Patents by Inventor Ting Yang

Ting Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147711
    Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Inventors: PERNG-FEI YUH, YIH WANG, MENG-SHENG CHANG, JUI-CHE TSAI, KU-FENG LIN, YU-WEI LIN, KEH-JENG CHANG, CHANSYUN DAVID YANG, SHAO-TING WU, SHAO-YU CHOU, PHILEX MING-YAN FAN, YOSHITAKA YAMAUCHI, TZU-HSIEN YANG
  • Publication number: 20240147648
    Abstract: A riser assembly may include a riser cage and a riser card. The riser cage includes sidewalls, a base extending from the sidewalls, and mounting features to mount the riser cage to a chassis of the electronic device. The base is coupled to the riser card positioned on a first side of the base. The base includes an opening to permit the connector to extend through the opening to protrude partially beyond the opening to a location on a second side of the base where the connector can detachably connect to an expansion card installed in the riser cage between the sidewalls. The base contacts the connector around the opening to provide lateral support to the connector on opposing faces (e.g., first sidewalls) of the connector.
    Type: Application
    Filed: October 31, 2022
    Publication date: May 2, 2024
    Inventors: Peng ChiangHsieh, Yi-Lung Chou, Chi Ting Yang
  • Publication number: 20240139988
    Abstract: Disclosed is a manufacturing method of a composite panel, comprising: a providing step of providing a flexible sheet; an attaching step of forming a lamellar structure by attaching at least one lamellar board to cover the flexible sheet; and a cutting step of cutting a plurality of longitudinal grooves in the lamellar structure layer to form a plurality of lamellar strips, thereby obtaining the composite panel that is able to be bent laterally into a curved configuration.
    Type: Application
    Filed: January 13, 2023
    Publication date: May 2, 2024
    Applicant: CAROL YOUNG CORPORATION
    Inventors: CHANG-JEN YANG, PAO-CHING YANG, CHUN-TING YANG
  • Patent number: 11973036
    Abstract: A method of manufacturing a semiconductor package structure is provided. The method includes providing a first carrier, forming a patterned buffer layer over the first carrier, forming a first redistribution structure that includes forming a first dielectric layer on the patterned buffer layer, after an electrical testing by applying an electric signal towards the first redistribution structure, removing the first carrier, removing portions of the first dielectric layer, resulting in a patterned first dielectric layer, the patterned first dielectric layer exposing portions of the first circuit layer, removing the exposed portions of the first circuit layer, using the patterned first dielectric layer as a mask, resulting in a patterned first circuit layer, and forming an electric conductor in a recess defined by the patterned first dielectric layer and the patterned first circuit layer.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: April 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Ting-Yang Chou
  • Publication number: 20240136183
    Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Ming-Hsi Yeh, Kuo-Bin Huang
  • Publication number: 20240136117
    Abstract: A multi-phase coupled inductor includes a first iron core, a second iron core, and a plurality of coil windings. The first iron core includes a first body and a plurality of first core posts. The plurality of first core posts are connected to the first body. The second iron core is opposite to the first iron core. The second iron core and the first body are spaced apart from each other by a gap. The plurality of coil windings wrap around the plurality of first core posts, respectively. Each of the coil windings has at least two coils.
    Type: Application
    Filed: October 1, 2023
    Publication date: April 25, 2024
    Inventors: HUNG-CHIH LIANG, PIN-YU CHEN, HANG-CHUN LU, YA-WEN YANG, YU-TING HSU, WEI-ZHI HUANG
  • Publication number: 20240131086
    Abstract: The present disclosure provides use of Clostridium ghonii combined with a tumor angiogenesis inhibitor in preparing a pharmaceutical product for treating a tumor. The present disclosure further provides a drug for treating a tumor, where the drug includes active ingredients of Clostridium ghonii and a tumor angiogenesis inhibitor.
