Patents by Inventor Timothy Dyer

Timothy Dyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dielectric covered electrostatic chuck
    Patent number: 6414834
    Abstract: An electrostatic chuck 100 useful for holding a substrate 55 in a high density plasma, comprises an electrode 110 at least partially covered by a semiconducting dielectric 115, wherein the semiconducting dielectric 115 may have an electrical resistance of from about 5×109 &OHgr;cm to about 8×1010 &OHgr;cm.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: July 2, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan, Robert J. Steger, Timothy Dyer, Ananda H. Kumar, Alexander M. Veytser, Kadthala R. Narendrnath, Semyon L. Kats, Arnold Kholodenko, Shamouil Shamouilian, Dennis S. Grimard
  • Electrostatic chuck having improved gas conduits
    Patent number: 6108189
    Abstract: An electrostatic chuck 100 useful for holding a substrate 55 in a high density plasma, comprises a dielectric covered electrode 110 having at least one heat transfer gas flow conduit 150 therein. An electrical isolator 200 comprising dielectric material is positioned in the gas flow conduit 150 to (i) electrically isolate the gas in the conduit from the plasma or electrode 110, and (ii) allow passage of heat transfer gas through the conduit. Preferably, the dielectric material comprises a plasma-deactivating material that has a high surface area that reduces plasma formation of gas passing through the conduit 150 in a plasma process. A semiconducting dielectric member 115 useful for rapidly charging and discharging electrostatic chucks is also described.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: August 22, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan, Robert J. Steger, Timothy Dyer, Ananda H. Kumar, Alexander M. Veytser, Kadthala R. Narendrnath, Semyon L. Kats, Arnold Kholodenko, Shamouil Shamouilian, Dennis S. Grimard
  • Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
    Patent number: 5904776
    Abstract: The present invention discloses a two basic structures (including multiple variations within one of the basic structures) and methods for fabrication of the structures which facilitate the flow of cooling gas or other heat transfer fluid to the surface of an electrostatic chuck. The basic structures address both the problem of breakdown of a heat transfer gas in an RF plasma environment and the problem of arcing between a semiconductor substrate and the conductive pedestal portion of the electrostatic chuck in such an RF plasma environment.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: May 18, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Arik Donde, Dan Maydan, Robert J. Steger, Edwin C. Weldon, Brian Lue, Timothy Dyer
  • Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
    Patent number: 5720818
    Abstract: The present invention discloses a two basic structures (including multiple variations within one of the basic structures) and methods for fabrication of the structures which facilitate the flow of cooling gas or other heat transfer fluid to the surface of an electrostatic chuck. The basic structures address both the problem of breakdown of a heat transfer gas in an RF plasma environment and the problem of arcing between a semiconductor substrate and the conductive pedestal portion of the electrostatic chuck in such an RF plasma environment.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: February 24, 1998
    Assignee: Applied Materials, Inc.
    Inventors: Arik Donde, Dan Maydan, Robert J. Steger, Edwin C. Weldon, Brian Lue, Timothy Dyer