Abstract: A Hall sensor has a P-type semiconductor substrate and a Hall sensing portion having a square shape and an N-type conductivity disposed on a surface of the semiconductor substrate. The Hall sensor includes Hall voltage output terminals having the same shape with each other, and control current input terminals having the same shape with each other. The Hall voltage output terminals are disposed at respective ones of four vertices of the Hall sensing portion. The control current input terminals include pairs of control current input terminals disposed at respective ones of the four vertices of the Hall sensing portion and arranged on both sides of respective ones of the Hall voltage output terminals in spaced apart relation from the Hall voltage output terminals so as to prevent electrical connection between the control current input terminals and the Hall voltage output terminals.

Abstract: Provided is a highly-sensitive Hall element capable of eliminating an offset voltage without increasing the chip size. The Hall element includes: a Hall sensing portion having a shape of a cross and four convex portions; Hall voltage output terminals which are arranged at the centers of the front edges of the four convex portions, respectively; and control current input terminals which are arranged on side surfaces of each of the convex portions independently of the Hall voltage output terminals. In this case, the Hall voltage output terminal has a small width and the control current input terminal has a large width.

Abstract: A photoelectric conversion device has pixel comprised of a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type disposed in the first semiconductor region. A first diffusion region of the first conductivity type is held at a predetermined potential, covers entirely the first semiconductor region, and covers only a part of an upper portion of the second semiconductor region. A second diffusion region of the second conductivity type covers a part of the upper portion of the second semiconductor region except for the part of the upper portion of the second semiconductor region covered by the first diffusion region. A thick oxide film covers entirely the first diffusion region and covers the upper portion of the second semiconductor region except for the part of the upper portion of the second semiconductor region covered by the second diffusion region.

Abstract: Provided is a photodetection device which is small in size and has excellent sensitivity. The photodetection device (10) puts cathode terminals of photodiodes (1 and 2) having different spectral characteristics, or a photodiode (1) provided with an optical filter and a photodiode (2) provided with a light shield layer, into an open end state, and detects light intensity of a desired wavelength region according to a difference in electric charges that have been stored in those photodiodes in a given period of time. Since the photodiodes 1 and 2 store electric charges, even if a photocurrent is small, it is possible to store the photocurrent to obtain the electric charges required for detection, permitting achievement of downsizing and high detection performance of the semiconductor device on which the photodiodes 1 and 2 are formed.

Abstract: Provided is a photodetection device which is small in size and has excellent sensitivity. A photodetection device puts cathode terminals of photodiodes having different spectral characteristics into an open end state, and detects light intensity of a desired wavelength region according to a difference in electric charges that have been stored in those photodiodes in a given period of time. The photodiodes employ a system of storing electric charges, and hence even if a photocurrent is small, the photocurrent may be stored to obtain the electric charges required for detection, and the downsizing and high detection performance of a semiconductor device that forms the photodiodes may be achieved.

Abstract: Provided is a highly-sensitive Hall element capable of eliminating an offset voltage without increasing the chip size. At the four vertices of a square Hall sensing portion, Hall voltage output terminals and control current input terminals are respectively arranged independently from each other. The Hall voltage output terminals all have the same shape. The control current input terminals are arranged on both sides of the Hall voltage output terminals, respectively, to be spaced apart from the Hall voltage output terminals so as to prevent electrical connection to the Hall voltage output terminals, and have the same shape at the four vertices.

Abstract: Provided is a highly-sensitive Hall element capable of eliminating an offset voltage without increasing the chip size. The Hall element includes: a Hall sensing portion having a shape of a cross and four convex portions; Hall voltage output terminals which are arranged at the centers of the front edges of the four convex portions, respectively; and control current input terminals which are arranged on side surfaces of each of the convex portions independently of the Hall voltage output terminals. In this case, the Hall voltage output terminal has a small width and the control current input terminal has a large width.

