Patents by Inventor Thomas WIRNSBERGER
Thomas WIRNSBERGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11965263Abstract: The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.Type: GrantFiled: September 2, 2020Date of Patent: April 23, 2024Assignee: SEMSYSCO GMBHInventors: Herbert Ötzlinger, Oliver Knoll, Raoul Schröder, Markus Gersdorff, Thomas Wirnsberger, Georg Hofer, Andreas Gleissner
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Patent number: 11908698Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: Providing a substrate with a substrate surface comprising at least one recess, applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and plating the recess.Type: GrantFiled: October 1, 2021Date of Patent: February 20, 2024Assignee: SEMSYSCO GMBHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okorn-Schmidt, Philipp Engesser
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Publication number: 20230053226Abstract: The invention relates to a substrate holding and locking system for chemical and/or electrolytic surface treatment of a substrate in a process fluid and a corresponding method. The system comprises a first element, a second element, a reduced pressure holding unit and a magnetic locking unit. The first element and the second element are configured to hold the substrate between each other. The reduced pressure holding unit comprises a pump to reduce an interior pressure inside the substrate holding and locking system below atmospheric pressure. The magnetic locking unit is configured to lock the first element and the second element with each other. The magnetic locking unit comprises a magnet control and at least a magnet. The magnet is arranged at one of the first element and the second element. The magnet control is configured to control a magnetic force between the first element and the second element.Type: ApplicationFiled: September 2, 2020Publication date: February 16, 2023Inventors: Herbert ÖTZLINGER, Oliver KNOLL, Raoul SCHRÖDER, Markus GERSDORFF, Thomas WIRNSBERGER, Georg HOFER, Andreas GLEISSNER
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Patent number: 11566337Abstract: Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.Type: GrantFiled: October 6, 2020Date of Patent: January 31, 2023Assignee: Semsysco GmbHInventors: Andreas Gleissner, Thomas Wirnsberger, Herbert Ötzlinger
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Publication number: 20220020591Abstract: The teaching relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate includes the following: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.Type: ApplicationFiled: October 1, 2021Publication date: January 20, 2022Applicant: SEMSYSCO GMBHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okom-Schmidt, Philipp Engesser
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Patent number: 11195730Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.Type: GrantFiled: November 22, 2019Date of Patent: December 7, 2021Assignee: Lam Research AGInventors: Rainer Obweger, Andreas Gleissner, Thomas Wirnsberger, Franz Kumnig, Alessandro Baldaro, Christian Thomas Fischer, Mu Hung Chou, Rafal Ryszard Dylewicz, Nathan Lavdovsky, Ivan L. Berry, III
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Patent number: 11164748Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.Type: GrantFiled: January 24, 2019Date of Patent: November 2, 2021Assignee: Semsyso GMBHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okorn-Schmidt, Philipp Engesser
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Publication number: 20210017662Abstract: Exemplary substrate locking system, device, apparatus and method for chemical and/or electrolytic surface treatment of a substrate in a process fluid can be provided. For example, it is possible to provide a first element, a second element and a locking unit. The first element and the second element can be configured to hold the substrate between each other. The locking unit can be configured to lock the first element and the second element with each other. The locking unit can comprise a magnet control device and a magnet. The magnet can be arranged at or near the first element and/or the second element. The magnet control device can be configured to control a magnetic force between the first element and the second element.Type: ApplicationFiled: October 6, 2020Publication date: January 21, 2021Inventors: Andreas Gleissner, Thomas Wirnsberger, Herbert Ötzlinger
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Publication number: 20200090956Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.Type: ApplicationFiled: November 22, 2019Publication date: March 19, 2020Inventors: Rainer Obweger, Andreas Gleissner, Thomas Wirnsberger, Franz Kumnig, Alessandro Baldaro, Christian Fischer, Mu Hung Chou, Rafal Ryszard Dylewicz, Nathan Lavdovsky, Ivan L. Berry
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Patent number: 10490426Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.Type: GrantFiled: August 26, 2014Date of Patent: November 26, 2019Assignee: LAM RESEARCH AGInventors: Rainer Obweger, Andreas Gleissner, Thomas Wirnsberger, Franz Kumnig, Alessandro Baldaro, Christian Thomas Fischer, Mu Hung Chou, Rafal Ryszard Dylewicz, Nathan Lavdovsky, Ivan L. Berry, III
