Abstract: A method for forming a through substrate via (TSV) comprises forming an opening within a substrate. An adhesion layer of titanium is formed within the via opening, a nucleation layer of titanium nitride is formed over the adhesion layer, and a tungsten layer is deposited over the nucleation layer, the tungsten layer having a thickness less than or equal to a critical film thickness sufficient to provide for film integrity and adhesion stability. A stress relief layer of titanium nitride is formed over the tungsten layer and a subsequent tungsten layer is deposited over the stress relief layer. The subsequent tungsten layer has a thickness less than or equal to the critical film thickness. The method further includes planarizing to expose the interlevel dielectric layer and a top of the TSV and backgrinding a bottom surface of the substrate sufficient to expose a bottom portion of the TSV.

Abstract: A method is provided for making a semiconductor device, which comprises (a) providing a semiconductor structure comprising a top gate (228) and a bottom gate (240); (b) creating first, second and third openings in the semiconductor structure, wherein the first opening exposes a portion of the bottom gate; (c) filling the first, second and third openings with a conductive material, thereby forming source (258) and drain (260) regions in the second and third openings and a conductive region (253) in the first opening; and (d) forming an electrical contact (278) to the conductive region.

Abstract: A method of making a semiconductor device includes providing a first wafer and providing a second wafer having a first side and a second side, the second wafer including a semiconductor substrate, a storage layer, and a layer of gate material. The storage layer may be located between the semiconductor structure and the layer of the gate material and the storage layer may be located closer to the first side of the second wafer than the semiconductor structure. The method further includes boding the first side of the second wafer to the first wafer. The method further includes removing a first portion of the semiconductor structure to leave a layer of the semiconductor structure after the bonding. The method further includes forming a transistor having a channel region, wherein at least a portion of the channel region is formed from the layer of the semiconductor structure.

Abstract: A semiconductor device suitable for use as a storage cell includes a semiconductor body having a top surface and a bottom surface, a top gate dielectric overlying the semiconductor body top surface, an electrically conductive top gate electrode overlying the top gate dielectric, a bottom gate dielectric underlying the semiconductor body bottom surface, an electrically conductive bottom gate electrode underlying the bottom gate dielectric, and a charge trapping layer. The charge trapping layer includes a plurality of shallow charge traps, adjacent the top or bottom surface of the semiconductor body. The charge trapping layer may be of aluminum oxide, silicon nitride, or silicon nanoclusters. The charge trapping layer may located positioned between the bottom gate dielectric and the bottom surface of the semiconductor body.

Abstract: A method for making a semiconductor device comprises providing a first wafer and providing a second wafer having a first side and a second side, the second wafer including a semiconductor structure, a first storage layer, and a layer of gate material, wherein the first storage layer is located between the semiconductor structure and the layer of gate material and closer to the first side of the second wafer than the semiconductor structure. The method further includes bonding the first side of the second wafer to the first wafer and cleaving away a first portion of the semiconductor structure to leave a layer of the semiconductor structure after the bonding. The method further includes forming a second storage layer over the layer of the semiconductor structure and forming a top gate over the second storage layer.

Abstract: Double gate transistors (12, 13) having different bottom gate dielectric thicknesses are formed on a first wafer (101) by forming a first gate dielectric layer (107); removing part of the first gate dielectric layer (107) from a first area (60); forming a second gate dielectric layer (108) to obtain a thinner bottom gate dielectric layer (150) over the first area (60) and a thicker bottom gate dielectric layer (151) over the second area (70); and forming a planar bottom gate layer (109) over first and second gate dielectric layers. After inverting and bonding the first wafer (101) to a second wafer (103), the bottom gate electrodes (109-2, 109-3), bottom gate dielectric layers (107, 108) and channel regions (203-2, 203-3) for the first and second double gate transistors (12, 13) are selectively etched prior to formation of the top gate structures.

Abstract: A method of generating a layout of one or more planar double gate transistors can include generating a single gate transistor layout at least in part from one or more double gate transistor circuits, logic diagrams, or any combination thereof, and generating the planar double gate transistor layout at least in part from the single gate transistor layout. The method is highly flexible regarding the generation and adjusting of gate shapes and gate contact shapes to ensure the proper connection of the gates to voltage or signal lines, and when such generation, adjusting, or any combination thereof is performed. In one embodiment, a data processing system can include a program that has code in the form of instructions to carry out the method.

Abstract: A method of automatically generating planar double gate transistor shapes can include taking an integrated circuit layout design that includes single gate transistors, locating the gate shapes and active shapes for the transistors, generating top gate shapes, planar double gate active shapes, bottom gate shapes, active cavity shapes, source/drain cavity shapes, and top gate contact shapes, bottom gate contact shapes, thru-gate contact shapes, and source/drain contact shapes for the planar double gate transistors. The method can generate gate contact shapes that have top and bottom gates to be electrically connected within the same planar double gate transistor or separate gate contact shapes where the top and bottom gates are not electrically connected to each other. In one embodiment, a data processing system can include a program that has code in the form of instructions to carry out the method.

Abstract: A semiconductor device has two types of multi-gate transistors, N channel and P channel, in which each type has a bottom gate and a top gate. The bottom gate and the top gate of the N channel transistors are chosen to be of a metal or metals that are for optimizing the performance of the N channel transistors. Similarly, the bottom gate and the top gate of the P channel transistors are chosen to be of a metal or metals that are for optimizing the performance of the P channel transistors.

Abstract: Methods are provided for forming a semiconductor device from a substrate comprising a bottom gate layer, a channel layer overlying the bottom gate layer, and a top gate structure formed over the channel layer. First, a hardmask comprising a first material interposed between a second material and a third material is deposited over a portion of the top gate structure. Then, the hardmask and top gate structure are encapsulated with an insulating material to form a spacer. A channel structure is formed from the channel layer, and the channel structure is disposed under the spacer. A bottom gate structure is formed from the bottom gate layer, and the bottom gate structure is disposed under the channel structure. Then, a source/drain contact is formed around the bottom gate structure.

Abstract: A method is provided for making a semiconductor device, which comprises (a) providing a semiconductor structure comprising a top gate (228) and a bottom gate (240); (b) creating first (251), second and third (252) openings in the semiconductor structure, wherein the first opening exposes a portion of the bottom gate; (c) filling the first, second and third openings with a conductive material, thereby forming source (258) and drain (260) regions in the second and third openings and a conductive region (253) in the first opening; and (d) forming an electrical contact (278) to the conductive region.

Abstract: A transistor having a bottom gate formed from a layer of gate material and a channel region formed from a layer semiconductor material. In some examples, the layer of gate material is patterned separately from the layer of semiconductor material. In some examples the patterning of the layer of gate material also leaves other conductive structures that may be, in some examples, used to provide a bottom gate bias voltage to the bottom gate. In some examples, the layer of semiconductor material is formed by bonding two wafers together with a substrate of one of the wafers being cleaved, wherein a remaining portion of the semiconductor substrate is a semiconductor layer from which the channel region is formed.