Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Abstract: A light emitting module includes: a first substrate including a resin having insulation properties, and a copper component embedded in the resin; a second substrate placed above the copper component of the first substrate, and soldered to the copper component; a mounting electrode formed above the second substrate; and an LED placed above the second substrate, and gold-tin soldered to the mounting electrode.

Abstract: An accelerator pedal reaction force control device for controlling a depression reaction force of an accelerator pedal provided to a motor vehicle, the control device including: a reaction force actuator that provides the accelerator pedal with a depression reaction force; a target reaction force setting unit that sets a target depression reaction force; and a vehicle speed maintenance depression amount setting unit that sets an amount of depression of the accelerator pedal for maintaining a current vehicle speed as a vehicle speed maintenance depression amount, wherein, when a pedal depression amount exceeds the vehicle speed maintenance depression amount, the target reaction force setting unit performs a cruize assist whereby the target depression reaction force is set to a value of a cruize assist depression reaction force.

Abstract: An organic electroluminescent element includes: a substrate; an organic light emitter including a first electrode, an organic light-emitting layer, and a second electrode; and a sealing member covering the organic light emitter. The first electrode, the organic light-emitting layer and the second electrode are located in this order. An electrode lead-out part is provided on a surface of an end of the substrate. The electrode lead-out part is externally led out from the sealing member. A wiring board is provided on an opposite side of the sealing member from the substrate. The wiring board has a surface which a wiring connecting electrode is in. The wiring board includes an external electrode pad electrically connected to the wiring connecting electrode. The wiring connecting electrode and the electrode lead-out part are electrically connected to each other by a coating-type conductive material.

Abstract: A reaction force control unit calculates a driver's requested output and then estimates a maximum output that can be generated by an engine in a current cylinder deactivation operation. Next, the reaction force control unit calculates a difference between the maximum output and the requested output as an output difference and then determines whether the output difference has reached a predetermined reaction force start threshold value, and if the determination result is Yes, the reaction force control unit estimates a number of to-be-reactivated cylinders on the basis of the output difference and the current cylinder deactivation operation state. Subsequently, the reaction force control unit sets a target reaction force on the basis of the output difference and the number of to-be-reactivated cylinders, and outputs drive current to a reaction force actuator.

Abstract: The organic electroluminescence element includes: a substrate; an organic light emitter formed on a surface of the substrate and including a first electrode, an organic light emitting layer, and a second electrode in this order; and an enclosing member bonded to the substrate to enclose the organic light emitter by covering it. The element further includes: an extended electrode part electrically connected to the first electrode and/or the second electrode and extending outward across the enclosing member to be on a surface of an end part of the substrate; and an electrode piece serving as an interconnection electrode and provided on an opposite side of the enclosing member from the substrate. The electrode piece includes an extension part fixed to the extended electrode part to make electric connection between the electrode piece and the extended electrode part.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: A toroidal continuously variable transmission of the present invention comprises: input side disks (1a, 1b) and output side disks (6) being supported concentric with each other such that the disks can rotate freely; a trunnion (9) that comprises end sections (36) on both ends on which tilt shafts (13) that are concentric with each other are provided, and a support beam section (15) that extends between both end sections (36), the trunnion (9) being capable of pivotally displacing around the tilt shafts (13); a thrust rolling bearing (17); and a power roller (8) that is supported to the inside surface of the trunnion (9) by way of the thrust rolling bearing (17) such that it rotates freely; wherein the support beam section (15) comprises an inside surface having a cylindrical convex surface (14); the thrust rolling bearing (17) comprises an outer race (18a) having an outside surface with a concave section (19a) that fits with the cylindrical convex surface (14) of the support beam section (15), and a plurality

Abstract: An organic electroluminescent lighting device includes an organic electroluminescent element which has a first electrode, a light-emitting layer, and a second electrode, which is formed on a surface of a base substrate and which is sealed with an opposed substrate. The organic electroluminescent lighting device further includes an auxiliary electrode that includes a transparent conductive layer made of optically-transparent electrode material, a conductive resin layer made of electric conductive resin, and a metal film layer made of metal having higher electric conductivity than that of the material of the transparent conductive layer, which are stacked in this order on the surface of the base substrate. The auxiliary electrode is formed on the surface of the base substrate so as to be across an opening edge of the opposed substrate. The auxiliary electrode is formed with a block structure configured to block moisture permeation through the conductive resin layer from outside.

Abstract: A reaction force control unit calculates a driver's requested output and then estimates a maximum output that can be generated by an engine in a current cylinder deactivation operation. Next, the reaction force control unit calculates a difference between the maximum output and the requested output as an output difference and then determines whether the output difference has reached a predetermined reaction force start threshold value, and if the determination result is Yes, the reaction force control unit estimates a number of to-be-reactivated cylinders on the basis of the output difference and the current cylinder deactivation operation state. Subsequently, the reaction force control unit sets a target reaction force on the basis of the output difference and the number of to-be-reactivated cylinders, and outputs drive current to a reaction force actuator.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: An accelerator pedal reaction force control device for controlling a depression reaction force of an accelerator pedal provided to a motor vehicle, the control device including: a reaction force actuator that provides the accelerator pedal with a depression reaction force; a target reaction force setting unit that sets a target depression reaction force; and a vehicle speed maintenance depression amount setting unit that sets an amount of depression of the accelerator pedal for maintaining a current vehicle speed as a vehicle speed maintenance depression amount, wherein, when a pedal depression amount exceeds the vehicle speed maintenance depression amount, the target reaction force setting unit performs a cruise assist whereby the target depression reaction force is set to a value of a cruise assist depression reaction force.

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: Of three chips (2A), (2B), and (2C) mounted on a main surface of a package substrate (1) in a multi-chip module (MCM), a chip (2A) with a DRAM formed thereon and a chip (2B) with a flash memory formed thereon are electrically connected to wiring lines (5) of the package substrate (1) through Au bumps (4), and a gap formed between main surfaces (lower surfaces) of the chips (2A), (2B) and a main surface of the package substrate (1) is filled with an under-fill resin (6). A chip (2C) with a high-speed microprocessor formed thereon is mounted over the two chips (2A) and (2B) and is electrically connected to bonding pads (9) of the package substrate (1) through Au wires (8).

Abstract: To provide a power generation member having a high power generating capacity, a power generation device using the same, and a power generation system. A power generation member 1 includes: a piezoelectric element 2 in which electrodes 2a and 2c are formed on both main faces of a plate-shaped piezoelectric ceramic 2b; a pressing member to press one main face of the piezoelectric element 2; and a support member 4 to support the other main face of the piezoelectric element 2, wherein the support member 4 supports an outer rim of the piezoelectric element 2, and the pressing member 3 presses the piezoelectric element 2 at a part inside the support member 4 with a planar pressing face. It is possible to reduce cancellation of the generated charge, as well as to allow the piezoelectric ceramic 2b to deform sufficiently to produce large strain by pressure energy generated by a walking man or vibration energy generated by a running car and the like. As a result, it is possible to effectively obtain large electricity.