Patents by Inventor Ting Zhong

Ting Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming a barrier layer in interconnect joints and structures formed thereby
    Publication number: 20060205234
    Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a barrier layer on a substrate, wherein the barrier layer comprises molybdenum; and forming a lead free interconnect structure on the barrier layer.
    Type: Application
    Filed: March 11, 2005
    Publication date: September 14, 2006
    Inventors: Ting Zhong, Valery Dubin, Ming Fang
  • Preparation of electroless deposition solutions
    Patent number: 7087104
    Abstract: A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electroless deposition solution containing the entire group. In one embodiment of the invention, the metal ion includes a cobalt ion, the complexing agent includes citric acid, the ammonium salt includes ammonium chloride, and the strong base includes tetramethylammonium hydroxide.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: August 8, 2006
    Assignee: Intel Corporation
    Inventors: Hok-Kin Choi, Vani Thirumala, Valery Dubin, Chin-chang Cheng, Ting Zhong
  • Methods to deposit metal alloy barrier layers
    Publication number: 20060071340
    Abstract: Metal alloy barrier layers formed of a group VII metal alloyed with boron (B) and/or phosphorous (P) and an at least one element from glyoxylic acid, such as carbon (C), hydrogen (H), or carbon and hydrogen (CH) formed by electoless plating are described. These barrier layers may be used as a barrier layer over copper bumps that are soldered to a tin-based solder in a die package. Such barrier layers may also be used as barrier layer liners within trenches in which copper interconnects or vias are formed and as capping layers over copper interconnects or vias to prevent the electromigration of copper.
    Type: Application
    Filed: September 30, 2004
    Publication date: April 6, 2006
    Inventors: Ting Zhong, Fay Hua, Valery Dubin
  • Method for preparing hydroxamic acids
    Publication number: 20050272928
    Abstract: Processes for using a compound of formula III: to make compounds of formulae I and II: and processes for making the compound of formula III, where R1-5 and J are as defined herein.
    Type: Application
    Filed: June 7, 2005
    Publication date: December 8, 2005
    Applicant: Wyeth
    Inventors: Ting-Zhong Wang, Lalitha Krishnan, Joseph Zeldis, Jeremy Levin, Jean Schmid, Mellard Jennings, Huan-Qiu Li, Zhixin Wen
  • Glycopeptide antibiotics
    Patent number: 6914045
    Abstract: The invention provides compounds of formula Wherein R1, R2, R3, R4, R5, R6a, R6b, R6c, R6d, R6e and R7 are defined in the specification. These compounds are useful as antibiotic agents.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: July 5, 2005
    Assignee: Wyeth Holdings Corporation
    Inventors: Darren Robert Abbanat, Valerie Sue Bernan, Russell George Dushin, Michael Greenstein, Haiyin He, Stanley Albert Lang, Howard Newman, Subas Sakya, Phaik-Eng Sum, Alan Gordon Sutherland, Ting-Zhong Wang, Jason Arnold Lotvin, Mark Edward Ruppen, Arthur Emergy Bailey, Ping Cai, Bo Shen, Fangming Kong
  • Preparation of electroless deposition solutions
    Publication number: 20040265501
    Abstract: A system and method for storing a solution containing a subset of a group consisting of a metal ion, a complexing agent, an ammonium salt, and a strong base and then nearer to a time of use in an electroless deposition process, using the solution to form an electroless deposition solution containing the entire group. In one embodiment of the invention, the metal ion includes a cobalt ion, the complexing agent includes citric acid, the ammonium salt includes ammonium chloride, and the strong base includes tetramethylammonium hydroxide.
    Type: Application
    Filed: June 26, 2003
    Publication date: December 30, 2004
    Applicant: Intel Corporation
    Inventors: Hok-Kin Choi, Vani Thirumala, Valery Bubin, Chin-Chang Cheng, Ting Zhong
  • Glycopeptide antibiotics
    Publication number: 20030087812
    Abstract: The invention provides compounds of formula 1
    Type: Application
    Filed: April 25, 2002
    Publication date: May 8, 2003
    Applicant: American Cyanamid Company
    Inventors: Darren Robert Abbanat, Valerie Sue Bernan, Russell George Dushin, Michael Greenstein, Haiyin He, Stanley Albert Lang, Howard Newman, Subas Sakya, Phaik-Eng Sum, Alan Gordon Sutherland, Ting-Zhong Wang, Jason Arnold Lotvin, Mark Edward Ruppen, Arthur Emery Bailey, Ping Cai, Bo Shen, Fangming Kong