Abstract: Provided is an ultrafine bubble generating method and an ultrafine bubble generating apparatus capable of efficiently generating a UFB-containing liquid with high purity. To this end, a flow passage inner volume is varied by using a flow passage inner volume varying element, the liquid is pressurized such that the liquid passes through a narrow portion at high speed and flows into a depressurizing area.

Abstract: Provided is a UFB generating apparatus capable of manufacturing an ozone UFB-contained liquid with high purity and quality. To this end, in the UFB generating apparatus capable of generating UFBs containing ozone by causing film boiling in ozone water, a liquid contact portion to come into contact with the ozone water is made of a material with corrosion resistance to ozone water.

Abstract: Provided is a UFB-containing liquid production apparatus that can efficiently produce a UFB-containing liquid with a UFB generation unit. The UFB-containing liquid production apparatus includes: a gas dissolution unit that produces a gas-dissolved liquid by dissolving a gas into a liquid supplied from a liquid supply unit; a UFB generation unit that generates UFBs in the flowing-in gas-dissolved liquid; and a circulation path that supplies the gas-dissolved liquid to the UFB generation unit and supplies a UFB-containing liquid produced by the UFB generation unit to the liquid supply unit. In the circulation path, there is provided a micro-bubble reduction unit that reduces an amount of micro-bubbles contained in the gas-dissolved liquid to flow into the UFB generation unit.

Abstract: An ultrafine bubble generating apparatus generates thermal-ultrafine bubbles by bringing a liquid into film boiling while using a heater provided to a substrate. The ultrafine bubble generating apparatus includes a control unit which inputs energy to the heater such that a value of a ratio of energy to be inputted to the heater relative to energy with which the heater generates film boiling falls below 1.17 under a condition that the energy to be inputted to the heater is larger than the energy with which the heater generates film boiling.

Abstract: The abstract of the disclosure is a thermal-ultrafine bubble generation unit which is configured to generate thermal-ultrafine bubbles by bringing a liquid into film boiling. More specifically, the thermal-ultrafine bubble generation unit in the disclosure includes a temperature detection element that is configured to detect generation of the film boiling.

Abstract: The present invention provides an ultrafine bubble-containing liquid producing apparatus capable of reducing the possibility of intermitting supply of a UFB-containing liquid. An ultrafine bubble-containing liquid producing apparatus includes producing units that produce an ultrafine bubble-containing liquid containing ultrafine bubbles by using a liquid supplied from a liquid introducing unit and deliver the produced ultrafine bubble-containing liquid to a liquid delivering unit. The producing units include a plurality of ultrafine bubble generating units capable of operating independently. Each of the plurality of ultrafine bubble generating units is provided to be capable of independently switching between communicating with and being disconnected from the liquid introducing unit and the liquid delivering unit.

Abstract: In order to efficiently produce a liquid containing ultrafine bubbles of a desired gas, an ultrafine bubble-containing liquid producing apparatus includes a gas dissolving unit that dissolves a predetermined gas into a liquid, and a UFB generating unit that generates ultrafine bubbles in the liquid in which the predetermined gas is dissolved. A CPU performs control under a first condition in a case of causing the gas dissolving unit to operate in a circulation route passing through the dissolving unit. The CPU performs control under a second condition different from the first condition in a case of causing the UFB generating unit to operate in a circulation route passing through the UFB generating unit.

Abstract: The apparatus includes: a producing unit that generates ultrafine bubbles in a liquid supplied from a liquid introducing unit to produce an ultrafine bubble-containing liquid containing the ultrafine bubbles, and delivers the ultrafine bubble-containing liquid; a liquid delivering unit that delivers the ultrafine bubble-containing liquid to an outside; a buffer tank that receives the liquid delivered from the producing unit and delivers the liquid to the liquid delivering unit; and a controller that controls the delivery of the ultrafine bubble-containing liquid from the buffer tank to the liquid delivering unit such that, if the producing unit stops operating, an ultrafine bubble-containing liquid accumulated in the buffer tank is delivered to the liquid delivering unit to enable the liquid delivering unit to deliver the ultrafine bubble-containing liquid to the outside.