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Publication number: 20190228975Abstract: The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps: a) Providing a substrate with a substrate surface comprising at least one recess, b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas, c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, and d) plating the recess.Type: ApplicationFiled: January 24, 2019Publication date: July 25, 2019Applicant: Semsysco GmbHInventors: Franz Markut, Thomas Wirnsberger, Oliver Knoll, Andreas Gleissner, Harald Okorn-Schmidt, Philipp Engesser
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Patent number: 10269615Abstract: A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.Type: GrantFiled: September 9, 2011Date of Patent: April 23, 2019Assignee: LAM RESEARCH AGInventors: Ulrich Tschinderle, Andreas Gleissner, Thomas Wirnsberger, Rainer Obweger
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Patent number: 10056287Abstract: A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.Type: GrantFiled: September 30, 2015Date of Patent: August 21, 2018Assignee: LAM RESEARCH AGInventors: Ulrich Tschinderle, Andreas Gleissner, Thomas Wirnsberger, Rainer Obweger
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Patent number: 9887120Abstract: A rotary chuck for processing wafer-shaped articles comprises a chuck body having a series of gripping pins that are movable by sliding horizontally and in unison relative to the chuck body from a first position in which the gripping pins are relatively more retracted into the chuck body to a second position in which the gripping pins are relatively more extended from the chuck body and in which the gripping pins are positioned so as to support a wafer-shaped article of a predetermined diameter.Type: GrantFiled: November 3, 2015Date of Patent: February 6, 2018Assignee: Lam Research AGInventors: Andreas Gleissner, Michael Brugger, Thomas Wirnsberger
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Patent number: 9653328Abstract: An apparatus for treating a surface of an article includes a chamber for receiving an article to be treated. A dispenser dispenses a treatment liquid including inorganic acid onto the article. A tank stores the treatment liquid. An ozone generator communicates with a supply line entering or exiting the tank to mix ozone with the treatment liquid. A cooler cools the treatment liquid to a subambient temperature in a range of 3° C. to less than 20° C. A heater heats a surface of an article to be treated to a temperature at least 30° C. greater than a temperature of the treatment liquid when applied to the article.Type: GrantFiled: April 1, 2014Date of Patent: May 16, 2017Assignee: Lam Research AGInventors: Harald Okorn-Schmidt, Franz Kumning, Rainer Obweger, Thomas Wirnsberger
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Publication number: 20170125281Abstract: A rotary chuck for processing wafer-shaped articles comprises a chuck body having a series of gripping pins that are movable by sliding horizontally and in unison relative to the chuck body from a first position in which the gripping pins are relatively more retracted into the chuck body to a second position in which the gripping pins are relatively more extended from the chuck body and in which the gripping pins are positioned so as to support a wafer-shaped article of a predetermined diameter.Type: ApplicationFiled: November 3, 2015Publication date: May 4, 2017Inventors: Andreas GLEISSNER, Michael BRUGGER, Thomas WIRNSBERGER
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Patent number: 9633890Abstract: A device for processing wafer-shaped articles comprises a rotary chuck having a series of pins adapted to hold a wafer shaped article on the rotary chuck. Each of the pins comprises a cylindrical body and a projecting gripping portion formed integrally therewith. The cylindrical body and gripping portion are made from a ceramic material. The gripping portion comprises cylindrical surfaces having a common generatrix with surfaces of the cylindrical body.Type: GrantFiled: December 16, 2011Date of Patent: April 25, 2017Assignee: Lam Research AGInventors: Ulrich Tschinderle, Andreas Gleissner, Thomas Wirnsberger, Franz Kumnig, Rainer Obweger
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Patent number: 9418883Abstract: A device for holding a wafer-shaped article comprises an annular chuck base body having a plurality of movable contact elements for securing a wafer-shaped article to the annular chuck base body, and a gear mechanism driving the contact elements in unison between a first position and a second position. The annular chuck base body comprises a housing formed from a material that is resistant to attack by strong inorganic acids. The annular chuck base body also comprises a reinforcing ring fitted within the housing and formed from a material whose coefficient of linear thermal expansion is substantially less than that of the housing material.Type: GrantFiled: July 3, 2013Date of Patent: August 16, 2016Assignee: LAM RESEARCH AGInventors: Andreas Gleissner, Thomas Wirnsberger
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Publication number: 20160064242Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.Type: ApplicationFiled: August 26, 2014Publication date: March 3, 2016Inventors: Rainer OBWEGER, Andreas GLEISSNER, Thomas WIRNSBERGER, Franz KUMNIG, Alessandro BALDARO, Christian Thomas FISCHER, Mu Hung CHOU, Rafal Ryszard DYLEWICZ, Nathan LAVDOVSKY, Ivan L. Berry, III
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Publication number: 20160027680Abstract: A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.Type: ApplicationFiled: September 30, 2015Publication date: January 28, 2016Inventors: Ulrich TSCHINDERLE, Andreas GLEISSNER, Thomas WIRNSBERGER, Rainer OBWEGER