    Type: Application
    Filed: October 9, 2022
    Publication date: April 25, 2024
    Inventors: Yong Wang, Yuanyuan Liu, Wenhua Zhang, Yanqiu Xing, Shaopeng Wang, Dan Wang, Hong Zhu, Xinglu Xu, Shengbiao Jiang, Xiaonan Li, Jiahui Zheng, Rong Zhang, Dongxia Yang, Yuxia Gao, Shili Shao, Ting Han
  • Patent number: 11968237
    Abstract: A processing blade is assigned from the plurality of processing blades to a session of data packets. The load balancing engine manages a session table and an IPsec routing table by updating the session table with a particular security engine card assigned to the session and by updating the IPsec routing table for storing a remote IP address for a particular session. Outbound raw data packets of a particular session are parsed for matching cleartext tuple information prior to IPsec encryption, and inbound encrypted data packets of the particular session are parsed for matching cipher tuple information prior to IPsec decryption. Inbound data packets assigned to the processing blade from the session table are parsed and forwarded to the station.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: April 23, 2024
    Assignee: Fortinet, Inc.
    Inventors: Yita Lee, Sen Yang, Ting Liu
  • Patent number: 11964212
    Abstract: A game board device is provided for carrying and identifying game pieces that are divided into different piece types. The game board device includes a board, a plurality of optically identifying modules, and a processing module electrically coupled to the optically identifying modules. The optically identifying modules respectively correspond in position to detection regions of the board. Each of the optically identifying modules includes a light emitter that can emit light toward the corresponding detection region and a light receiver that can receive light reflected by the corresponding detection region. When any one of the detection regions is in an unoccupied mode, the corresponding optically identifying module can emit an unoccupied signal. When any one of the detection regions is in an occupied mode, the corresponding optically identifying module enables an identification signal that corresponds to the piece type of the corresponding game piece to be emitted therefrom.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: April 23, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Chung-Ting Yang, Yen-Min Chang, Yen-Chang Wang
  • Patent number: 11967612
    Abstract: A method of manufacturing a semiconductor structure includes the following steps: providing a first semiconductor wafer, wherein the first semiconductor wafer includes a first dielectric layer and at least one first top metallization structure embedded in the first dielectric layer, and a top surface of the first dielectric layer is higher than a top surface of the first top metallization structure by a first distance; providing a second semiconductor wafer, wherein the second semiconductor wafer includes a second dielectric layer and at least one second top metallization structure embedded in the second dielectric layer, and a top surface of the second top metallization structure is higher than a top surface second dielectric layer of the by a second distance; and hybrid-bonding the first semiconductor wafer and the second semiconductor wafer.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: April 23, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Ting-Cih Kang, Hsih-Yang Chiu
  • Patent number: 11968908
    Abstract: In an embodiment, a method includes: forming a first inter-metal dielectric (IMD) layer over a semiconductor substrate; forming a bottom electrode layer over the first IMD layer; forming a magnetic tunnel junction (MTJ) film stack over the bottom electrode layer; forming a first top electrode layer over the MTJ film stack; forming a protective mask covering a first region of the first top electrode layer, a second region of the first top electrode layer being uncovered by the protective mask; forming a second top electrode layer over the protective mask and the first top electrode layer; and patterning the second top electrode layer, the first top electrode layer, the MTJ film stack, the bottom electrode layer, and the first IMD layer with an ion beam etching (IBE) process to form a MRAM cell, where the protective mask is etched during the IBE process.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tai-Yen Peng, Hui-Hsien Wei, Han-Ting Lin, Sin-Yi Yang, Yu-Shu Chen, An-Shen Chang, Qiang Fu, Chen-Jung Wang
  • Publication number: 20240129167
    Abstract: A communication receiver includes a first signal processing circuit and a second signal processing circuit. The first signal processing circuit includes a first feedforward equalizer and a decision circuit. The first feedforward equalizer processes a received signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a first symbol decision signal. The second signal processing circuit includes a second feedforward equalizer, a decision feedforward equalizer, and a first decision feedback equalizer. The second feedforward equalizer processes the first equalized signal to generate a second equalized signal. The decision feedforward equalizer processes the first symbol decision signal to generate a third equalized signal. The first decision feedback equalizer generates a second symbol decision signal according to the second equalized signal and the third equalized signal.
