Patents by Inventor Toshinobu Miyagoshi
Toshinobu Miyagoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230382070Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.Type: ApplicationFiled: May 25, 2023Publication date: November 30, 2023Applicant: TDK CORPORATIONInventors: Yohei SATO, Hiroshi KOIZUMI, Toshinobu MIYAGOSHI, Osamu SHINDO, Seijiro SUNAGA, Mitsuyoshi MAKIDA, Makoto YAMASHITA, Yasuo KATO, Ryo SHINDO, Masashi MATSUMOTO
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Publication number: 20230381904Abstract: A substrate processing apparatus 10 having a lower jig plate 46 for arranging a substrate 2 as an object to be pressurized, a support member 45 including an installation portion 52 for installing columnar members 50 supporting the lower jig plate 46, in which the columnar members 50 are placed to the installation portion 52 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.Type: ApplicationFiled: May 25, 2023Publication date: November 30, 2023Applicant: TDK CORPORATIONInventors: Yohei SATO, Hiroshi KOIZUMI, Toshinobu MIYAGOSHI, Osamu SHINDO, Seijiro SUNAGA, Makoto YAMASHITA, Yasuo KATO, Mitsuyoshi MAKIDA, Masashi MATSUMOTO
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Publication number: 20230187258Abstract: [Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same. [Solution] A stamp tool 10 includes a stamp layer 12 allowing an element 32r as an transport object element to detachably adhere thereto, a support plate 14 to which the stamp layer 12 is fixed, and an adapter plate 16 having a mounting surface 16a, the support plate 14 being replaceably attached thereto, and a transport head 22 being allowed to be detachably attached thereon.Type: ApplicationFiled: March 30, 2021Publication date: June 15, 2023Applicant: TDK CORPORATIONInventors: Seijiro SUNAGA, Makoto YAMASHITA, Toshinobu MIYAGOSHI, Yasuo KATO, Tatsunori OTOMO, Mitsuyoshi MAKIDA, Yohei SATO
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Publication number: 20230140856Abstract: A stamp tool holding device capable of holding a stamp tool while keeping a stamp surface of the stamp tool clean, a stamp tool positioning device that easily positions a stamp tool with respect to a transport head, a multi-element transfer device for efficiently transferring a transport object element such as an element using a stamp tool, and a method of manufacturing an element array using the same, wherein the stamp tool holding device has an installation stage on which a stamp tool is detachably installed. The installation stage has an installation surface on which a housing recess for accommodating a stamp layer of the stamp tool is formed, and a suction hole capable of detachably adsorbing a part of the stamp tool located around the stamp layer is formed on the installation surface.Type: ApplicationFiled: March 30, 2021Publication date: May 11, 2023Applicant: TDK CORPORATIONInventors: Seijiro SUNAGA, Makoto YAMASHITA, Toshinobu MIYAGOSHI, Yasuo KATO, Tatsunori OTOMO, Mitsuyoshi MAKIDA, Yohei SATO
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Publication number: 20230093241Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.Type: ApplicationFiled: March 4, 2021Publication date: March 23, 2023Applicant: TDK CORPORATIONInventors: Hiroshi KOIZUMI, Yasuo KATO, Makoto YAMASHITA, Mitsuyoshi MAKIDA, Ryo SHINDO, Osamu SHINDO, Hiroshi IIZUKA, Seijiro SUNAGA, Toshinobu MIYAGOSHI
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Patent number: 11541477Abstract: An ultrasonic bonding device includes a stage and an ultrasonic horn. A first flat member and a second flat member to be bonded are placed on the stage. The ultrasonic horn includes a press part to be pressed on a laminated portion of the first flat member and the second flat member. The stage includes a lower-side surface, a higher-side surface, and a step wall surface. The first flat member is to be placed on the lower-side surface. The higher-side surface is positioned higher than the lower-side surface by a predetermined step height. The second flat member is to be placed on the higher-side surface. The step wall surface is positioned in a boundary between the lower-side surface and the higher-side surface.Type: GrantFiled: June 5, 2019Date of Patent: January 3, 2023Assignee: TDK CORPORATIONInventors: Seijiro Sunaga, Toshinobu Miyagoshi, Mitsuyoshi Makida
