Abstract: a pre-filter device capable of preventing water leakage, that includes: a connector, a water inlet channel, a plug, and a spring. The connector is connected to a water inlet tube, and is connected to the pre-filter device. The water inlet channel is disposed in the connector, and is connected to the pre-filter device. The plug is disposed in the water inlet channel, to open or close the water inlet channel. The spring is disposed between one end of the plug and the connector, the other end of the plug is connected to and acts in cooperation with the pre-filter device. When a pre-filter device capable of preventing water leakage is burst to leak out water, it is able to close the water inlet channel automatically, to avoid the problem deteriorating into flooding the entire household, to achieve timely self protection.

Abstract: A die stacking method is provided. The die stacking method includes executing a manufacturing recipe, and loading an interposer-die mapping file according to the manufacturing recipe. The interposer-die mapping file corresponds to an interposer wafer including interposer dies. The die stacking method also includes loading a combination setting data according to the interposer-die mapping file, and loading a top die number and a top-die ID code of a top-die mapping file according to the combination setting data and the interposer-die mapping file. The top-die ID code corresponds to a top wafer including top dies, and the top die number corresponds to one of the top dies. The die stacking method also includes disposing the one of the top dies of the top wafer on one of the interposer dies of the interposer wafer.

Abstract: Embodiments of the present application provide a packet processing method in a Point-to-Point Protocol over Ethernet (PPPoE) authentication process and a relevant device. A first broadcast access server (BAS) exists in a broadcast domain in which a user terminal is located, the first BAS supports the PPPoE and corresponds to a first operator. The method includes receiving, by the first BAS, a PPPoE active discovery initiation (PADI) packet sent by the user terminal; and when determining that a quantity of authentication failures of the user terminal on the first BAS is greater than a preset threshold, skipping sending, by the first BAS, a PPPoE active discovery offer (PADO) packet to the user terminal in a preset period. The technical solutions in the embodiments of the present application resolve a problem that the user terminal cannot perform access because the user terminal establishes a session with the first BAS.

Abstract: Electronic devices and methods for providing location information are provided, of which a representative method includes: generating sensor readings corresponding to sensed motion of the electronic device; determining a reference location information; computing a GPS-fused location information based on the reference location information and the sensor readings; generating a GPS-required event based on a change of the GPS-fused location information; generating a GPS-not-required event responsive to the reference location information being determined; receiving the GPS-fused location information and one of either the GPS-required event or the GPS-not-required event; responsive to the GPS-required event being received, operating the GPS receiver in a location information-acquiring mode during which the GPS receiver generates geographical location readings; and responsive to the GPS-not-required event being received, operating the GPS receiver in a power-saving mode during which the GPS receiver is deactivated.

Abstract: A computer stick docking system and a power management method thereof are provided. The computer stick docking system includes a docking station and a computer stick device. The docking station is configured to receive a display device and a computer stick device, including a docking battery and a docking HDMI interface circuit. The computer stick device includes a computer-stick controller and a computer-stick HDMI interface circuit. The computer-stick controller is configured to load an operating system. The computer-stick HDMI interface circuit, coupled to the computer-stick controller, is configured to request battery power information of the docking battery from the docking station after it is powered on and the computer-stick HDMI interface circuit is connected to the docking station.

Abstract: A die stacking method is provided. The die stacking method includes executing a manufacturing recipe, and loading an interposer-die mapping file according to the manufacturing recipe. The interposer-die mapping file corresponds to an interposer wafer including interposer dies. The die stacking method also includes loading a combination setting data according to the interposer-die mapping file, and loading a top die number and a top-die ID code of a top-die mapping file according to the combination setting data and the interposer-die mapping file. The top-die ID code corresponds to a top wafer including top dies, and the top die number corresponds to one of the top dies. The die stacking method also includes disposing the one of the top dies of the top wafer on one of the interposer dies of the interposer wafer.

Abstract: A method for testing a semiconductor device is disclosed. The method comprises positioning a probe card comprising a plurality of probes above the semiconductor device and moving the probe card in a vertical direction towards the semiconductor device. The plurality of probes are moving in a vertical direction towards a plurality of electrical structures of the semiconductor device until each probe of the plurality of probes has made mechanical contact with a corresponding electrical structure of the plurality of electrical structures with a minimum quantity of force. The each probe of the plurality of probes absorbs a portion of vertical overdrive after contacting their corresponding electrical structures. The probe card absorbs any remaining vertical overdrive. The vertical overdrive is a continuing vertical movement of the plurality of probes after a first probe of the plurality of probes mechanically contacts a first corresponding electrical structure.

