Patents by Inventor Thomas Licht

Thomas Licht has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060231644
    Abstract: The compressed air foam and high pressure liquid dispersal system provides a compressed air foam product in addition to concurrently producing a liquid under pressure for decontamination, general cleaning, vapor suppression, Hazmat remediation, fuel spills, and fire suppression support for durable equipment, vehicles, terrain, facilities, and aircraft. The system includes a power plant for powering the compressed air foam and high pressure liquid sub-systems of the system. The high pressure sub-system further includes a boiler for heating the liquid to a temperature above ambient temperature. The boiler and power plant may use the same type of fuel for decreasing the number of fuel supplies to the system. In addition, the power plant drives an air compressor for providing compressed air for powering the compressed air foam sub-system. The power plant further drives a high pressure water pump for pressurizing the water for the high pressure sub-system.
    Type: Application
    Filed: April 13, 2005
    Publication date: October 19, 2006
    Applicant: Intelagard, Inc.
    Inventors: John Breedlove, Dennis Smagac, Seth Mayer, Thomas Licht, James Wilkinson
  • Patent number: 7078795
    Abstract: A high-voltage module comprises a housing (9) which accommodates at least one structural component (4, 5) that is fastened on a metal-ceramics substrate from a ceramic layer (1) comprising a first main face (11) and a second main face (12) opposite said first main face (11), an upper metal layer (15) on the first main face (11) and a lower metal layer (16) on the second main face (12). The high-voltage module is further comprising on the outer edges (14) of the substrate either a cast from weakly conductive particles (17) and a gel, or a cast from particles having a high dielectric constant as compared to the cast gel (17), and a gel.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: July 18, 2006
    Assignee: Eupec Europaische Gesellschaft fur Leistungshalbleiter GmbH & Co. KG
    Inventors: Reinhold Bayerer, Volker Gabler, Thomas Licht
  • Publication number: 20060076389
    Abstract: In a method and a corresponding apparatus for controlling and monitoring the vacuum brazing of power components and SMD components, in which the temperature of the process is controlled using an open thermocouple, which is arranged separate from the furnace heating and is integrated in a base plate serving as a heat buffer, the temperature of the process is monitored and measured directly at the point of contact between brazing material and component. The uniformity of the temperature distribution during the process is measured by means of a contactless optical measuring system.
    Type: Application
    Filed: September 27, 2005
    Publication date: April 13, 2006
    Inventors: Alfred Kemper, Thomas Licht, Christian Robohm, Guido Strotmann
  • Publication number: 20050269683
    Abstract: The invention relates to a high-voltage module comprising a housing (9) which accommodates at least one structural component (4, 5) that is fastened on a metal-ceramics substrate from a ceramic layer (1) comprising a first main face (11) and a second main face (12) opposite said first main face (11), an upper metal layer (15) on the first main face (1) and a lower metal layer (16) on the second main face (12). The high-voltage module is further characterized by comprising on the outer edges (14) of the substrate either a cast from weakly conductive particles (17) and a gel, or a cast from particles having a high dielectric constant as compared to the cast gel (17), and a gel.
    Type: Application
    Filed: August 12, 2005
    Publication date: December 8, 2005
    Inventors: Reinhold Bayerer, Volker Gabler, Thomas Licht
  • Publication number: 20050230820
    Abstract: A power semiconductor arrangement has an electrically insulating and thermally conductive substrate, which is provided with structured metallization on at least one side, a cooling device which is in thermal contact with the other side of the substrate, at least one semiconductor component which is arranged on the substrate and is electrically connected to the structured metallization, an entirely or partially electrically insulating film which is arranged at least on that side of the substrate at which the at least one semiconductor component is placed, and which is laminated without any cavities onto the substrate including or excluding the at least one semiconductor component, and a contact-pressure device which exerts a force on the substrate locally and via the at least one semiconductor component such that the substrate is pressed against the cooling device.
    Type: Application
    Filed: April 15, 2005
    Publication date: October 20, 2005
    Inventor: Thomas Licht
  • Publication number: 20040140116
    Abstract: A high-voltage module comprises a housing (9) which accommodates at least one structural component (4, 5) that is fastened on a metal-ceramics substrate from a ceramic layer (1) comprising a first main face (11) and a second main face (12) opposite said first main face (11), an upper metal layer (15) on the first main face (11) and a lower metal layer (16) on the second main face (12). The high-voltage module is further comprising on the outer edges (14) of the substrate either a cast from weakly conductive particles (17) and a gel, or a cast from particles having a high dielectric constant as compared to the cast gel (17), and a gel.
    Type: Application
    Filed: December 19, 2003
    Publication date: July 22, 2004
    Inventors: Reinhold Bayerer, Volker Gabler, Thomas Licht
  • Patent number: 5141111
    Abstract: A system and method for inspecting and rejecting defective containers comprising a plurality of reflective infrared sensors, an electronic logic control and a container removal device. The system assesses the quality of the flange of the container and senses the height of the container by sensors irradiating the flange portion of the container with narrow beams of infrared light at varying heights and receiving radiation reflected from the flange portion. The acceptability of the container is determined by the quantum of reflected radiation received by the sensors. Unacceptable containers are removed by a high-speed pneumatic cylinder coupled to independently controlled, solenoid-operated air valves which govern the movement of the cylinder piston of the pneumatic cylinder.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: August 25, 1992
    Assignee: Ball Corporation
    Inventor: Thomas A. Licht
  • Patent number: 5139132
    Abstract: A high speed orientation apparatus for disk-shaped objects includes upper and lower turntables operated to provide constant angular orientation of the disk-shaped objects. An automatic supply delivers disk-shaped objects to one of a plurality of disk receiving stations located on the upper turntable. The upper turntable and the lower turntable, which also includes disk receiving stations, are attached to a rotating drive with the disk receiving stations of the lower table directly underneath the disk receiving stations of the upper table. Both the upper and lower turntables are rotated at the same speed. The plurality of disk receiving stations include operable disk retainers for holding and releasing a disk-shaped object.
    Type: Grant
    Filed: September 9, 1991
    Date of Patent: August 18, 1992
    Assignee: Ball Corporation
    Inventor: Thomas A. Licht