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Patent number: 11267071Abstract: An ultrasonic bonding head includes a vibrator unit, a holder, and a pressurizing shaft. The vibrator unit includes a press part formed at a tip of the vibrator unit in a longitudinal axis thereof and configured to press a bonding scheduled part to be bonded. The holder holds a base of the vibrator unit in a cantilever manner so that the tip is a free end. The pressurizing shaft is connected with the holder and transmits a force of pressing the press part against the bonding scheduled part so that the vibrator unit moves substantially perpendicularly to the longitudinal axis. The holder is provided with a restraint portion. The restraint portion contacts with the vibrator unit at a counterforce dispersion position located between a main hold position for holding the vibrator unit by the holder and the free end.Type: GrantFiled: June 27, 2019Date of Patent: March 8, 2022Assignee: TDK CORPORATIONInventors: Seijiro Sunaga, Toshinobu Miyagoshi, Tatsunori Otomo
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Patent number: 11167541Abstract: An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.Type: GrantFiled: December 13, 2019Date of Patent: November 9, 2021Assignee: TDK CORPORATIONInventors: Toshinobu Miyagoshi, Seijiro Sunaga, Osamu Shindo, Yasuo Kato
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Patent number: 11101317Abstract: In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.Type: GrantFiled: December 13, 2019Date of Patent: August 24, 2021Assignee: TDK CORPORATIONInventors: Toshinobu Miyagoshi, Seijiro Sunaga, Osamu Shindo, Yasuo Kato
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Publication number: 20200227468Abstract: In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.Type: ApplicationFiled: December 13, 2019Publication date: July 16, 2020Applicant: TDK CORPORATIONInventors: Toshinobu MIYAGOSHI, Seijiro SUNAGA, Osamu SHINDO, Yasuo KATO
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Publication number: 20200215809Abstract: An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.Type: ApplicationFiled: December 13, 2019Publication date: July 9, 2020Applicant: TDK CORPORATIONInventors: Toshinobu MIYAGOSHI, Seijiro SUNAGA, Osamu SHINDO, Yasuo KATO
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Publication number: 20200001391Abstract: An ultrasonic bonding head includes a vibrator unit, a holder, and a pressurizing shaft. The vibrator unit includes a press part formed at a tip of the vibrator unit in a longitudinal axis thereof and configured to press a bonding scheduled part to be bonded. The holder holds a base of the vibrator unit in a cantilever manner so that the tip is a free end. The pressurizing shaft is connected with the holder and transmits a force of pressing the press part against the bonding scheduled part so that the vibrator unit moves substantially perpendicularly to the longitudinal axis. The holder is provided with a restraint portion. The restraint portion contacts with the vibrator unit at a counterforce dispersion position located between a main hold position for holding the vibrator unit by the holder and the free end.Type: ApplicationFiled: June 27, 2019Publication date: January 2, 2020Applicant: TDK CORPORATIONInventors: Seijiro SUNAGA, Toshinobu MIYAGOSHI, Tatsunori OTOMO
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Publication number: 20190375041Abstract: An ultrasonic bonding device includes a stage and an ultrasonic horn. A first flat member and a second flat member to be bonded are placed on the stage. The ultrasonic horn includes a press part to be pressed on a laminated portion of the first flat member and the second flat member. The stage includes a lower-side surface, a higher-side surface, and a step wall surface. The first flat member is to be placed on the lower-side surface. The higher-side surface is positioned higher than the lower-side surface by a predetermined step height. The second flat member is to be placed on the higher-side surface. The step wall surface is positioned in a boundary between the lower-side surface and the higher-side surface.Type: ApplicationFiled: June 5, 2019Publication date: December 12, 2019Applicant: TDK CORPORATIONInventors: Seijiro SUNAGA, Toshinobu MIYAGOSHI, Mitsuyoshi MAKIDA