Abstract: Embodiments of a die stacking apparatus are provided. The die stacking apparatus includes a storage device configured to contain a top wafer and an interposer wafer. The top wafer has a number of top dies, and the interposer wafer has a number of interposer dies. The die stacking apparatus also includes a carrier device configured to carry the interposer wafer, and a transferring device configured to transfer the interposer wafer to the carrier device and to dispose the top dies on the interposer dies. The die stacking apparatus further includes a process module configured to control the transferring device. The process module controls the transferring device to transfer the interposer wafer to the carrier device, and controls the transferring device to dispose the top dies on the interposer dies of the interposer wafer, which is stacked on the carrier device.

Abstract: A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.

Abstract: The invention relates to a method for determining an integrated network loss rate in the UHV AC cross-regional electricity trading. The method includes fitting a curve relationship between integrated network loss rates and transmitting powers on the basis of theoretical calculations of the UHV AC transmission line loss, using a relational fitted curve between actual values of integrated network loss rates and transmitting powers calculated according to gateway power statistical data to perform geometrical average correction on the original curve, and making planned values of the integrated network loss rates to be closer to the actual values according to a method for determining UHV AC integrated network loss rates according to a correction curve function relation, which greatly increases fairness of the trading settlement. The method is simple and easy to implement with high accuracy, and applicable to planning and trading settlement of regular or real-time UHV AC electricity trading.

Abstract: A power supply apparatus and a method for supplying power are provided. The method includes: providing a first power supply for outputting a first power signal; providing a second power supply for outputting a second power signal; and selectively charging the second power supply by using the first power supply.

Abstract: A computer stick docking system and a power management method thereof are provided. The computer stick docking system includes a docking station and a computer stick device. The docking station is configured to receive a display device and a computer stick device, including a docking battery and a docking HDMI interface circuit. The computer stick device includes a computer-stick controller and a computer-stick HDMI interface circuit. The computer-stick controller is configured to load an operating system. The computer-stick HDMI interface circuit, coupled to the computer-stick controller, is configured to request battery power information of the docking battery from the docking station after it is powered on and the computer-stick HDMI interface circuit is connected to the docking station.

Abstract: A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.

Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; wherein each probe is capable of elastic deformation when the probe tip comes in contact with the electronic devices; each probe comprising a plurality of isolated electrical vertical interconnect accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Abstract: A hierarchical security model for networked computer users is described. Files and resources are controlled or created by users within the network. Each user within the network has an account that is managed by a network administrator. The account specifies the user identifier and password. Users are grouped into organizations depending upon function or other organizational parameter. The groups within the network are organized hierarchically in terms of access and control privileges. Users within a higher level group may exercise access and control privileges over files or resources owned by users in a lower level group. The account for each user further specifies the group that the owner belongs to and an identifier for any higher level groups that have access privileges over the user's group. All users within a group inherit the rights and restrictions of the group.

Abstract: Embodiments of a die stacking apparatus are provided. The die stacking apparatus includes a storage device configured to contain a top wafer and an interposer wafer. The top wafer has a number of top dies, and the interposer wafer has a number of interposer dies. The die stacking apparatus also includes a carrier device configured to carry the interposer wafer, and a transferring device configured to transfer the interposer wafer to the carrier device and to dispose the top dies on the interposer dies. The die stacking apparatus further includes a process module configured to control the transferring device. The process module controls the transferring device to transfer the interposer wafer to the carrier device, and controls the transferring device to dispose the top dies on the interposer dies of the interposer wafer, which is stacked on the carrier device.

Abstract: A bonding apparatus includes a wafer stage, a first chip stage, a first transporting device, a second stage and a second transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second transporting device is used for transporting the second chip from the second chip stage onto the wafer.

Abstract: A boost circuit includes a power rail to provide a supply voltage, a switch transistor controlling output of a boosted signal from a source of the switch transistor, and a timing and voltage control circuit configured to generate an equalization (EQ) signal to be applied to a gate of the switch transistor. The EQ waveform has a level being an EQ high level, an EQ low level lower than the EQ high level, or an EQ clamped level between the EQ low level and the EQ high level.

Abstract: Image processing methods and systems for handheld devices are provided. First, an image effect is determined. Then, a plurality of preview images is continuously captured by an image capture unit of an electronic device. After the respective preview image is captured, the image effect is applied to the preview image, and the preview image applied with the image effect is displayed in a display unit of the electronic device.

Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.