Patents by Inventor Ting Hu

Ting Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11985822
    Abstract: A memory device is provided. The memory device includes a stacked structure, a tubular element, a conductive pillar and memory cells. The tubular element includes a dummy channel layer and penetrates the stacked structure. The conductive pillar is enclosed by the tubular element and extending beyond a bottom surface of the dummy channel layer. The memory cells are in the stacked structure and electrically connected to the conductive pillar.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: May 14, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Teng-Hao Yeh, Chih-Wei Hu, Hang-Ting Lue, Guan-Ru Lee
  • Patent number: 11984410
    Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240148817
    Abstract: Disclosed is a method of preparing black tea extract with high theaflavin content, which utilizes an enzyme solution prepared by extracting polyphenol oxidase and laccase from bergamot yam (Dioscorea opposita foshou) or Chinese yam (Dioscoreae Rhizoma). Also disclosed is a method of treating liver fibrosis or kidney injury or atherosclerosis in a subject.
    Type: Application
    Filed: November 6, 2022
    Publication date: May 9, 2024
    Applicant: Huanggang Normal University
    Inventors: Shiming Li, Weixin Wang, Peng Wu, Ting Hu, Junfeng Shen, Jianfeng Zhan
  • Patent number: 11979977
    Abstract: A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.
    Type: Grant
    Filed: August 31, 2019
    Date of Patent: May 7, 2024
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Hsiao-Ting Hsu, Tao-Ming Liao, Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen
  • Publication number: 20240141205
    Abstract: This disclosure relates to a composition that includes at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low-k removal rate inhibitor; and an aqueous solvent.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Ting-Kai Huang, Bin Hu, Yannan Liang, Hong Piao
  • Patent number: 11966734
    Abstract: A method for developing an Android TV hybrid application includes: generating a WebView component in an Android Activity belonging to an Android side of the application; obtaining a WebSettings subclass and using it to configure the WebView component; using Web technologies to develop a Web page belonging to a Web side of the application; using the WebView component to show the Web page; creating a first Java object blended with a JavaScript context in the Android side to define different interfaces, and creating a second Java object to implement the interfaces defined by the first Java object, so that the Web side can call the functions of the Android side; providing a packaged Java class in the Android side to send messages, and providing a packaged JavaScript module in the Web side to process the messages, so that the Android side can feedback the messages to the Web side.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: April 23, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Ya-Ting Hu
  • Patent number: 11966241
    Abstract: A circuit includes a voltage divider circuit configured to generate a feedback voltage according to an output voltage, an operational amplifier configured to output a driving signal according to the feedback voltage and a reference voltage and a pass gate circuit including multiple current paths. The current paths are controlled by the driving signal and connected in parallel between the voltage divider circuit and a power reference node.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huan-Neng Chen, Yen-Lin Liu, Chia-Wei Hsu, Jo-Yu Wu, Chang-Fen Hu, Shao-Yu Li, Bo-Ting Chen
  • Patent number: 11960051
    Abstract: Various embodiments may provide a method of fabricating a meta-lens structure. The method may include forming a first dielectric layer in contact with a silicon wafer. The method may also include forming a second dielectric layer in contact with the first dielectric layer. A refractive index of the second dielectric layer may be different from a refractive index of the first dielectric layer. The method may further include, in patterning the second dielectric layer. The method may additionally include removing at least a portion of the silicon wafer to expose the first dielectric layer.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: April 16, 2024
    Assignee: Agency for Science, Technology and Research
    Inventors: Shiyang Zhu, Chih-Kuo Tseng, Ting Hu, Zhengji Xu, Yuan Dong, Alex Yuandong Gu
  • Patent number: 11962211
    Abstract: A vibration module is provided, having a main axis passing through the center of the vibration module. The vibration module includes a fixed part and a first vibration part. The first vibration part is disposed within the fixed part. The first vibration part includes a first moving member and a first driving assembly. The first driving assembly drives the first moving member to move along the main axis relative to the fixed part.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: April 16, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Che-Wei Chang
  • Publication number: 20240101847
    Abstract: A quantum dot oil-based ink is provided. The quantum dot oil-based ink includes a quantum dot material, a dispersing solvent, a viscosity modifier, and a surface tension modifying solution. The dispersing solvent includes a linear alkane having 6 to 14 carbon atoms. The viscosity modifier includes an aromatic hydrocarbon having 10 to 18 carbon atoms or a linear olefin having 16 to 20 carbon atoms. The surface tension modifying solution includes a hydrophobic polymer material and a nonpolar solvent.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 28, 2024
    Inventors: Chun Che LIN, Chong-Ci HU, Yi-Ting TSAI, Ching-Yi CHEN, Yu-Chun LEE
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11936378
    Abstract: An interface circuit and an electronic apparatus, including: a programmable current array (1), generating a first current and a second current transmitted to a common mode and differential mode generation circuit (2) according to an input code, and a third current and a fourth current transmitted to a driving bias generation circuit (3) according to the input code; the common mode and differential mode generation circuit (2), generating a common mode voltage according to the first current, and generating a high level voltage and a low level voltage according to the second current and the common mode voltage; a driving bias generation circuit (3), simulating a load according to the third and fourth currents, and generating a bias voltage based on the load and the low and high level voltages; an output driving circuit (4), converting an input signal into a differential signal in which the common mode voltage and a differential mode amplitude are configurable.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: March 19, 2024
    Assignees: NO.24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION, Chongqing GigaChip Technology Co., Ltd.