    Type: Application
    Filed: September 18, 2023
    Publication date: April 18, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chung-Hsien Tsai, Che-Yu Chiang, Yu-Ting Liu, Tsung-Lin Lee, Chia-Sheng Peng, Ting-Ming Yang
  • Publication number: 20240127863
    Abstract: The present disclosure relates to a method, apparatus, device, storage medium and program product for processing multimedia data. The method comprises: acquiring first multimedia draft data, wherein the first multimedia draft data is generated based on a segmented recording operation, video materials collected by the segmented recording operation being used to form video track segments in the first multimedia draft data; importing the first multimedia draft data into a first editor, so that the video track segments are displayed on a video editing track of the first editor; updating the first multimedia draft data in response to triggering a video editing operation for the video track segments on the first editor, to obtain second multimedia draft data; and generating a target video based on the second multimedia draft data in response to a trigger operation of video synthesis.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Inventors: Zhanpeng HUANG, Guangde HUANG, Hengan WU, Rongtao YANG, Ting LUO, Yihan YANG, Xuyue HAN
  • Patent number: 11960211
    Abstract: In an embodiment, an apparatus includes an energy source, a support platform for holding a wafer, an optical path extending from the energy source to the support platform, and a photomask aligned such that a patterned major surface of the photomask is parallel to the force of gravity, where the optical path passes through the photomask, where the patterned major surface of the photomask is perpendicular to a topmost surface of the support platform.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hung-Jui Kuo, Ting-Yang Yu, Ming-Tan Lee
  • Publication number: 20240117582
    Abstract: The embodiment of the present disclosure provides a recovery device for oil spilling on water, a control method thereof, and a recovery vessel. The recovery device includes a casing, a control center, a variable pressure airbag, an oil detector, an isolation layer, a water suction pump, and a drain pipe. The casing is of a hollow structure, the hollow structure is used to accommodate an oil-water mixture and used as a temporary oil collection tank, the upper part of the casing is provided with an oil-water mixture inlet, the bottom of the casing is provided with a drain port, and the side wall of the casting is provided with an oil suction port. The variable pressure airbag is arranged outside the casing, and the variable pressure airbag is configured to adjust buoyancy of the recovery device. The water suction pump is configured to pump out water in the casing and discharge water to a water environment outside the casing through the drain pipe.
    Type: Application
    Filed: June 9, 2023
    Publication date: April 11, 2024
    Applicant: CHANGZHOU UNIVERSITY
    Inventors: Hong JI, Jie GUO, Ke YANG, Juncheng JIANG, Zhixiang XING, Ting WANG
  • Patent number: 11955154
    Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
  • Patent number: 11953125
    Abstract: The embodiments of the present disclosure provide a detachable anti-vibration sealing protection device for a pipe flange. The protection device includes a casing, wherein left and right end surfaces of the casing have through holes for the pipeline to pass through, and the casing has an accommodation cavity for placing the flange; a first shock absorption assembly for radial shock absorption of the flange; and a second shock absorption assembly which is installed in a one-to-one correspondence with the flange and is configured for axial shock absorption of the corresponding flange. The first shock absorption assembly and the second shock absorption assembly are installed in the accommodation cavity.
    Type: Grant
    Filed: May 22, 2023
    Date of Patent: April 9, 2024
    Assignee: CHANGZHOU UNIVERSITY
    Inventors: Hong Ji, Yuchen Liu, Ke Yang, Zhixiang Xing, Juncheng Jiang, Yinhan Zhao, Jie Guo, Ting Wang, Wencong Shen
  • Patent number: 11950424
    Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Ting Tsai, Ching-Tzer Weng, Tsung-Hua Yang, Kao-Chao Lin, Chi-Wei Ho, Chia-Ta Hsieh
  • Publication number: 20240100068
    Abstract: In certain aspects, disclosed herein are methods of treating cancer in a subject, comprising administration to the subject of (1) one or more glucocorticoid receptor agonists and (2) one or more inhibitors of calcineurin. In some embodiments, the administration of the one or more glucocorticoid receptor agonists and the one or more inhibitors of calcineurin results in restoration of contact inhibition, increased formation of intercellular junctions, reduced cell proliferation, and/or increased vacuolization of cells growing in multilayer zones. Included herein are methods for identification of novel compounds that restore contact inhibition in cancer cells.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 28, 2024
    Inventors: Dun Yang, Thaddeus Allen, Jing Zhang, Shenqiu Zhang, Qiong Shi, Yan Long, Ting Zhang, Zhengchi He, Hongmei Li, Chenglu Yang
  • Patent number: D1020776
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: April 2, 2024
    Assignee: BEIJING ZITIAO NETWORK TECHNOLOGY CO., LTD.
    Inventor: Ting Yang