Abstract: Provided are techniques for comparing similar applications. A feature is identified from a linkage table, wherein the linkage table comprises a link to first information and a link to second information describing the feature, wherein the first information is for a first application and the second information is for a second application. There is redirection from a first web page to a second web page in a Graphical User Interface (GUI) with a first window in the second web page displaying the first information and a second window in the second web page displaying the second information.

Abstract: Distributing access to a document from a processing system includes sending or pushing a reference for a document within a repository to a storage area of a recipient system of a recipient to enable retrieval of the document from the repository. The reference is removed from the storage area of the recipient system of the recipient in response to an expiration of the document.

Abstract: Distributing access to a document from a processing system includes sending or pushing a reference for a document within a repository to a storage area of a recipient system of a recipient to enable retrieval of the document from the repository. The reference is removed from the storage area of the recipient system of the recipient in response to an expiration of the document.

Abstract: An autothermal reforming catalytic structure for generating hydrogen gas from liquid hydrocarbons, steam and an oxygen source. The autothermal reforming catalytic structure includes a support structure and nanosized mixed metal oxide particles dispersed homogenously throughout the support structure.

Abstract: A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).

Abstract: A system and method for magnetic survey uses an autonomous vehicle configured to traverse over the area in a grid pattern with a magnetometer coupled to the autonomous vehicle and configured to obtain magnetic measurements at a controlled rate, the magnetometer obtaining a uniform sampling of the magnetic measurements in each grid of the grid pattern; and a processor configured to obtain the magnetic survey based on the magnetic measurements.

Abstract: A low profile strip dual in-line memory module (200) includes a passive interposer support structure (90) with patterned openings (91-97) formed between opposing top and bottom surfaces, a plurality of memory chips (D1-D8) attached to the top and bottom surfaces, and vertical solder ball conductors (98) extending through the patterned openings to electrically connect the plurality of memory chips, where each memory chip has an attachment surface facing the passive interposer structure and a patterned array of horizontal conductors (e.g., 82-86) formed on the attachment surface with contact pads electrically connected to the plurality of vertical conductors to define at least one bus conductor that is electrically connected to each memory die in the first and second plurality of memory die.

Abstract: An autothermal reforming catalytic structure for generating hydrogen gas from liquid hydrocarbons, steam and an oxygen source. The autothermal reforming catalytic structure includes a support structure and nanosized mixed metal oxide particles dispersed homogenously throughout the support structure.

Abstract: An autothermal reforming catalytic structure for generating hydrogen gas from liquid hydrocarbons, steam and an oxygen source. The autothermal reforming catalytic structure includes a support structure and nanosized mixed metal oxide particles dispersed homogenously throughout the support structure.

Abstract: An autothermal reforming catalytic structure for generating hydrogen gas from liquid hydrocarbons, steam and an oxygen source. The autothermal reforming catalytic structure includes a support structure and metal particles dispersed homogenously throughout the support structure.

Abstract: An autothermal reforming catalytic structure for generating hydrogen gas from liquid hydrocarbons, steam and an oxygen source. The autothermal reforming catalytic structure includes a support structure and nanosized mixed metal oxide particles dispersed homogenously throughout the support structure.

Abstract: The dies of a stacked die integrated circuit (IC) employ the address bus to indicate the particular die, or set of dies, targeted by data on a data bus. During manufacture of the stacked die IC, the IC is programmed with information indicating a width of the address bus. During operation, each die addresses the other dies with addresses having the corresponding width based on this programmed information.

Abstract: A first semiconductor device die is provided having a bottom edge incorporating a notch structure that allows sufficient height and width clearance for a wire bond connected to a bond pad on an active surface of a second semiconductor device die upon which the first semiconductor device die is stacked. Use of such notch structures reduces a height of a stack incorporating the first and second semiconductor device die, thereby also reducing a thickness of a semiconductor device package incorporating the stack.

Abstract: A microelectronic device package including a package substrate, microelectronic component disposed on a first surface of a first portion of the substrate, and encapsulant material surrounding the microelectronic electronic component. An exposed surface of the first portion of the substrate is exposed through an opening in a first major surface of the encapsulant material. The exposed surface of the first portion has an edge. Encapsulant material is adjacent to the edge at the first major surface. The exposed surface is opposite the first surface. A stress relief feature located in one of the first major surface or a second major surface of the encapsulant material. The second major surface is opposite the first major surface. The stress relief feature reduces an amount of the encapsulant material and is 1 mm or less of a plane of the edge of the exposed surface. The plane is generally perpendicular to the exposed surface.

Abstract: A bypass system and method that mimics read timing of a memory system which includes a self-timing circuit and a sense amplifier. When prompted, the self-timing circuit initiates the sense amplifier to evaluate its differential input. The bypass system includes a memory controller that is configured to provide a bypass enable, to prompt the self-timing circuit, and to disable normal read control when a bypass read operation is indicated. A bypass latch latches an input data value, converts the input data value into an input complementary pair, and provides the complementary pair to the differential input of the sense amplifier. The sense amplifier, when initiated, evaluates the input complementary pair after its self-timing period and provides an output data value. The bypass latch and self-timing circuit may operate synchronous with a read clock in a read domain of the memory for more accurate memory read timing.

Abstract: Compounds are provided that can exhibit anti-cancer and/or anti-inflammatory properties, in some aspects, methods of treating an inflammatory disease or a hyperproliferative disease, such as cancer, with the compounds are provided.

Abstract: A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).

Abstract: A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).

Abstract: The dies of a stacked die IC are tested and, in response to detection of a defect at one of the dies, the type of defect is identified. If the defect is identified as a defective module repairable at the die itself, a redundant module of the die is used to replace the functionality of the defective module. If the defect is identified as one that is not repairable, a replacement die in the die stack is used to replace the functionality of the defective die.

Abstract: Systems, methods and other embodiments associated with spatial-domain Low-coherence Quantitative Phase Microscopy (SL-QPM) are described herein. SL-QPM can detect structural alterations within cell nuclei with nanoscale sensitivity (0.9 nm) (or nuclear nano-morphology) for “nano-pathological diagnosis” of cancer. SL-QPM uses original, unmodified cytology and histology specimens prepared with standard clinical protocols and stains. SL-QPM can easily integrate in existing clinical pathology laboratories. Results quantified the spatial distribution of optical path length or refractive index in individual nuclei with nanoscale sensitivity, which could be applied to studying nuclear nano-morphology as cancer progresses. The nuclear nano-morphology derived from SL-QPM offers significant diagnostic value in clinical care and subcellular mechanistic insights for basic and translational research. Techniques that provide for depth selective investigation of nuclear and other cellular features are disclosed.