) formed of a thin film of metal or metal oxide deposited on it, similar to the first substrate. The first and second substrates are arranged so that the electrodes face each other and are separated by the spherical plastic spacers to form a gap (18) of about 20 microns between the electrodes. An electrolyte (20) is filled in the gap, and the edges of the gap are optionally sealed (22) to form the electrical energy storage device. The device may also be formed by using metal foils, and eliminating one or more of the substrates. In both cases, the use of an electrolyte is optional.

Abstract: A liquid crystal display (LCD) package (10) is made by creating an indium/tin oxide electrode (64) on the surface of a flexible substrate (60). The electrode is connected to conductive vias (68) in the flexible substrate by conductive runners (66) that are also indium/tin oxide with an overlayer of copper. The indium/tin oxide is typically sputtered, and the copper is sputtered or plated on selected portions of the runners. The conductive vias are further connected to a circuitry pattern (62) on an opposite side of the flexible substrate. A display driver (70) is attached to the circuitry pattern to drive the LCD (5). A second substrate (80), also with a film electrode (82) on it, is arranged in mutually opposing planar relationship to the flexible substrate in order to form a liquid crystal display. A liquid crystal material (86) is then filled in the gap between the two substrates creating an LCD module (10).

Abstract: A method of forming electrode patterns on a substrate. A transparent substrate (10) is patterned with a photoresist layer (14) on the front side so that portions (18) of the substrate are revealed. A metal oxide layer (12) is deposited on the patterned photoresist layer and the revealed portions of the substrate. The patterned photoresist layer is then exposed to actinic radiation (19) through the back side (25) of the transparent substrate. The photoresist pattern (20) is removed, carrying with it those portions of the metal oxide layer deposited on the photoresist layer, forming an electrode pattern (22) by a lift-off technique.

Abstract: A rechargeable electrical energy storage device (20). The cell has two electrodes (28, 36) constructed from a similar organometallic compound (30), and the electrodes are electrically connected by an ion carrying electrolyte (32). The electrodes are also physically separated from each other by a barrier (34) that will pass ions but not electrons. In one embodiment of the invention, the electrodes are ferrocene, and the electrolyte is sulfuric acid.

Abstract: A metallized aluminum nitride substrate (40) has a first layer (42) of deposited metal, comprising chromium, chromium oxide, and an aluminum nitride/chromium oxide complex represented by the formulaAl.sub.a N.sub.b O.sub.c Cr.sub.dwhere a, b, c and d are numbers representing relative combining ratios. The first layer is formed by sputtering about 10-500 .ANG.ngstroms of chromium onto the substrate under vacuum, and then heating the substrate in an oxygen-containing atmosphere at conditions of time and temperature sufficient to convert at least portions of the deposited chromium to chromium oxide, in order to form an adherent metal system. A second layer (44) of metal such as chromium covers the first layer. A third layer (46) of metal is deposited on the second layer in a manner sufficient to prevent oxidation of the second layer.