    Inventors: Ting Li, Gangyi Hu, Ruzhang Li, Yong Zhang, Yabo Ni, Dongbing Fu, Jian'an Wang, Guangbing Chen
  • Publication number: 20240086079
    Abstract: A system comprises a memory device including a plurality of management units and a processing device. The processing device is operatively coupled with the memory device and configured to place the plurality of management units into a first protective state by erasing the plurality of management units, identify a cursor satisfying a cursor definition, identify a subset of the plurality of management units based on a location, on the memory device, referenced by the cursor, and place a selected management unit of the subset of the plurality of management units into a second protective state by programming a protective data pattern to the selected management unit.
    Type: Application
    Filed: August 24, 2023
    Publication date: March 14, 2024
    Inventors: Guang Hu, Ting Luo
  • Patent number: 11919192
    Abstract: The invention discloses a bamboo chip integrated material. The bamboo chip integrated material is formed by a plurality of lengthened bamboo chips which are glued and overlaid; each lengthened bamboo chip is formed by a plurality of bamboo chip units which sequentially and continuously mesh and are butted; sharp teeth and grooves are formed in the two ends in the length direction of the bamboo chip units, wherein the sharp tooth of each bamboo chip unit and the groove of the corresponding bamboo sheet unit are matched to form a meshing butt-joint part, and the meshing butt-joint parts of the adjacent lengthened bamboo chips are arranged in a staggered mode; and each bamboo chip unit has a thickness of 4-12 mm and a width of 15-50 mm.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: March 5, 2024
    Assignee: HUNAN TAOHUAJIANG BAMBOO SCIENCE & TECHNOLOGY CO., LTD.
    Inventors: Zhiping Wu, Jinbo Hu, Yanhui Xiong, Zhicheng Xue, Ting Li, Zhibin Hu, Yuankun Hu
  • Publication number: 20240069735
    Abstract: Described are systems and methods related to a memory block erase protocol. An example system includes a memory device having a memory array including a plurality of memory cells. The system further includes a processing device coupled to the memory device. The processing device is to determine a value of a metric associated with the memory array. Responsive to determine that the value of the metric is below a predetermined threshold, the processing device is further to initiate an erase protocol of the memory device. The processing device is further to erase sets of memory cells associated with one or more memory blocks of the memory array. The processing device is further to receive a programming command directed to the first set of memory cells. The processing device is further to perform a programming operation with respect to a set of memory cells responsive to receiving the programming command.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Inventors: Chun Sum Yeung, Deping He, Ting Luo, Guang Hu, Jonathan S. Parry
  • Publication number: 20240069299
    Abstract: An optical element driving mechanism includes a movable assembly, a fixed assembly, and a driving assembly. The movable assembly is configured to be connected to an optical element. The movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly in a range of motion. The optical element driving mechanism further includes a positioning assembly configured to position the movable assembly at a predetermined position relative to the fixed assembly when the driving assembly is not operating.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Chao-Chang HU, Kuen-Wang TSAI, Liang-Ting HO, Chao-Hsi WANG, Chih-Wei WENG, He-Ling CHANG, Che-Wei CHANG, Sheng-Zong CHEN, Ko-Lun CHAO, Min-Hsiu TSAI, Shu-Shan CHEN, Jungsuck RYOO, Mao-Kuo HSU, Guan-Yu SU
  • Publication number: 20230337421
    Abstract: Methods, systems and apparatus for managing capacitors in memory devices, e.g., three-dimensional (3D) memory devices are provided. In one aspect, a capacitor includes: a first terminal, a second terminal conductively insulated from the first terminal, and a capacitance structure that includes a plurality of layers sequentially stacked together. At least one layer includes: one or more first conductive parts and one or more second conductive parts that are conductively insulated in the layer, the one or more first conductive parts being conductively coupled to the first terminal, the one or more second conductive parts being conductively coupled to the second terminal. The at least one layer is configured such that at least one of the one or more second conductive parts forms at least one subordinate capacitor with at least one adjacent first conductive part.
    Type: Application
    Filed: April 19, 2022
    Publication date: October 19, 2023
    Applicant: Macronix International Co., Ltd.
    Inventors: Jung-Chuan Ting, Chih-Ting Hu
  • Publication number: 20230273648
    Abstract: A portable information handling system having a portable housing with first and second housing portions rotationally coupled by a hinge having an adjustable torque and a sensor disposed at a front corner of a housing portion reduces torque provided by the hinge when in a closed position and an indication is sensed of an end user opening the housing portions. Reducing torque of the hinge that resists housing rotation from the closed position aids an end user in a single handed rotation of the housing to an open position by allowing the weight of the housing to be sufficient to hold the housing in place on a support surface while the housing rotates open.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Applicant: Dell Products L.P.
    Inventors: Kuan-Hua Chiou, Chunpo Chen, Wen-Hsing Lin, Chia-Ting Hu, Yu-Chun Hsieh, Bo-Wei Chu, Jou-Yen Lu