Abstract: A thermal head driving IC for supplying voltage to a plurality of heating resistors each controlled by a driving MOS transistor includes a switch for making and breaking electrically between a substrate and a source of the plurality of driving MOS transistors. In a case where the plurality of heating resistors are activated, the plurality of driving MOS transistors are turned on and the switch is turned off, whereby the substrate potential is floated. As a result, the substrate potential is forward-biased against the source by a substrate current generated in a high-electric-field depletion region near the drain, and a parasitic bipolar transistor turns on, whereby both the plurality of driving MOS transistors and the parasitic bipolar transistor turn on. In a case where the plurality of heating resistors are not activated, a signal for turning off the plurality of driving NMOS transistors is given, and the switch is turned on.

Abstract: A plurality of line image sensor ICs 110 are formed to be arranged in X, Y directions with gaps therebetween on a semiconductor substrate 101. The gaps between the line image sensor ICs 110 become scribe lines 102X, 102Y. A pattern of dummy interconnects 120 is formed in a region where a short side 110S of an arbitrary line image sensor IC 110 is opposed to a short side 110S of another line image sensor IC 110 adjacent to the arbitrary line image sensor IC 110 in the X direction in a region where the scribe line 102Y is formed. When a material gas is generated by plasma CVD, the material gas is uniformly deposited not only on the line image sensor ICs 110, but also on the dummy interconnects 120. Consequently, a protective film with a uniform thickness can be formed on the line image sensor ICs 110.

Abstract: Provided is a photodetection device which is small in size and has excellent sensitivity. A photodetection device puts cathode terminals of photodiodes having different spectral characteristics into an open end state, and detects light intensity of a desired wavelength region according to a difference in electric charges that have been stored in those photodiodes in a given period of time. The photodiodes employ a system of storing electric charges, and hence even if a photocurrent is small, the photocurrent may be stored to obtain the electric charges required for detection, and the downsizing and high detection performance of a semiconductor device that forms the photodiodes may be achieved.

Abstract: Provided is a photodetection device which is small in size and has excellent sensitivity. The photodetection device (10) puts cathode terminals of photodiodes (1 and 2) having different spectral characteristics, or a photodiode (1) provided with an optical filter and a photodiode (2) provided with a light shield layer, into an open end state, and detects light intensity of a desired wavelength region according to a difference in electric charges that have been stored in those photodiodes in a given period of time. Since the photodiodes 1 and 2 store electric charges, even if a photocurrent is small, it is possible to store the photocurrent to obtain the electric charges required for detection, permitting achievement of downsizing and high detection performance of the semiconductor device on which the photodiodes 1 and 2 are formed.

Abstract: In order to provide a wafer level semiconductor device, a protection film and a stress buffer layer are formed on a metal wiring formed on a semiconductor element, a via-hole that passes through the protection film and the stress buffer layer is formed so as to expose the metal wiring, and a bump electrode is formed on a conductive layer that fills the via-hole.

Abstract: Provided is a photoelectric conversion device including: a semiconductor substrate (3) of a first conductivity type; a photoelectric conversion region (7) of a second conductivity type which is located in the semiconductor substrate (3), the second conductivity type being opposite to the first conductivity type; and a buried layer (17) of the first conductivity type which is formed in an inner portion of the semiconductor substrate (3) to cover a lower side of the photoelectric conversion region (7), the buried layer (17) including a higher impurity concentration than the semiconductor substrate (3).

Abstract: A photoelectric conversion device (10) includes a first conductivity type first semiconductor region (10a) located in a pixel region (11), a second conductivity type second semiconductor region (12) provided in the first semiconductor region (10a), for storing a signal charge, interconnecting portions (13 and 14) for connecting the second semiconductor region (12) with a circuit element provided outside the pixel region (11), and an organic film (16) which is provided above a portion located in the pixel region (11) in the interconnecting portions (13 and 14) through an insulating protective film (15) and held at a predetermined potential. The organic film (16) is made of a thermoplastic polyimide resin containing one of a conductive particle and a conductive fiber.

