Abstract: A horn that can suppress oscillation components other than the component in the horizontal direction, a horn unit, and a bonding apparatus using same are provided. In the horn 50 in accordance with the present invention, oscillations are applied by an oscillator 42. The horn 50 has a cross-section variable section 54 in which a cross section perpendicular to the lengthwise direction (X direction) of the horn 50 has a first region A1 extending in the Z direction and a pair of second regions A2 sandwiching the first region A1 from the direction (Y direction) perpendicular to the Z direction. In the position P3 corresponding to an anti-node of a standing wave of oscillations excited in the horn 50, a sectional area S1 of the first region A1 assumes a maximum and a sectional area S2 of the second region A2 assumes a minimum.

Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: The present invention has as its object to realize both of the higher accuracy of the detection of contact between a mounting part and a part to be mounted and an improvement in the stability of the detection at a high level. For this purpose, the present invention is comprised of a contact start detecting member designed to move in operative association with moving means for moving at least one of the mounting part and the part to be mounted toward the other until the mounting part and the part to be mounted contact with each other, and on the other hand, when the mounting part and the part to be mounted have contacted with each other, to have its operative association with the moving means released in response to the action of the contact pressure thereof and be movable independently of the moving means, and contact start detecting means for detecting the movement of the contact start detecting member to thereby detect the start of contact between the mounting part and the part to be mounted.

Abstract: The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.

Abstract: A mounting apparatus capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In the apparatus, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.