Abstract: Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.

Abstract: An information processing device may display a first image indicating a storage area. The information processing device may display a second image in response to receiving a first specific operation performed on the first image. The information processing device may receive a second specific operation for selecting the second image. The information processing device may receive first path information in response to receiving the second specific operation The first path information may indicate a location of the storage area. The information processing device may send the first execution instruction to the image processing device, in the case that the second specific operation is received. The information processing device may receive scan data from the image processing device. The information processing device may store a data file of the received scan data in the storage area designated by the first path information.

Abstract: A steel material containing 0.01% to 0.07% C, 0.40% or less Si, 0.5% to 1.4% Mn, 0.1% or less Al, 0.01% to 0.15% Nb, 0.1% or less V, 0.03% or less Ti, and 0.008% or less N on a mass basis, Nb, V, and Ti satisfying Nb+V+Ti<0.15, Cm satisfying 0.12 or less, is heated to a heating temperature of 1,100° C. to 1,250° C., finish-rolled in such a way that the accumulative rolling reduction at a temperature of 930° C. or lower is 40% to 85% and the finished rolling temperature is 760° C. to 870° C., cooled to a cooling stop temperature of 500° C. or lower in terms of surface temperature at an average cooling rate of 30° C./s to 200° C./s in terms of thickness-wise center temperature, naturally cooled for more than 10 s after cooling is stopped, and coiled at a coiling temperature of 400° C. to 620° C.

Abstract: A hot-rolled steel sheet has a chemical composition containing, by mass %, C: 0.030% or more and 0.120% or less, Si: 0.05% or more and 0.50% or less, Mn: 1.00% or more and 2.20% or less, P: 0.025% or less, S: 0.0050% or less, N: 0.0060% or less, Al: 0.005% or more and 0.100% or less, Nb: 0.020% or more and 0.100% or less, Mo: 0.05% or more and 0.50% or less, Ti: 0.001% or more and 0.100% or less, Cr: 0.05% or more and 0.50% or less, Ca: 0.0005% or more and 0.0050% or less, and the balance being Fe and inevitable impurities, and has a microstructure including bainitic ferrite as a main phase and martensite and retained austenite as second phases, wherein a volume fraction of the main phase is 90% or more, an average grain diameter of the main phase is 10 ?m or less, a volume fraction of the martensite is 0.5% or more and 9.5% or less, and a volume fraction of the retained austenite is 0.5% or more and 9.

Abstract: An information processing device may display a first image indicating a storage area. The information processing device may display a second image in response to receiving a first specific operation performed on the first image. The information processing device may receive a second specific operation for selecting the second image. The information processing device may receive first path information in response to receiving the second specific operation The first path information may indicate a location of the storage area. The information processing device may send the first execution instruction to the image processing device, in the case that the second specific operation is received. The information processing device may receive scan data from the image processing device. The information processing device may store a data file of the received scan data in the storage area designated by the first path information.

Abstract: A hot-rolled steel sheet is provided having high strength and excellent toughness and ductility includes a composition that contains, on a mass percent basis, 0.04% or more and 0.15% or less of C, 0.01% or more and 0.55% or less of Si, 1.0% or more and 3.0% or less of Mn, 0.03% or less P, 0.01% or less S, 0.003% or more and 0.1% or less of Al, 0.006% or less N, 0.035% or more and 0.1% or less Nb, 0.001% or more and 0.1% or less of V, 0.001% or more and 0.1% or less Ti, and the balance being Fe and incidental impurities, in which the hot-rolled steel sheet includes a microstructure in which the proportion of precipitated Nb to the total amount of Nb is 35% or more and 80% or less, the volume fraction of tempered martensite and/or tempered bainite having a lath interval of 0.2 ?m or more and 1.6 ?m or less is 95% or more at a position 1.0 mm from a surface of the sheet in the thickness direction, and the volume fraction of ferrite having a lath interval of 0.2 ?m or more and 1.

Abstract: The present invention relates to an optical waveguide comprising a lower cladding layer, a patternized core layer and an upper cladding layer, wherein a striking part for positioning is provided in one end part thereof, and an optical path turning mirror face is formed in a position different from a striking part-forming end part in the above core layer. Capable of being provided are an optical waveguide and an optoelectronic circuit board each having a simple configuration in which an optical device is not mounted on an optical wiring part or an optoelectronic composite wiring part and capable of connecting an optical device with a core of an optical waveguide in an optical wiring part (optical waveguide) or an optoelectronic composite wiring part (optoelectronic circuit board) at a high position accuracy and an optical module comprising an optical waveguide or an optoelectronic circuit board and a connector.

Abstract: The present invention relates to a flexible opto-electric combined circuit board in which an optical waveguide film provided with a core and a clad is bonded to a flexible electric wiring board, wherein a reinforcing material is provided to at least a part of an optical waveguide film side in a bent part and electronic devices prepared by using the above flexible opto-electric combined circuit board. Capable of being provided are an opto-electric combined circuit board in which an optical waveguide film is bonded to a flexible electric wiring board and in which braking and cracking are not generated by bending or folding back and electronic devices prepared by using the above opto-electric combined circuit board.