Abstract: A plurality of line image sensor ICs 110 are formed to be arranged in X, Y directions with gaps therebetween on a semiconductor substrate 101. The gaps between the line image sensor ICs 110 become scribe lines 102X, 102Y. A pattern of dummy interconnects 120 is formed in a region where a short side 110S of an arbitrary line image sensor IC 110 is opposed to a short side 110S of another line image sensor IC 110 adjacent to the arbitrary line image sensor IC 110 in the X direction in a region where the scribe line 102Y is formed. When a material gas is generated by plasma CVD, the material gas is uniformly deposited not only on the line image sensor ICs 110, but also on the dummy interconnects 120. Consequently, a protective film with a uniform thickness can be formed on the line image sensor ICs 110.

Abstract: Shields that transmit light to be detected and have conductivity are disposed on light receiving surfaces of photodiodes (1 and 2) to prevent electric charges from being induced to the photodiodes (1 and 2) by electromagnetic waves entered from an external. Two kinds of filters having light transmittance depending on a wavelength of light are disposed on the light receiving surfaces of the photodiodes (1 and 2), respectively, to take a difference between their spectral characteristics. The shield and filter may be made of, for example, polysilicon or a semiconductor thin film of a given conductivity type, and may be readily manufactured by incorporating those manufacturing processes into a semiconductor manufacturing process.

Abstract: Shields that transmit light to be detected and have conductivity are disposed on light receiving surfaces of photodiodes (1 and 2) to prevent electric charges from being induced to the photodiodes (1 and 2) by electromagnetic waves entered from an external. Two kinds of filters having light transmittance depending on a wavelength of light are disposed on the light receiving surfaces of the photodiodes (1 and 2), respectively, to take a difference between their spectral characteristics. The shield and filter may be made of, for example, polysilicon or a semiconductor thin film of a given conductivity type, and may be readily manufactured by incorporating those manufacturing processes into a semiconductor manufacturing process.

Abstract: Provided is a thermal head driving IC for supplying voltage to a plurality of heating resistors each controlled by a driving MOS transistor, including a switch for making and breaking between a substrate and a source of the plurality of driving MOS transistors. In a case where the plurality of heating resistors are activated, the plurality of driving MOS transistors are turned on and the switch is turned off, a substrate is floated. As a result, a substrate potential is forward-biased against the source by a substrate current generated in a high-electric-field depletion region near the drain, and a parasitic bipolar transistor turns on, whereby both the plurality of driving MOS transistors and the parasitic bipolar transistor turn on. In a case where the plurality of heating resistors are not activated, a signal for turning off the plurality of driving NMOS transistors is given, and the switch is turned on.

Abstract: A photoelectric conversion device (10) includes a first conductivity type first semiconductor region (10a) located in a pixel region (11), a second conductivity type second semiconductor region (12) provided in the first semiconductor region (10a), for storing a signal charge, interconnecting portions (13 and 14) for connecting the second semiconductor region (12) with a circuit element provided outside the pixel region (11), and an organic film (16) which is provided above a portion located in the pixel region (11) in the interconnecting portions (13 and 14) through an insulating protective film (15) and held at a predetermined potential. The organic film (16) is made of a thermoplastic polyimide resin containing one of a conductive particle and a conductive fiber.

Abstract: Provided is a photoelectric conversion device including: a semiconductor substrate (3) of a first conductivity type; a photoelectric conversion region (7) of a second conductivity type which is located in the semiconductor substrate (3), the second conductivity type being opposite to the first conductivity type; and a buried layer (17) of the first conductivity type which is formed in an inner portion of the semiconductor substrate (3) to cover a lower side of the photoelectric conversion region (7), the buried layer (17) including a higher impurity concentration than the semiconductor substrate (3).