Abstract: To satisfactorily seal an electrical connection portion between an element substrate and a wiring substrate, and suppress a decrease in yield and an increase in manufacturing cost. A liquid ejecting head includes an element substrate having a plurality of energy generating elements and a plurality of electrodes, and a wiring substrate having a plurality of electrode terminals connected to the plurality of electrodes. The element substrate and the wiring substrate are overlapped each other in a state where the electrode and the electrode terminal face each other, a connection portion is surrounded by a resin layer, and the resin layer is covered with a sealing resin. The resin layer is divided into a plurality of portions by a gap provided in a portion between both end portions of the electrode terminal in an arrangement direction. An inside of the gap is filled with the sealing resin.

Abstract: A liquid ejection head includes: a substrate; an energy generator that is provided on the substrate; an electrode portion that is provided on the substrate; a liquid ejection face that is provided near a surface of the substrate having the electrode portion, and flexible printed circuits including a conductive pattern and a base material having a first surface and a second surface, the first surface having the conductive pattern, the second surface being provided on the opposite side from the first surface. The base material of the flexible printed circuits has a leading region from the terminal end of a region having the conductive pattern to an end of the base material near the energy generator, without formation of the conductive pattern in the leading region, and at least a part of the second surface of the leading region inclines toward the substrate.

Abstract: A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

Abstract: A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

Abstract: Disclosed is an inkjet printing head which ejects ink in response to generation a bubble in the ink accompanying the action of heat from a heater, and which preferably allows ejection energy to be effectively used, and desired attachment accuracy of a movable valve to be secured and maintained. To this end, employed is a two-body structure formed of a substrate including the heater; and a valve retaining member having the movable valve. Then, the effective use of ejection energy is achieved by appropriately selecting the shape and dimensions of the movable valve. Furthermore, the desired attachment accuracy is secured and maintained by attaching the valve retaining member to the substrate by applying a photolithography process without using an adhesive agent.

Abstract: A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

Abstract: A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

Abstract: A liquid-ejecting head is provided whereby it is possible to eject both a main droplet and a satellite in the desired ejection direction, and furthermore, wherein no bias exists in the lifetimes of the heaters of a tip A and a tip B. In order to do so, a stopper is formed inside the ejection nozzle, the stopper limiting the movement of movable valves during bubble formation.

Abstract: Disclosed is an inkjet printing head which ejects ink in response to generation a bubble in the ink accompanying the action of heat from a heater, and which preferably allows ejection energy to be effectively used, and desired attachment accuracy of a movable valve to be secured and maintained. To this end, employed is a two-body structure formed of a substrate including the heater; and a valve retaining member having the movable valve. Then, the effective use of ejection energy is achieved by appropriately selecting the shape and dimensions of the movable valve. Furthermore, the desired attachment accuracy is secured and maintained by attaching the valve retaining member to the substrate by applying a photolithography process without using an adhesive agent.

Abstract: An ink jet print head is provided which includes: a print element substrate; a plate accommodating the print element substrate by enclosing a side peripheral portion of the print element substrate; an electric wiring tape member disposed on the plate and having electric wiring portions for the print element substrate; a first sealant filling a space surrounding the print element substrate enclosed by the plate; and a second sealant covering a part of the electric wiring portions. In this construction, stress concentrations in the electric connections are alleviated even if the electric wiring tape used to support the second sealant has a reduced stiffness due to a reduced thickness of the tape. For this purpose, the plate H1401? is provided with protrusions H1402 as support members that support the second sealant H1308 through the extension portions H1305 of the electric wiring tape.

Abstract: A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

Abstract: Patterning is performed to thermal oxide films 12a and 12b formed on both surface sides of a silicon substrate in which crystal orientation of a surface is (100) or (110), a liquid chamber pattern and a liquid supplying port pattern are formed, and a liquid chamber and a liquid supplying port are formed separately by anisotropically etching the silicon substrate from both surface sides at the same time. Then, a silicon nitride film is deposited with a low pressure chemical vapor deposition to both surface sides of the silicon substrate and all faces of the liquid chamber and the liquid supplying port which are formed by etching. As a result, when the silicon substrate is used for a top plate, stiffness of the top plate is improved, design freedom of the liquid chamber and the liquid supplying port is increased, misalignment is prevented in bonding to the substrate, degradation of ejecting performance is prevented, and a liquid discharge head having high preciseness and high reliability can be provided.