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Patent number: 10162137Abstract: A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.Type: GrantFiled: April 25, 2013Date of Patent: December 25, 2018Assignee: NIPPON MEKTRON, LTD.Inventors: Toru Mizuno, Hiroshi Ikeda, Tatsunori Otomo, Toshinobu Miyagoshi, Shoji Takano, Fumihiko Matsuda, Garo Miyamoto
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Publication number: 20150153523Abstract: A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.Type: ApplicationFiled: April 25, 2013Publication date: June 4, 2015Applicant: NIPPON MEKTRON, LTD.Inventors: Toru Mizuno, Hiroshi Ikeda, Tatsunori Otomo, Toshinobu Miyagoshi, Shoji Takano, Fumihiko Matsuda, Garo Miyamoto
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Patent number: 7828190Abstract: In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.Type: GrantFiled: April 6, 2009Date of Patent: November 9, 2010Assignee: TDK CorporationInventors: Yuji Saito, Tomomi Asakura, Mitsuyoshi Makida, Toru Mizuno, Toshinobu Miyagoshi
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Patent number: 7814645Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.Type: GrantFiled: July 18, 2008Date of Patent: October 19, 2010Assignee: TDK CorporationInventors: Toru Mizuno, Tomomi Asakura, Yuji Saito, Hiroyuki Takano, Toshinobu Miyagoshi
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Publication number: 20090255979Abstract: In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.Type: ApplicationFiled: April 6, 2009Publication date: October 15, 2009Applicant: TDK CORPORATIONInventors: Yuji Saito, Tomomi Asakura, Mitsuyoshi Makida, Toru Mizuno, Toshinobu Miyagoshi
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Patent number: 7508115Abstract: A horn that can suppress oscillation components other than the component in the horizontal direction, a horn unit, and a bonding apparatus using same are provided. The horn has a cross-section variable section in which a cross section perpendicular to the lengthwise direction (X direction) thereof has a first region extending in the Z direction and a pair of second regions sandwiching the first region from Y direction. In the position P3 corresponding to an anti-node of a standing wave of oscillations excited in the horn, a sectional area S1 of the first region assumes a maximum and a sectional area S2 of the second region assumes a minimum. With a transition from the position P3 to the other positions corresponding to nodes, the sectional area S1 decreases and the sectional area S2 increases. As a result, oscillation components other than those in the X direction are suppressed.Type: GrantFiled: December 18, 2006Date of Patent: March 24, 2009Assignee: TDK CorporationInventors: Norihiko Kawada, Yuji Saito, Masakazu Nakayama, Toru Mizuno, Toshinobu Miyagoshi, Junichi Kamata
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Publication number: 20090031558Abstract: A mounting apparatus applies ultrasonic vibration exactly to a junction between a SMD and a SMD receiving device and maintains the junction at the suitable temperature, in simple construction in ultrasonic bonding of the SMD and the SMD receiving device held by holding unit. This includes SMD holding unit, SMD receiving device holding unit, moving unit moving at least one of the SMD holding unit and SMD receiving device holding units to contact each other, vibration generating unit applying ultrasonic vibration to the a contact portion between the SMD and the SMD receiving device, pressing unit applying an bias force between the SMD and SMD receiving device, heating unit arranged movably so as to surround in a noncontact manner a portion of the SMD holding unit near the SMD and heating the SMD holding unit, and interlocking unit interlocking the heating unit with the SMD holding unit.Type: ApplicationFiled: July 18, 2008Publication date: February 5, 2009Applicant: TDK CORPORATIONInventors: Toru MIZUNO, Tomomi ASAKURA, Yuji SAITO, Hiroyuki TAKANO, Toshinobu MIYAGOSHI