Patents by Inventor Thomas Wagenleitner
Thomas Wagenleitner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210291504Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: June 8, 2021Publication date: September 23, 2021Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11121091Abstract: A method and device for the alignment of substrates that are to be bonded. The method includes detecting and storing positions of alignment mark pairs located on surfaces of the substrates, and aligning the substrates with respect to each other in accordance with the detected positions.Type: GrantFiled: March 20, 2017Date of Patent: September 14, 2021Assignee: EV Group E. Thallner GmbHInventor: Thomas Wagenleitner
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Patent number: 11101132Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: GrantFiled: May 21, 2020Date of Patent: August 24, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Patent number: 11059280Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 18, 2019Date of Patent: July 13, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020953Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 20, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020950Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 19, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020951Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 19, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020952Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 20, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20210151339Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.Type: ApplicationFiled: January 29, 2021Publication date: May 20, 2021Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
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Patent number: 10991609Abstract: A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.Type: GrantFiled: August 12, 2016Date of Patent: April 27, 2021Assignee: EV GROUP E. THALLNER GMBHInventors: Dominik Zinner, Thomas Wagenleitner, Jurgen Markus Suss, Jurgen Mallinger, Thomas Plach
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Publication number: 20210104425Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.Type: ApplicationFiled: November 30, 2020Publication date: April 8, 2021Applicant: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
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Patent number: 10954122Abstract: A method for bonding at least three substrates to form a substrate stack, wherein the substrate stack has at least one lowermost substrate a middle substrate, and an upper substrate. The method includes the following steps: aligning the middle substrate to the lowermost substrate and bonding the middle substrate to the lowermost substrate, then aligning the upper substrate and bonding the upper substrate to the middle substrate, wherein the upper substrate is aligned to the lowermost substrate.Type: GrantFiled: March 16, 2017Date of Patent: March 23, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Thomas Glinsner, Harald Zaglmayr
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Publication number: 20210074544Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: November 4, 2020Publication date: March 11, 2021Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 10943807Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.Type: GrantFiled: March 26, 2020Date of Patent: March 9, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
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Patent number: 10886156Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.Type: GrantFiled: February 25, 2019Date of Patent: January 5, 2021Assignee: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
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Patent number: 10861699Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: July 8, 2020Date of Patent: December 8, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20200335341Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: July 8, 2020Publication date: October 22, 2020Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20200333136Abstract: A mark field, having at least two location marks with information for the location of the respective location mark in the mark field, and at least one position mark, which is or can be assigned to one of the location marks. Furthermore, the invention relates to a device for determining X-Y positions of structural features of structures arranged on a substrate, wherein the X-Y positions relative to the mark field, which is fixed with respect to the substrate, can be determined. Furthermore, the present invention relates to a corresponding method.Type: ApplicationFiled: February 27, 2018Publication date: October 22, 2020Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Frank Bogelsack
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Publication number: 20200286733Abstract: A method and device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: ApplicationFiled: May 21, 2020Publication date: September 10, 2020Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer
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Patent number: 10755929Abstract: A method and a device for bonding a first substrate with a second substrate inside a sealed bonding chamber. The method includes: a) fixing of the first and second substrates, b) arranging of the first and second substrates, c) mutual approaching of the first and second substrates, d) contacting the first and second substrates at respective bond initiation points, e) generating a bonding wave running from the bond initiation points to side edges of the substrates, and f) influencing the bonding wave during course of the bonding wave, wherein targeted influencing of the bonding wave takes place by a regulated and/or controlled change of pressure inside the bonding chamber.Type: GrantFiled: February 16, 2016Date of Patent: August 25, 2020Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Andreas Fehkuhrer