Abstract: An optical fiber connector in which: an optical fiber guide member includes a fiber guide side substrate portion forming part of a substrate, a fiber guide pattern, and a lid member; and an optical waveguide includes an optical waveguide side substrate portion adjacent to the fiber guide side substrate portion, an optical waveguide side first lower clad layer, an optical signal transmission core pattern, and an optical waveguide side upper clad layer. The fiber guide pattern is formed of a plurality of guide members aligned parallel to one another at intervals. A space defined by every two adjacent guide members, the fiber guide side substrate portion, and a fiber guide side lid member portion forms a fiber guide groove. The fiber guide groove is present on an extension of the optical signal transmission core pattern in an optical path direction.

Abstract: The steel sheet has a chemical composition containing, by mass %, C: 0.04-0.08%, Si: 0.50% or less, Mn: 0.8-2.2%, P: 0.02% or less, S: 0.006% or less, Al: 0.1% or less, N: 0.008% or less, and Cr: 0.05-0.8%, and further Nb: 0.01-0.08%, V: 0.001-0.12%, and Ti: 0.005-0.04% in adjusted amounts, with the balance including Fe and incidental impurities. The steel sheet has a surface layer having a microstructure containing bainite as a main phase, martensite as a second phase in a volume fraction of 0.5-4%, and at lease one of ferrite phase, pearlite, and cementite as a third phase in a total volume fraction of 10% or less.

Abstract: According to a manufacturing method of an optical waveguide substrate including a core (12) and clads (11) (13) and provided with an optical axis conversion mirror (14) in the core and an alignment recess for the optical axis conversion mirror with respect to a light receiving and emitting element, the recess is obtained by obtaining an outline of the core by synthesizing at least an image captured by focusing a microscope (20) to a highest position (14a) of the core in an optical axis conversion mirror portion and an image captured by focusing the microscope to a lowest position (14d), and by determining a position of the alignment recess in reference to a center of gravity of the outline, and according to an optical waveguide substrate obtained by this manufacturing method, it becomes possible to provide an optical waveguide substrate in which the optical axis conversion mirror in the optical waveguide substrate and the light receiving and emitting element are aligned with respect to each other at an extrem

Abstract: A steel material containing 0.01% to 0.07% C, 0.40% or less Si, 0.5% to 1.4% Mn, 0.1% or less Al, 0.01% to 0.15% Nb, 0.1% or less V, 0.03% or less Ti, and 0.008% or less N on a mass basis, Nb, V, and Ti satisfying Nb+V+Ti<0.15, Cm satisfying 0.12 or less, is heated to a heating temperature of 1,100° C. to 1,250° C., finish-rolled in such a way that the accumulative rolling reduction at a temperature of 930° C. or lower is 40% to 85% and the finished rolling temperature is 760° C. to 870° C., cooled to a cooling stop temperature of 500° C. or lower in terms of surface temperature at an average cooling rate of 30° C./s to 200° C./s in terms of thickness-wise center temperature, naturally cooled for more than 10 s after cooling is stopped, and coiled at a coiling temperature of 400° C. to 620° C.

Abstract: The invention provides an optical waveguide including a resin substrate containing an inorganic filler, and at least a UV-absorbing layer, a lower cladding layer, a patterned core layer, and an upper cladding layer laminated above the resin substrate in this order, wherein the core layer has been patterned through light exposure and development, and the UV-absorbing layer has a thickness of 10 to 50 ?m, and a method for producing an optical waveguide, including a step of forming a UV-absorbing layer on a resin substrate containing an inorganic filler; a step of forming a lower cladding layer on the UV-absorbing layer; a step of forming a core layer on the lower cladding layer; a step of subjecting the core layer to light exposure to thereby transfer a pattern having a given shape to the core layer; a step of developing the core layer to thereby form a core pattern; and a step of forming an upper cladding layer on the patterned core layer.

Abstract: The present invention relates to a resin composition for an optical material comprising (A) a carboxylic acid-modified phenoxy resin, (B) a polymerizable compound and (C) a polymerization initiator, a resin film for an optical material comprising the above resin composition and an optical waveguide having a core part and/or a cladding layer formed by using the same. Provided are a resin composition for an optical material which is excellent in a heat resistance and a transparency and which is soluble in an alkaline aqueous solution, a resin film for an optical material comprising the above resin composition and an optical waveguide produced by using the same.

Abstract: The present invention relates to a phenoxy resin for an optical material obtained by subjecting at least one selected from specific difunctional epoxy resins and at least one selected from specific difunctional phenols to polyaddition reaction, wherein a film comprising the above phenoxy resin has a refractive index of 1.580 or less at 25° C. and a wavelength of 830 nm, a resin composition for an optical material containing the above phenoxy resin, a resin film for an optical material comprising the above resin composition and an optical waveguide produced by using the above resin composition and/or the above resin film.