Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.

Abstract: A device for determining alignment errors of structures which are present on, or which have been applied to a substrate, comprising a substrate holder for accommodating the substrate with the structures and detection means for detecting X-Y positions of first markings on the substrate and/or second markings on the structures by moving the substrate or the detection means in a first coordinate system, wherein in a second coordinate system which is independent of the first coordinate system X?-Y? structure positions for the structures are given whose respective distance from the X-Y positions of the first markings and/or second markings can be determined by the device.

Abstract: The present invention relates to a device and method for determining changes in the shape of a substrate parallel to its substrate surface. The device comprises at least one detection apparatus for detecting images of structures which are located on the substrate surface, and optics comprised of at least two optics apparatus with at least two different beam paths for imaging of the structures on the detection apparatus. The device is able to determine distances (dx1, dy1, dx2, dy2, dxn, dyn) of images of the structures and/or changes of the distances (dx1, dy1, dx2, dy2, dxn, dyn).

Abstract: This invention relates to a method and a device for temporary bonding of a first substrate with a second substrate. The device is comprised of a mounting apparatus for mounting of the first substrate on a mounting contour with an active mounting surface. The mounting apparatus has an outer ring section for controllable fixing of the first substrate. Deformation means are provided for controllable deformation of the first substrate. The deformation means act within the outer ring section. Bonding means are provided for bonding of the first substrate with the second substrate.

Abstract: Handling device for handling of a wafer in the processing of the wafer with the following features: a carrier with a flat receiving side for holding the wafer, an especially lattice-like grid structure which is raised on the receiving side relative to the receiving side, a flexible cover which covers the grid structure relative to the carrier, sealing it, for fixing of the wafer on the carrier, and a grid space which is bordered by the cover and the carrier can be exposed to negative pressure, characterized in that the grid structure and the cover with the receiving side form an especially trough-shaped receiving space for holding of receiving structures which are provided on the wafer and which are raised relative to the wafer receiving side.

Abstract: A receiving means for receiving and mounting of wafers, comprised of: a mounting surface, mounting means for mounting a wafer on the mounting surface and compensation means for active, especially locally controllable, at least partial compensation of local and/or global distortions of the wafer.

Abstract: This invention relates to a retaining system for retaining and holding a wafer for processing the wafer with a holding surface for placing the wafer on a support surface of the wafer and holding means for holding the wafer, whereby because of the holding means holding extremely thin wafers on the holding surface of the wafer, the smallest possible local distortions of the wafer are achieved.

Abstract: In a system having a substrate holding means for holding a substrate, wherein the substrate holding means is rotatable about an axis of rotation that is perpendicular to an X-Y coordinate system, a method for determining position of the axis of rotation in the X-Y coordinate system, comprising the steps of: providing a reference labeling on the substrate holding means or on the substrate; determining a first X-Y reference position RP of a reference labeling on the substrate holding means or on the substrate by means of optical positional detecting means that is fixed relative to the X-Y coordinate system, rotating the substrate holding means by a defined angle of rotation R around the axis of rotation, determining by means of said fixed optical positional detecting means a second X-Y reference position RP? of the reference labeling that is changed by the rotation, and calculating the X-Y position of the axis of rotation in the substrate.

Abstract: Handling device for handling of a wafer in the processing of the wafer with the following features: a carrier with a flat receiving side for holding the wafer, an especially lattice-like grid structure which is raised on the receiving side relative to the receiving side, a flexible cover which covers the grid structure relative to the carrier, sealing it, for fixing of the wafer on the carrier, and a grid space which is bordered by the cover and the carrier can be exposed to negative pressure, characterized in that the grid structure and the cover with the receiving side form an especially trough-shaped receiving space for holding of receiving structures which are provided on the wafer and which are raised relative to the wafer receiving side.

Abstract: An amplifier arrangement and a method for compensating for an offset in an amplifier is provided. A respective switch for connecting together the inputs in a compensation operating mode and for interrupting the feedback path in this operating mode is provided in an amplifier. A control device detects an output signal and drives a controllable current source, which can be coupled to one of the two inputs of the amplifier, in such a manner that a compensation current which minimizes the offset is provided. The arrangement and method can be used, for example, in transmission arrangements.

Abstract: An amplifier arrangement and a method for compensating for an offset in an amplifier is provided. A respective switch for connecting together the inputs in a compensation operating mode and for interrupting the feedback path in this operating mode is provided in an amplifier. A control device detects an output signal and drives a controllable current source, which can be coupled to one of the two inputs of the amplifier, in such a manner that a compensation current which minimizes the offset is provided. The arrangement and method can be used, for example, in transmission arrangements.